JPWO2021111538A1 - - Google Patents

Info

Publication number
JPWO2021111538A1
JPWO2021111538A1 JP2021562245A JP2021562245A JPWO2021111538A1 JP WO2021111538 A1 JPWO2021111538 A1 JP WO2021111538A1 JP 2021562245 A JP2021562245 A JP 2021562245A JP 2021562245 A JP2021562245 A JP 2021562245A JP WO2021111538 A1 JPWO2021111538 A1 JP WO2021111538A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021562245A
Other languages
Japanese (ja)
Other versions
JPWO2021111538A5 (en
JP7128994B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021111538A1 publication Critical patent/JPWO2021111538A1/ja
Publication of JPWO2021111538A5 publication Critical patent/JPWO2021111538A5/ja
Application granted granted Critical
Publication of JP7128994B2 publication Critical patent/JP7128994B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2021562245A 2019-12-04 2019-12-04 Electronic member removal method and device Active JP7128994B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/047349 WO2021111538A1 (en) 2019-12-04 2019-12-04 Electronic member removal method and device therefor

Publications (3)

Publication Number Publication Date
JPWO2021111538A1 true JPWO2021111538A1 (en) 2021-06-10
JPWO2021111538A5 JPWO2021111538A5 (en) 2022-07-01
JP7128994B2 JP7128994B2 (en) 2022-09-01

Family

ID=76222601

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021562245A Active JP7128994B2 (en) 2019-12-04 2019-12-04 Electronic member removal method and device

Country Status (5)

Country Link
JP (1) JP7128994B2 (en)
KR (1) KR102498034B1 (en)
CN (1) CN114762466A (en)
TW (1) TWI808356B (en)
WO (1) WO2021111538A1 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5765771U (en) * 1980-09-30 1982-04-20
JPS5793175U (en) * 1980-11-28 1982-06-08
JPS6448669A (en) * 1987-06-08 1989-02-23 Metcal Inc Self-adjusting type heater
JPH09330956A (en) * 1996-06-13 1997-12-22 Nec Corp Method and device for repairing semiconductor device
JP2001298268A (en) * 2000-04-14 2001-10-26 Miyaden Co Ltd High frequency heating solder iron
JP2007510548A (en) * 2003-11-07 2007-04-26 デラウェア キャピタル フォーメーション インコーポレイテッド Temperature self-control type soldering iron with removable chip
JP2009164310A (en) * 2007-12-28 2009-07-23 Sharp Corp Electronic parts repair equipment and electronic parts repairing method
JP2009200170A (en) * 2008-02-20 2009-09-03 Fanuc Ltd Heating device for terminal
KR20160129570A (en) * 2015-04-30 2016-11-09 주식회사 다원시스 Induction heating desoldering device
WO2019108006A1 (en) * 2017-11-30 2019-06-06 Saint-Gobain Glass France An apparatus for soldering a terminal on window glass for a vehicle and a method thereof

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3470953B2 (en) 1999-08-02 2003-11-25 アオイ電子株式会社 How to attach and detach electronic components to a printed wiring board
JP2004186491A (en) 2002-12-04 2004-07-02 Murata Mfg Co Ltd Suction nozzle for repairing electronic component, and repairing method
TW200850092A (en) * 2004-11-29 2008-12-16 Heetronix Platen for use with a thermal attach and detach system which holds components by vacuum suction

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5765771U (en) * 1980-09-30 1982-04-20
JPS5793175U (en) * 1980-11-28 1982-06-08
JPS6448669A (en) * 1987-06-08 1989-02-23 Metcal Inc Self-adjusting type heater
JPH09330956A (en) * 1996-06-13 1997-12-22 Nec Corp Method and device for repairing semiconductor device
JP2001298268A (en) * 2000-04-14 2001-10-26 Miyaden Co Ltd High frequency heating solder iron
JP2007510548A (en) * 2003-11-07 2007-04-26 デラウェア キャピタル フォーメーション インコーポレイテッド Temperature self-control type soldering iron with removable chip
JP2009164310A (en) * 2007-12-28 2009-07-23 Sharp Corp Electronic parts repair equipment and electronic parts repairing method
JP2009200170A (en) * 2008-02-20 2009-09-03 Fanuc Ltd Heating device for terminal
KR20160129570A (en) * 2015-04-30 2016-11-09 주식회사 다원시스 Induction heating desoldering device
WO2019108006A1 (en) * 2017-11-30 2019-06-06 Saint-Gobain Glass France An apparatus for soldering a terminal on window glass for a vehicle and a method thereof

Also Published As

Publication number Publication date
KR102498034B1 (en) 2023-02-10
CN114762466A (en) 2022-07-15
JP7128994B2 (en) 2022-09-01
KR20220112748A (en) 2022-08-11
TW202139806A (en) 2021-10-16
TWI808356B (en) 2023-07-11
WO2021111538A1 (en) 2021-06-10

Similar Documents

Publication Publication Date Title
BR112021017339A2 (en)
BR112021018450A2 (en)
BR112021013854A2 (en)
BR112021017939A2 (en)
BR112021017738A2 (en)
BR112021017892A2 (en)
BR112021017782A2 (en)
BR112019016138A2 (en)
BR112021018168A2 (en)
BR112021017728A2 (en)
BR112021018452A2 (en)
BR112021017234A2 (en)
BR112021017355A2 (en)
BR112021017703A2 (en)
BR112021018102A2 (en)
BR112021018584A2 (en)
BR112021017637A2 (en)
BR112021015080A2 (en)
BR112021018250A2 (en)
BR112021018084A2 (en)
BR112021018093A2 (en)
BR112021013944A2 (en)
BR112021013128A2 (en)
BR112021018484A2 (en)
BR112021017732A2 (en)

Legal Events

Date Code Title Description
A529 Written submission of copy of amendment under article 34 pct

Free format text: JAPANESE INTERMEDIATE CODE: A5211

Effective date: 20220415

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220509

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20220509

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220706

R150 Certificate of patent or registration of utility model

Ref document number: 7128994

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150