JPWO2021053747A1 - - Google Patents
Info
- Publication number
- JPWO2021053747A1 JPWO2021053747A1 JP2021546102A JP2021546102A JPWO2021053747A1 JP WO2021053747 A1 JPWO2021053747 A1 JP WO2021053747A1 JP 2021546102 A JP2021546102 A JP 2021546102A JP 2021546102 A JP2021546102 A JP 2021546102A JP WO2021053747 A1 JPWO2021053747 A1 JP WO2021053747A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
Landscapes
- Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/036518 WO2021053747A1 (ja) | 2019-09-18 | 2019-09-18 | 部品実装機 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021053747A1 true JPWO2021053747A1 (ja) | 2021-03-25 |
| JP7297907B2 JP7297907B2 (ja) | 2023-06-26 |
Family
ID=74884616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021546102A Active JP7297907B2 (ja) | 2019-09-18 | 2019-09-18 | 部品実装機 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4033872A4 (ja) |
| JP (1) | JP7297907B2 (ja) |
| CN (1) | CN114303452B (ja) |
| WO (1) | WO2021053747A1 (ja) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1051193A (ja) * | 1996-08-01 | 1998-02-20 | Sony Corp | 電子部品のマウント装置 |
| JP2816485B2 (ja) * | 1990-01-10 | 1998-10-27 | 松下電器産業株式会社 | 電子部品検査装置および電子部品実装装置 |
| JP2001230597A (ja) * | 1999-12-08 | 2001-08-24 | Fuji Mach Mfg Co Ltd | 電気部品位置検出方法 |
| JP2004356139A (ja) * | 2003-05-27 | 2004-12-16 | Matsushita Electric Ind Co Ltd | 部品実装装置及び方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5452080A (en) * | 1993-06-04 | 1995-09-19 | Sony Corporation | Image inspection apparatus and method |
| US6118538A (en) * | 1995-01-13 | 2000-09-12 | Cyberoptics Corporation | Method and apparatus for electronic component lead measurement using light based sensors on a component placement machine |
| JPH1050093A (ja) * | 1996-08-01 | 1998-02-20 | Hitachi Ltd | 救済判定処理装置 |
| US5956134A (en) * | 1997-07-11 | 1999-09-21 | Semiconductor Technologies & Instruments, Inc. | Inspection system and method for leads of semiconductor devices |
| DE19823942C1 (de) * | 1998-05-28 | 1999-10-07 | Siemens Ag | Verfahren und Vorrichtung zur Schräglagenprüfung und/oder Koplanaritätsprüfung einer Kontaktreihe von SMD-Bauelementen |
| JP4607313B2 (ja) | 2000-12-08 | 2011-01-05 | 富士機械製造株式会社 | 電子部品装着システム |
| CN102374993B (zh) * | 2010-08-20 | 2014-01-08 | 吴华 | 集成电路封装片三维引脚外观检测单元的检测方法 |
-
2019
- 2019-09-18 CN CN201980099814.6A patent/CN114303452B/zh active Active
- 2019-09-18 JP JP2021546102A patent/JP7297907B2/ja active Active
- 2019-09-18 WO PCT/JP2019/036518 patent/WO2021053747A1/ja unknown
- 2019-09-18 EP EP19946092.4A patent/EP4033872A4/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2816485B2 (ja) * | 1990-01-10 | 1998-10-27 | 松下電器産業株式会社 | 電子部品検査装置および電子部品実装装置 |
| JPH1051193A (ja) * | 1996-08-01 | 1998-02-20 | Sony Corp | 電子部品のマウント装置 |
| JP2001230597A (ja) * | 1999-12-08 | 2001-08-24 | Fuji Mach Mfg Co Ltd | 電気部品位置検出方法 |
| JP2004356139A (ja) * | 2003-05-27 | 2004-12-16 | Matsushita Electric Ind Co Ltd | 部品実装装置及び方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114303452B (zh) | 2023-07-11 |
| EP4033872A1 (en) | 2022-07-27 |
| CN114303452A (zh) | 2022-04-08 |
| JP7297907B2 (ja) | 2023-06-26 |
| EP4033872A4 (en) | 2022-09-28 |
| WO2021053747A1 (ja) | 2021-03-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20220119 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20221115 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20221220 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230216 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230606 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230614 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7297907 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |