JPWO2021084994A1 - - Google Patents

Info

Publication number
JPWO2021084994A1
JPWO2021084994A1 JP2021554193A JP2021554193A JPWO2021084994A1 JP WO2021084994 A1 JPWO2021084994 A1 JP WO2021084994A1 JP 2021554193 A JP2021554193 A JP 2021554193A JP 2021554193 A JP2021554193 A JP 2021554193A JP WO2021084994 A1 JPWO2021084994 A1 JP WO2021084994A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021554193A
Other versions
JPWO2021084994A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021084994A1 publication Critical patent/JPWO2021084994A1/ja
Publication of JPWO2021084994A5 publication Critical patent/JPWO2021084994A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14634—Assemblies, i.e. Hybrid structures
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14643—Photodiode arrays; MOS imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • H04N23/11—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths for generating image signals from visible and infrared light wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/131—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements including elements passing infrared wavelengths
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/10—Circuitry of solid-state image sensors [SSIS]; Control thereof for transforming different wavelengths into image signals
    • H04N25/11—Arrangement of colour filter arrays [CFA]; Filter mosaics
    • H04N25/13—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements
    • H04N25/135—Arrangement of colour filter arrays [CFA]; Filter mosaics characterised by the spectral characteristics of the filter elements based on four or more different wavelength filter elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2021554193A 2019-10-30 2020-09-28 Pending JPWO2021084994A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019197384 2019-10-30
PCT/JP2020/036495 WO2021084994A1 (ja) 2019-10-30 2020-09-28 撮像素子

Publications (2)

Publication Number Publication Date
JPWO2021084994A1 true JPWO2021084994A1 (ja) 2021-05-06
JPWO2021084994A5 JPWO2021084994A5 (ja) 2022-07-06

Family

ID=75715079

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021554193A Pending JPWO2021084994A1 (ja) 2019-10-30 2020-09-28

Country Status (4)

Country Link
US (1) US20220217294A1 (ja)
JP (1) JPWO2021084994A1 (ja)
CN (1) CN114556572A (ja)
WO (1) WO2021084994A1 (ja)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03148175A (ja) * 1989-11-02 1991-06-24 Fujitsu Ltd 赤外線検知装置
JPH0513741A (ja) * 1991-06-28 1993-01-22 Yokogawa Electric Corp 半導体光検出装置
JP2005353626A (ja) * 2004-06-08 2005-12-22 Fuji Photo Film Co Ltd 光電変換膜積層型固体撮像素子及びその製造方法
JP5180538B2 (ja) * 2007-08-27 2013-04-10 キヤノン株式会社 撮像素子及び撮像装置
JP5117523B2 (ja) * 2010-03-09 2013-01-16 株式会社東芝 固体撮像装置
JP5724309B2 (ja) * 2010-11-12 2015-05-27 富士通株式会社 赤外線イメージセンサ及び赤外線撮像装置
JP6079502B2 (ja) * 2013-08-19 2017-02-15 ソニー株式会社 固体撮像素子および電子機器
TWI505455B (zh) * 2013-09-27 2015-10-21 Maxchip Electronics Corp 光感測器
US20150091115A1 (en) * 2013-10-02 2015-04-02 Visera Technologies Company Limited Imaging devices with partitions in photoelectric conversion layer
KR20150123088A (ko) * 2014-04-24 2015-11-03 삼성전자주식회사 스큐드 픽셀 구조를 갖는 이미지 센서를 포함하는 이미지 데이터 처리 장치
JP2016012642A (ja) * 2014-06-27 2016-01-21 パナソニックＩｐマネジメント株式会社 固体撮像装置及びその制御方法
JP6546590B2 (ja) * 2014-07-03 2019-07-17 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、および電子装置
CN105742303B (zh) * 2014-12-26 2020-08-25 松下知识产权经营株式会社 摄像装置
KR20160100569A (ko) * 2015-02-16 2016-08-24 삼성전자주식회사 이미지 센서 및 이미지 센서를 포함하는 촬상 장치
KR20170070693A (ko) * 2015-12-14 2017-06-22 삼성전자주식회사 이미지 센서
DE102015225797B3 (de) * 2015-12-17 2017-05-04 Robert Bosch Gmbh Optischer Detektor
KR102560758B1 (ko) * 2017-01-03 2023-07-28 삼성전자주식회사 이미지 센서
JP6860390B2 (ja) * 2017-03-22 2021-04-14 キヤノン株式会社 撮像素子及びその制御方法、撮像装置、焦点検出装置及び方法
KR101980199B1 (ko) * 2018-04-13 2019-05-20 삼성전자주식회사 유기 광전 변환부를 채용한 이미지 센서

Also Published As

Publication number Publication date
CN114556572A (zh) 2022-05-27
WO2021084994A1 (ja) 2021-05-06
US20220217294A1 (en) 2022-07-07

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