JPWO2021054136A1 - - Google Patents

Info

Publication number
JPWO2021054136A1
JPWO2021054136A1 JP2021546593A JP2021546593A JPWO2021054136A1 JP WO2021054136 A1 JPWO2021054136 A1 JP WO2021054136A1 JP 2021546593 A JP2021546593 A JP 2021546593A JP 2021546593 A JP2021546593 A JP 2021546593A JP WO2021054136 A1 JPWO2021054136 A1 JP WO2021054136A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021546593A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021054136A1 publication Critical patent/JPWO2021054136A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Valve Device For Special Equipments (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
JP2021546593A 2019-09-19 2020-09-03 Pending JPWO2021054136A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019170522 2019-09-19
PCT/JP2020/033403 WO2021054136A1 (en) 2019-09-19 2020-09-03 Target

Publications (1)

Publication Number Publication Date
JPWO2021054136A1 true JPWO2021054136A1 (en) 2021-03-25

Family

ID=74883653

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021546593A Pending JPWO2021054136A1 (en) 2019-09-19 2020-09-03

Country Status (3)

Country Link
JP (1) JPWO2021054136A1 (en)
TW (1) TWI803774B (en)
WO (1) WO2021054136A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3666853B2 (en) * 2001-01-25 2005-06-29 高橋 研 Magnetic recording medium, method for manufacturing the same, and magnetic recording apparatus
US20070253103A1 (en) * 2006-04-27 2007-11-01 Heraeus, Inc. Soft magnetic underlayer in magnetic media and soft magnetic alloy based sputter target
JP4647724B2 (en) * 2009-04-17 2011-03-09 Jx日鉱日石金属株式会社 Barrier film for semiconductor wiring, sintered sputtering target, and sputtering target manufacturing method
TWI387661B (en) * 2009-07-22 2013-03-01 China Steel Corp Manufacturing method of nickel alloy target
CN104651788B (en) * 2013-11-21 2017-03-15 安泰科技股份有限公司 Ni Fe W alloys targets and its manufacture method
JP6581780B2 (en) * 2015-02-09 2019-09-25 山陽特殊製鋼株式会社 Ni-based target material with excellent sputtering properties
MY185510A (en) * 2015-03-12 2021-05-19 Sanyo Special Steel Co Ltd Ni-based sputtering target material and magnetic recording medium
JP7385370B2 (en) * 2019-05-07 2023-11-22 山陽特殊製鋼株式会社 Ni-based sputtering target and magnetic recording medium

Also Published As

Publication number Publication date
TWI803774B (en) 2023-06-01
TW202113112A (en) 2021-04-01
WO2021054136A1 (en) 2021-03-25

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230710