JPWO2021026110A5 - - Google Patents
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- JPWO2021026110A5 JPWO2021026110A5 JP2022507321A JP2022507321A JPWO2021026110A5 JP WO2021026110 A5 JPWO2021026110 A5 JP WO2021026110A5 JP 2022507321 A JP2022507321 A JP 2022507321A JP 2022507321 A JP2022507321 A JP 2022507321A JP WO2021026110 A5 JPWO2021026110 A5 JP WO2021026110A5
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- JP
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022064247A JP2022163709A (ja) | 2019-08-05 | 2022-04-08 | 基板処理システム用の静電容量の変動が低減された可動エッジリング |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962882890P | 2019-08-05 | 2019-08-05 | |
| US62/882,890 | 2019-08-05 | ||
| US202062976088P | 2020-02-13 | 2020-02-13 | |
| US62/976,088 | 2020-02-13 | ||
| PCT/US2020/044816 WO2021026110A1 (en) | 2019-08-05 | 2020-08-04 | Moveable edge rings with reduced capacitance variation for substrate processing systems |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064247A Division JP2022163709A (ja) | 2019-08-05 | 2022-04-08 | 基板処理システム用の静電容量の変動が低減された可動エッジリング |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022544102A JP2022544102A (ja) | 2022-10-17 |
| JPWO2021026110A5 true JPWO2021026110A5 (zh) | 2022-10-25 |
Family
ID=74094202
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022507321A Pending JP2022544102A (ja) | 2019-08-05 | 2020-08-04 | 基板処理システム用の静電容量の変動が低減された可動エッジリング |
| JP2022064247A Pending JP2022163709A (ja) | 2019-08-05 | 2022-04-08 | 基板処理システム用の静電容量の変動が低減された可動エッジリング |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022064247A Pending JP2022163709A (ja) | 2019-08-05 | 2022-04-08 | 基板処理システム用の静電容量の変動が低減された可動エッジリング |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20220254612A1 (zh) |
| EP (2) | EP4010918A4 (zh) |
| JP (2) | JP2022544102A (zh) |
| KR (5) | KR102646633B1 (zh) |
| CN (3) | CN212874424U (zh) |
| TW (2) | TWM602283U (zh) |
| WO (1) | WO2021026110A1 (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10658222B2 (en) | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| US11935728B2 (en) * | 2020-01-31 | 2024-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method of manufacturing a semiconductor device |
| KR20220100339A (ko) * | 2021-01-08 | 2022-07-15 | 삼성전자주식회사 | 플라즈마 처리 장치 및 이를 이용한 반도체 소자 제조방법 |
| CN113097038B (zh) * | 2021-02-25 | 2022-07-15 | 长江存储科技有限责任公司 | 刻蚀装置 |
| WO2023078628A1 (en) * | 2021-11-02 | 2023-05-11 | Asml Netherlands B.V. | Wafer edge inspection of charged particle inspection system |
| US20230197495A1 (en) * | 2021-12-16 | 2023-06-22 | Applied Materials, Inc. | Substrate support gap pumping to prevent glow discharge and light-up |
| JP2023130163A (ja) * | 2022-03-07 | 2023-09-20 | キオクシア株式会社 | クリーニング方法、半導体装置の製造方法、プラズマ処理装置、及び外周リングセット |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5942039A (en) * | 1997-05-01 | 1999-08-24 | Applied Materials, Inc. | Self-cleaning focus ring |
| US7311784B2 (en) * | 2002-11-26 | 2007-12-25 | Tokyo Electron Limited | Plasma processing device |
| US7718559B2 (en) * | 2007-04-20 | 2010-05-18 | Applied Materials, Inc. | Erosion resistance enhanced quartz used in plasma etch chamber |
| US8409355B2 (en) * | 2008-04-24 | 2013-04-02 | Applied Materials, Inc. | Low profile process kit |
| US8287650B2 (en) * | 2008-09-10 | 2012-10-16 | Applied Materials, Inc. | Low sloped edge ring for plasma processing chamber |
| US8979087B2 (en) * | 2011-07-29 | 2015-03-17 | Applied Materials, Inc. | Substrate supporting edge ring with coating for improved soak performance |
| CN104862660B (zh) * | 2014-02-24 | 2017-10-13 | 北京北方华创微电子装备有限公司 | 承载装置及等离子体加工设备 |
| US10658222B2 (en) * | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| CN108369922B (zh) * | 2016-01-26 | 2023-03-21 | 应用材料公司 | 晶片边缘环升降解决方案 |
| US10704147B2 (en) * | 2016-12-03 | 2020-07-07 | Applied Materials, Inc. | Process kit design for in-chamber heater and wafer rotating mechanism |
| JP6812224B2 (ja) * | 2016-12-08 | 2021-01-13 | 東京エレクトロン株式会社 | 基板処理装置及び載置台 |
| US10553404B2 (en) * | 2017-02-01 | 2020-02-04 | Applied Materials, Inc. | Adjustable extended electrode for edge uniformity control |
| US11404249B2 (en) * | 2017-03-22 | 2022-08-02 | Tokyo Electron Limited | Substrate processing apparatus |
| KR101927936B1 (ko) * | 2017-06-09 | 2018-12-11 | 세메스 주식회사 | 기판 처리 장치 |
| EP3580777B1 (en) * | 2017-07-24 | 2021-04-14 | LAM Research Corporation | Moveable edge ring designs |
| KR102143290B1 (ko) * | 2017-11-21 | 2020-08-11 | 램 리써치 코포레이션 | 하단 링 및 중간 에지 링 |
| KR102134391B1 (ko) * | 2018-10-18 | 2020-07-15 | 세메스 주식회사 | 기판 처리 장치 |
| US20200234928A1 (en) * | 2019-01-17 | 2020-07-23 | Applied Materials, Inc. | Semiconductor plasma processing equipment with wafer edge plasma sheath tuning ability |
-
2020
- 2020-04-01 TW TW109203808U patent/TWM602283U/zh unknown
- 2020-04-20 CN CN202020586711.2U patent/CN212874424U/zh active Active
- 2020-08-04 EP EP20850215.3A patent/EP4010918A4/en active Pending
- 2020-08-04 KR KR1020237037853A patent/KR102646633B1/ko active IP Right Grant
- 2020-08-04 US US17/632,066 patent/US20220254612A1/en active Pending
- 2020-08-04 WO PCT/US2020/044816 patent/WO2021026110A1/en unknown
- 2020-08-04 KR KR1020247007605A patent/KR20240034892A/ko active Search and Examination
- 2020-08-04 KR KR1020227007496A patent/KR20220037522A/ko active Search and Examination
- 2020-08-04 EP EP22156901.5A patent/EP4036955A1/en active Pending
- 2020-08-04 KR KR1020237037449A patent/KR20230155028A/ko active Application Filing
- 2020-08-04 CN CN202080056085.9A patent/CN114207769A/zh active Pending
- 2020-08-04 JP JP2022507321A patent/JP2022544102A/ja active Pending
- 2020-08-04 KR KR1020227007791A patent/KR20220035979A/ko active Search and Examination
- 2020-08-04 CN CN202210228466.1A patent/CN114695062A/zh active Pending
- 2020-08-05 TW TW109126470A patent/TW202121484A/zh unknown
-
2022
- 2022-02-14 US US17/671,211 patent/US20220270863A1/en active Pending
- 2022-04-08 JP JP2022064247A patent/JP2022163709A/ja active Pending
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