JPWO2020196195A1 - - Google Patents

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Publication number
JPWO2020196195A1
JPWO2020196195A1 JP2021509271A JP2021509271A JPWO2020196195A1 JP WO2020196195 A1 JPWO2020196195 A1 JP WO2020196195A1 JP 2021509271 A JP2021509271 A JP 2021509271A JP 2021509271 A JP2021509271 A JP 2021509271A JP WO2020196195 A1 JPWO2020196195 A1 JP WO2020196195A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021509271A
Other versions
JP7179159B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed filed Critical
Publication of JPWO2020196195A1 publication Critical patent/JPWO2020196195A1/ja
Application granted granted Critical
Publication of JP7179159B2 publication Critical patent/JP7179159B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form
    • G05B19/4155—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of programme data in numerical form characterised by programme execution, i.e. part programme or machine function execution, e.g. selection of a programme
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021509271A 2019-03-26 2020-03-18 状態判定装置、状態判定方法、コンピュータ読み取り可能な記録媒体及びプログラム Active JP7179159B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019058391 2019-03-26
JP2019058391 2019-03-26
PCT/JP2020/012127 WO2020196195A1 (ja) 2019-03-26 2020-03-18 状態判定装置、状態判定方法及びコンピュータ読み取り可能な記録媒体

Publications (2)

Publication Number Publication Date
JPWO2020196195A1 true JPWO2020196195A1 (ja) 2020-10-01
JP7179159B2 JP7179159B2 (ja) 2022-11-28

Family

ID=72611862

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509271A Active JP7179159B2 (ja) 2019-03-26 2020-03-18 状態判定装置、状態判定方法、コンピュータ読み取り可能な記録媒体及びプログラム

Country Status (5)

Country Link
US (1) US20220223443A1 (ja)
JP (1) JP7179159B2 (ja)
KR (1) KR20210145769A (ja)
CN (1) CN113614664B (ja)
WO (1) WO2020196195A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7465243B2 (ja) * 2021-06-28 2024-04-10 日本電子株式会社 ステージ装置および電子ビーム描画装置
WO2024024633A1 (ja) * 2022-07-25 2024-02-01 東京エレクトロン株式会社 情報処理方法、コンピュータプログラム及び情報処理装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569951U (ja) * 1992-02-25 1993-09-21 株式会社島津製作所 駆動装置
JPH09274535A (ja) * 1996-04-04 1997-10-21 Ricoh Co Ltd ペン型入力装置
WO2018147183A1 (ja) * 2017-02-13 2018-08-16 東京エレクトロン株式会社 搬送装置、搬送方法及び記憶媒体
JP2018148350A (ja) * 2017-03-03 2018-09-20 日本電信電話株式会社 閾値決定装置、閾値決定方法及びプログラム
JP2018147443A (ja) * 2017-03-09 2018-09-20 安川情報システム株式会社 故障予知方法、故障予知装置および故障予知プログラム
JP2018156151A (ja) * 2017-03-15 2018-10-04 ファナック株式会社 異常検知装置及び機械学習装置
JP2018160093A (ja) * 2017-03-23 2018-10-11 株式会社日立製作所 異常検知システムおよび異常検知方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4032045B2 (ja) * 2004-08-13 2008-01-16 新キャタピラー三菱株式会社 データ処理方法及びデータ処理装置、並びに診断方法及び診断装置
JP2008097363A (ja) * 2006-10-12 2008-04-24 Okuma Corp 異常診断方法及びその装置
JP5664543B2 (ja) 2011-12-26 2015-02-04 東京エレクトロン株式会社 搬送装置及び搬送方法
WO2013105164A1 (ja) * 2012-01-13 2013-07-18 日本電気株式会社 異常信号判定装置、異常信号判定方法、および異常信号判定プログラム
JP5910428B2 (ja) * 2012-09-13 2016-04-27 オムロン株式会社 監視装置、監視方法、プログラムおよび記録媒体
DE112015003585T5 (de) * 2015-03-19 2017-06-08 Mitsubishi Heavy Industries, Ltd. Zustandsüberwachungseinrichtung und Zustandsüberwachungsverfahren für ein Fördergaskompressionssystem und Fördergaskompressionssystem
JP6888251B2 (ja) * 2016-07-15 2021-06-16 富士電機株式会社 制御装置、駆動装置、制御方法、及び制御プログラム
JP6896432B2 (ja) * 2017-01-11 2021-06-30 株式会社Ｙｅ Ｄｉｇｉｔａｌ 故障予知方法、故障予知装置および故障予知プログラム
JP2018116545A (ja) * 2017-01-19 2018-07-26 オムロン株式会社 予測モデル作成装置、生産設備監視システム、及び生産設備監視方法
DE102018000579A1 (de) * 2018-01-24 2018-07-12 Daimler Ag Überwachen einer Funktionsbereitschaft eines elektrischen Gerätes

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569951U (ja) * 1992-02-25 1993-09-21 株式会社島津製作所 駆動装置
JPH09274535A (ja) * 1996-04-04 1997-10-21 Ricoh Co Ltd ペン型入力装置
WO2018147183A1 (ja) * 2017-02-13 2018-08-16 東京エレクトロン株式会社 搬送装置、搬送方法及び記憶媒体
JP2018148350A (ja) * 2017-03-03 2018-09-20 日本電信電話株式会社 閾値決定装置、閾値決定方法及びプログラム
JP2018147443A (ja) * 2017-03-09 2018-09-20 安川情報システム株式会社 故障予知方法、故障予知装置および故障予知プログラム
JP2018156151A (ja) * 2017-03-15 2018-10-04 ファナック株式会社 異常検知装置及び機械学習装置
JP2018160093A (ja) * 2017-03-23 2018-10-11 株式会社日立製作所 異常検知システムおよび異常検知方法

Also Published As

Publication number Publication date
CN113614664A (zh) 2021-11-05
US20220223443A1 (en) 2022-07-14
CN113614664B (zh) 2024-05-17
WO2020196195A1 (ja) 2020-10-01
JP7179159B2 (ja) 2022-11-28
KR20210145769A (ko) 2021-12-02

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