JPWO2020189108A1 - - Google Patents

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Publication number
JPWO2020189108A1
JPWO2020189108A1 JP2021506239A JP2021506239A JPWO2020189108A1 JP WO2020189108 A1 JPWO2020189108 A1 JP WO2020189108A1 JP 2021506239 A JP2021506239 A JP 2021506239A JP 2021506239 A JP2021506239 A JP 2021506239A JP WO2020189108 A1 JPWO2020189108 A1 JP WO2020189108A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021506239A
Other languages
Japanese (ja)
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JP7382551B2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2020189108A1 publication Critical patent/JPWO2020189108A1/ja
Application granted granted Critical
Publication of JP7382551B2 publication Critical patent/JP7382551B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/085—Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
    • H05K13/0853—Determination of transport trajectories inside mounting machines

Landscapes

  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021506239A 2019-03-15 2020-02-13 Component mounting equipment and component mounting method, mounting board manufacturing system and mounting board manufacturing method, and mounted component inspection equipment Active JP7382551B2 (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2019047846 2019-03-15
JP2019047846 2019-03-15
JP2019047845 2019-03-15
JP2019047845 2019-03-15
JP2019125048 2019-07-04
JP2019125048 2019-07-04
PCT/JP2020/005512 WO2020189108A1 (en) 2019-03-15 2020-02-13 Component installation device and component installation method, mounting substrate manufacturing system and mounting substrate manufacturing method, and installed component inspection device

Publications (2)

Publication Number Publication Date
JPWO2020189108A1 true JPWO2020189108A1 (en) 2020-09-24
JP7382551B2 JP7382551B2 (en) 2023-11-17

Family

ID=72520117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021506239A Active JP7382551B2 (en) 2019-03-15 2020-02-13 Component mounting equipment and component mounting method, mounting board manufacturing system and mounting board manufacturing method, and mounted component inspection equipment

Country Status (4)

Country Link
JP (1) JP7382551B2 (en)
CN (1) CN113508652B (en)
DE (1) DE112020001298T5 (en)
WO (1) WO2020189108A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116918473A (en) * 2021-03-03 2023-10-20 松下知识产权经营株式会社 Imaging device and mounting machine
CN118176838A (en) * 2021-11-24 2024-06-11 株式会社富士 Component mounting machine and correction value calculation method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251897A (en) * 1991-01-24 1993-09-28 Matsushita Electric Works Ltd Apparatus for mounting parts
JP2003229699A (en) * 2002-02-05 2003-08-15 Matsushita Electric Ind Co Ltd Electronic component mounting system and method therefor
JP2015099863A (en) * 2013-11-20 2015-05-28 パナソニックＩｐマネジメント株式会社 Component mounting system and component mounting method
WO2018189937A1 (en) * 2017-04-13 2018-10-18 Ckd株式会社 Component mounting system and adhesive inspection device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5747164B2 (en) * 2011-09-27 2015-07-08 パナソニックＩｐマネジメント株式会社 Electronic component mounting system
JP5945697B2 (en) 2012-11-19 2016-07-05 パナソニックＩｐマネジメント株式会社 Electronic component mounting system and electronic component mounting method
JP6277422B2 (en) * 2014-09-11 2018-02-14 パナソニックＩｐマネジメント株式会社 Component mounting method and component mounting system
JP6913851B2 (en) * 2017-08-24 2021-08-04 パナソニックＩｐマネジメント株式会社 Mounting board manufacturing system and mounting board manufacturing method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05251897A (en) * 1991-01-24 1993-09-28 Matsushita Electric Works Ltd Apparatus for mounting parts
JP2003229699A (en) * 2002-02-05 2003-08-15 Matsushita Electric Ind Co Ltd Electronic component mounting system and method therefor
JP2015099863A (en) * 2013-11-20 2015-05-28 パナソニックＩｐマネジメント株式会社 Component mounting system and component mounting method
WO2018189937A1 (en) * 2017-04-13 2018-10-18 Ckd株式会社 Component mounting system and adhesive inspection device

Also Published As

Publication number Publication date
CN113508652A (en) 2021-10-15
DE112020001298T5 (en) 2021-12-16
WO2020189108A1 (en) 2020-09-24
CN113508652B (en) 2023-08-18
JP7382551B2 (en) 2023-11-17

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