JPWO2021053773A1 - - Google Patents

Info

Publication number
JPWO2021053773A1
JPWO2021053773A1 JP2021546122A JP2021546122A JPWO2021053773A1 JP WO2021053773 A1 JPWO2021053773 A1 JP WO2021053773A1 JP 2021546122 A JP2021546122 A JP 2021546122A JP 2021546122 A JP2021546122 A JP 2021546122A JP WO2021053773 A1 JPWO2021053773 A1 JP WO2021053773A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021546122A
Other languages
Japanese (ja)
Other versions
JP7420821B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021053773A1 publication Critical patent/JPWO2021053773A1/ja
Application granted granted Critical
Publication of JP7420821B2 publication Critical patent/JP7420821B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Materials For Photolithography (AREA)
JP2021546122A 2019-09-18 2019-09-18 Photosensitive curable compositions, dry films, cured products, and electronic components Active JP7420821B2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/036648 WO2021053773A1 (en) 2019-09-18 2019-09-18 Photosensitive curable composition, dry film, cured product, and electronic component

Publications (2)

Publication Number Publication Date
JPWO2021053773A1 true JPWO2021053773A1 (en) 2021-03-25
JP7420821B2 JP7420821B2 (en) 2024-01-23

Family

ID=74884418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021546122A Active JP7420821B2 (en) 2019-09-18 2019-09-18 Photosensitive curable compositions, dry films, cured products, and electronic components

Country Status (4)

Country Link
JP (1) JP7420821B2 (en)
KR (1) KR20220064957A (en)
CN (1) CN114364717A (en)
WO (1) WO2021053773A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217250A (en) * 1990-03-02 1992-08-07 Union Carbide Chem & Plast Co Inc Two-color image preparation using novolak photoresist and carbodiimide
JPH08314141A (en) * 1995-05-22 1996-11-29 Nitto Denko Corp Heat resistant photoresist composition, photosensitive base material and negative pattern forming method
JP2001345537A (en) * 2000-03-31 2001-12-14 Toshiba Corp Method of manufacturing composite member, photosensitive composition, insulator for manufacturing composite member, the composite member, multilayered wiring board, and electronic package
JP2009222923A (en) * 2008-03-14 2009-10-01 Nagase Chemtex Corp Radiation-sensitive resin composition

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5303854B2 (en) 2006-10-24 2013-10-02 日立化成株式会社 Novel semi-IPN composite thermosetting resin composition and varnish, prepreg and metal-clad laminate using the same
JP5334755B2 (en) 2009-08-31 2013-11-06 富士フイルム株式会社 Photosensitive resin composition, cured film, method for forming cured film, organic EL display device, and liquid crystal display device
JP7007792B2 (en) * 2015-09-30 2022-01-25 太陽インキ製造株式会社 Curable resin composition, dry film, cured product and printed wiring board
JP2017179307A (en) 2016-03-31 2017-10-05 日立化成株式会社 Carbodiimide compound, resin composition, prepreg, resin sheet and laminate
JP2019028316A (en) 2017-07-31 2019-02-21 太陽ホールディングス株式会社 Photosensitive resin composition, dry film, cured product, printed wiring board, and semiconductor element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04217250A (en) * 1990-03-02 1992-08-07 Union Carbide Chem & Plast Co Inc Two-color image preparation using novolak photoresist and carbodiimide
JPH08314141A (en) * 1995-05-22 1996-11-29 Nitto Denko Corp Heat resistant photoresist composition, photosensitive base material and negative pattern forming method
JP2001345537A (en) * 2000-03-31 2001-12-14 Toshiba Corp Method of manufacturing composite member, photosensitive composition, insulator for manufacturing composite member, the composite member, multilayered wiring board, and electronic package
JP2009222923A (en) * 2008-03-14 2009-10-01 Nagase Chemtex Corp Radiation-sensitive resin composition

Also Published As

Publication number Publication date
JP7420821B2 (en) 2024-01-23
WO2021053773A1 (en) 2021-03-25
CN114364717A (en) 2022-04-15
KR20220064957A (en) 2022-05-19

Similar Documents

Publication Publication Date Title
BR112021017339A2 (en)
BR112021018450A2 (en)
BR112021017939A2 (en)
BR112021017892A2 (en)
BR112021017738A2 (en)
BR112021017782A2 (en)
BR112021018168A2 (en)
BR112021017728A2 (en)
BR112021018452A2 (en)
BR112021017234A2 (en)
BR112021017355A2 (en)
BR112021017703A2 (en)
BR112021017173A2 (en)
BR112021018102A2 (en)
BR112021017083A2 (en)
BR112021017637A2 (en)
BR112021018250A2 (en)
BR112021018084A2 (en)
BR112021018093A2 (en)
BR112021018484A2 (en)
BR112021017732A2 (en)
BR112021017949A2 (en)
BR112021017983A2 (en)
BR112021016996A2 (en)
BR112021017010A2 (en)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220620

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230314

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230509

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230704

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231003

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231201

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20231219

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240111

R150 Certificate of patent or registration of utility model

Ref document number: 7420821

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150