JPWO2021111563A1 - - Google Patents
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- Publication number
- JPWO2021111563A1 JPWO2021111563A1 JP2021562266A JP2021562266A JPWO2021111563A1 JP WO2021111563 A1 JPWO2021111563 A1 JP WO2021111563A1 JP 2021562266 A JP2021562266 A JP 2021562266A JP 2021562266 A JP2021562266 A JP 2021562266A JP WO2021111563 A1 JPWO2021111563 A1 JP WO2021111563A1
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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Publication number | Priority date | Publication date | Assignee | Title |
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JPH06120284A (ja) * | 1992-10-05 | 1994-04-28 | Toyota Motor Corp | 半導体装置 |
JP2007012831A (ja) * | 2005-06-30 | 2007-01-18 | Hitachi Ltd | パワー半導体装置 |
WO2016016970A1 (ja) * | 2014-07-30 | 2016-02-04 | 株式会社日立製作所 | 半導体装置、半導体装置の製造方法および電力変換装置 |
WO2017145667A1 (ja) * | 2016-02-24 | 2017-08-31 | 三菱電機株式会社 | 半導体モジュールおよびその製造方法 |
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CN104563693B (zh) | 2014-12-31 | 2016-08-17 | 湖北盛佳电器设备有限公司 | 一种a型可拆卸式铰链 |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06120284A (ja) * | 1992-10-05 | 1994-04-28 | Toyota Motor Corp | 半導体装置 |
JP2007012831A (ja) * | 2005-06-30 | 2007-01-18 | Hitachi Ltd | パワー半導体装置 |
WO2016016970A1 (ja) * | 2014-07-30 | 2016-02-04 | 株式会社日立製作所 | 半導体装置、半導体装置の製造方法および電力変換装置 |
WO2017145667A1 (ja) * | 2016-02-24 | 2017-08-31 | 三菱電機株式会社 | 半導体モジュールおよびその製造方法 |
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