JPWO2020241775A1 - - Google Patents
Info
- Publication number
- JPWO2020241775A1 JPWO2020241775A1 JP2021522875A JP2021522875A JPWO2020241775A1 JP WO2020241775 A1 JPWO2020241775 A1 JP WO2020241775A1 JP 2021522875 A JP2021522875 A JP 2021522875A JP 2021522875 A JP2021522875 A JP 2021522875A JP WO2020241775 A1 JPWO2020241775 A1 JP WO2020241775A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4857—Multilayer substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4867—Applying pastes or inks, e.g. screen printing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023107470A JP2023126865A (ja) | 2019-05-29 | 2023-06-29 | 電子素子実装用基板、電子装置、および電子モジュール |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019100404 | 2019-05-29 | ||
JP2019100404 | 2019-05-29 | ||
PCT/JP2020/021181 WO2020241775A1 (ja) | 2019-05-29 | 2020-05-28 | 電子素子実装用基板、電子装置、および電子モジュール |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023107470A Division JP2023126865A (ja) | 2019-05-29 | 2023-06-29 | 電子素子実装用基板、電子装置、および電子モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020241775A1 true JPWO2020241775A1 (ja) | 2020-12-03 |
JP7307161B2 JP7307161B2 (ja) | 2023-07-11 |
Family
ID=73552185
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021522875A Active JP7307161B2 (ja) | 2019-05-29 | 2020-05-28 | 電子素子実装用基板、電子装置、および電子モジュール |
JP2023107470A Pending JP2023126865A (ja) | 2019-05-29 | 2023-06-29 | 電子素子実装用基板、電子装置、および電子モジュール |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023107470A Pending JP2023126865A (ja) | 2019-05-29 | 2023-06-29 | 電子素子実装用基板、電子装置、および電子モジュール |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220361333A1 (ja) |
JP (2) | JP7307161B2 (ja) |
CN (1) | CN113875000A (ja) |
WO (1) | WO2020241775A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07273455A (ja) * | 1994-03-30 | 1995-10-20 | Oki Electric Ind Co Ltd | 多層セラミック基板及びその製造方法 |
WO2002074029A1 (en) * | 2001-03-14 | 2002-09-19 | Ibiden Co., Ltd. | Multilayer printed wiring board |
JP2004111769A (ja) * | 2002-09-20 | 2004-04-08 | Kyocera Corp | 電子部品搭載用基板 |
JP2005072503A (ja) * | 2003-08-27 | 2005-03-17 | Kyocera Corp | 配線基板およびそれを用いた電子装置 |
JP2006269692A (ja) * | 2005-03-23 | 2006-10-05 | Tdk Corp | 多層セラミック基板及びその製造方法 |
JP2017050391A (ja) * | 2015-09-01 | 2017-03-09 | 株式会社デンソー | 多層基板およびその製造方法 |
JP2019079987A (ja) * | 2017-10-26 | 2019-05-23 | 京セラ株式会社 | 電子素子実装用基板、電子装置および電子モジュール |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5140621B1 (ja) * | 1971-02-10 | 1976-11-05 | ||
JPS5122060A (ja) * | 1974-08-19 | 1976-02-21 | Fujitsu Ltd | Tasopurintoban |
JPH0717166Y2 (ja) * | 1988-06-28 | 1995-04-19 | 株式会社フジクラ | 多層フレキシブルプリント配線板 |
JP2005150552A (ja) * | 2003-11-18 | 2005-06-09 | Ngk Spark Plug Co Ltd | 配線基板の製造方法 |
WO2008108172A1 (ja) * | 2007-03-01 | 2008-09-12 | Murata Manufacturing Co., Ltd. | 多層配線基板 |
JP5574038B2 (ja) * | 2011-03-07 | 2014-08-20 | 株式会社村田製作所 | セラミック多層基板およびその製造方法 |
JP5835282B2 (ja) * | 2013-07-04 | 2015-12-24 | 株式会社村田製作所 | 多層配線基板の製造方法およびプローブカードの製造方法並びに多層配線基板およびプローブカード |
JP2017123377A (ja) * | 2016-01-05 | 2017-07-13 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
JP6832630B2 (ja) * | 2016-03-28 | 2021-02-24 | 富士通インターコネクトテクノロジーズ株式会社 | 配線基板の製造方法 |
TW202339757A (zh) | 2022-01-19 | 2023-10-16 | 日商塩野義製藥股份有限公司 | 新型冠狀病毒感染症治療用醫藥 |
-
2020
- 2020-05-28 CN CN202080037938.4A patent/CN113875000A/zh active Pending
- 2020-05-28 US US17/613,514 patent/US20220361333A1/en active Pending
- 2020-05-28 JP JP2021522875A patent/JP7307161B2/ja active Active
- 2020-05-28 WO PCT/JP2020/021181 patent/WO2020241775A1/ja active Application Filing
-
2023
- 2023-06-29 JP JP2023107470A patent/JP2023126865A/ja active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07273455A (ja) * | 1994-03-30 | 1995-10-20 | Oki Electric Ind Co Ltd | 多層セラミック基板及びその製造方法 |
WO2002074029A1 (en) * | 2001-03-14 | 2002-09-19 | Ibiden Co., Ltd. | Multilayer printed wiring board |
JP2004111769A (ja) * | 2002-09-20 | 2004-04-08 | Kyocera Corp | 電子部品搭載用基板 |
JP2005072503A (ja) * | 2003-08-27 | 2005-03-17 | Kyocera Corp | 配線基板およびそれを用いた電子装置 |
JP2006269692A (ja) * | 2005-03-23 | 2006-10-05 | Tdk Corp | 多層セラミック基板及びその製造方法 |
JP2017050391A (ja) * | 2015-09-01 | 2017-03-09 | 株式会社デンソー | 多層基板およびその製造方法 |
JP2019079987A (ja) * | 2017-10-26 | 2019-05-23 | 京セラ株式会社 | 電子素子実装用基板、電子装置および電子モジュール |
Also Published As
Publication number | Publication date |
---|---|
US20220361333A1 (en) | 2022-11-10 |
CN113875000A (zh) | 2021-12-31 |
WO2020241775A1 (ja) | 2020-12-03 |
JP7307161B2 (ja) | 2023-07-11 |
JP2023126865A (ja) | 2023-09-12 |
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