JPWO2020030939A1 - 電力変換装置の冷却システム - Google Patents
電力変換装置の冷却システム Download PDFInfo
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- JPWO2020030939A1 JPWO2020030939A1 JP2020535320A JP2020535320A JPWO2020030939A1 JP WO2020030939 A1 JPWO2020030939 A1 JP WO2020030939A1 JP 2020535320 A JP2020535320 A JP 2020535320A JP 2020535320 A JP2020535320 A JP 2020535320A JP WO2020030939 A1 JPWO2020030939 A1 JP WO2020030939A1
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- temperature
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- cooling system
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- power conversion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
- H05K7/20918—Forced ventilation, e.g. on heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20945—Thermal management, e.g. inverter temperature control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inverter Devices (AREA)
- Motor Or Generator Cooling System (AREA)
- Electric Propulsion And Braking For Vehicles (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
図1は、第1実施形態による電力変換装置の冷却システムを示す概略構成図である。
図5を参照して、第1実施形態の変形例による電力変換装置の冷却システムを説明する。
Claims (8)
- ラジエータと、
前記ラジエータに空気を供給するラジエータファンと、
複数の電気部品と前記複数の電気部品を内部に収容する筐体とから構成される電力変換装置と、
を備える電力変換装置の冷却システムであって、
前記筐体は、非金属材料により形成され、前記複数の電気部品を載置するベース部と、金属材料により形成され、前記ベース部に固定されるとともに前記複数の電気部品の周囲を覆うカバー部と、から構成され、
前記筐体の前記ベース部には、前記複数の電気部品を冷却する冷媒が流れる冷媒流路が形成され、
前記筐体は、前記ラジエータファンからの風が前記カバー部に当たる位置に配置される、
電力変換装置の冷却システム。 - 請求項1に記載の電力変換装置の冷却システムであって、
前記電力変換装置は車両に搭載され、
前記筐体の前記カバー部は、前記ベース部よりも剛性が高い部品に締結されている、
電力変換装置の冷却システム。 - 請求項1又は2に記載の電力変換装置の冷却システムであって、
前記筐体は、前記カバー部の外表面にヒートシンク構造を備える、
電力変換装置の冷却システム。 - 請求項3に記載の電力変換装置の冷却システムであって、
前記筐体は前記ラジエータと対向するように設置され、
前記筐体の前記カバー部のうち、前記ラジエータに対向する側壁とは反対側の側壁にはヒートシンク構造を備えない、
電力変換装置の冷却システム。 - 請求項3又は4に記載の電力変換装置の冷却システムであって、
前記ヒートシンク構造は、前記カバー部から前記筐体の外方へ突出するフィンである、
電力変換装置の冷却システム。 - 請求項1から5のいずれか一項に記載の電力変換装置の冷却システムであって、
前記ラジエータファンの動作を制御する制御部をさらに備え、
前記制御部は、前記冷媒流路内を流れる前記冷媒の温度が所定の温度より高い場合に、前記冷媒の温度に応じた回転数で前記ラジエータファンを駆動させる、
電力変換装置の冷却システム。 - 請求項6に記載の電力変換装置の冷却システムであって、
前記制御部は、前記冷媒の温度が所定の温度以下の場合にも、前記電力変換装置の温度が所定の温度より高い場合には、前記電力変換装置の温度に応じた回転数で前記ラジエータファンを駆動させる、
電力変換装置の冷却システム。 - 請求項7に記載の電力変換装置の冷却システムであって、
前記電力変換装置と電気的に接続された回転電機をさらに備え、
前記制御部は、前記冷媒の温度及び前記電力変換装置の温度が所定の温度以下の場合にも、前記回転電機の温度が所定の温度より高い場合には、前記回転電機の温度に応じた回転数で前記ラジエータファンを駆動させる、
電力変換装置の冷却システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IB2018/001045 WO2020030939A1 (ja) | 2018-08-09 | 2018-08-09 | 電力変換装置の冷却システム |
Publications (2)
Publication Number | Publication Date |
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JPWO2020030939A1 true JPWO2020030939A1 (ja) | 2021-08-26 |
JP7031746B2 JP7031746B2 (ja) | 2022-03-08 |
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JP2020535320A Active JP7031746B2 (ja) | 2018-08-09 | 2018-08-09 | 電力変換装置の冷却システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US11729956B2 (ja) |
EP (1) | EP3836380B1 (ja) |
JP (1) | JP7031746B2 (ja) |
CN (1) | CN112534701B (ja) |
WO (1) | WO2020030939A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP4355041A4 (en) * | 2021-06-08 | 2024-07-17 | Nissan Motor | HOUSINGS FOR ELECTRICAL COMPONENTS |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006264473A (ja) * | 2005-03-23 | 2006-10-05 | Toyota Motor Corp | 冷却システムおよびハイブリッド自動車 |
JP2012170177A (ja) * | 2011-02-10 | 2012-09-06 | Toyota Motor Corp | 電力制御装置の搭載構造 |
JP2013128051A (ja) * | 2011-12-19 | 2013-06-27 | Mahle Filter Systems Japan Corp | インバータ回路の冷却装置 |
JP2017103944A (ja) * | 2015-12-03 | 2017-06-08 | 富士電機株式会社 | 冷却システムの制御装置 |
JP2018114833A (ja) * | 2017-01-18 | 2018-07-26 | 日野自動車株式会社 | 電動車両用冷却装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09246767A (ja) * | 1996-03-05 | 1997-09-19 | Hitachi Ltd | 電気車用電力変換装置 |
JP3616005B2 (ja) * | 2000-12-20 | 2005-02-02 | 本田技研工業株式会社 | ハイブリッド車両の冷却装置 |
JP3676719B2 (ja) | 2001-10-09 | 2005-07-27 | 株式会社日立製作所 | 水冷インバータ |
US6972957B2 (en) * | 2002-01-16 | 2005-12-06 | Rockwell Automation Technologies, Inc. | Modular power converter having fluid cooled support |
JP4290461B2 (ja) * | 2003-04-03 | 2009-07-08 | 株式会社日立製作所 | 電動装置の冷却システムおよび冷却制御方法 |
JP4796841B2 (ja) * | 2005-12-28 | 2011-10-19 | 株式会社日立産機システム | 電力変換装置、及びその制御方法 |
CN103616789B (zh) * | 2013-12-06 | 2016-03-02 | 中国电子科技集团公司第四十四研究所 | 适用于热电制冷型InGaAs短波红外相机的机壳 |
JP6733405B2 (ja) * | 2016-07-29 | 2020-07-29 | 三菱自動車工業株式会社 | 電動車両の冷却構造 |
JP6690732B2 (ja) * | 2016-11-14 | 2020-04-28 | 株式会社Ihi | 電動コンプレッサ |
-
2018
- 2018-08-09 JP JP2020535320A patent/JP7031746B2/ja active Active
- 2018-08-09 US US17/265,575 patent/US11729956B2/en active Active
- 2018-08-09 EP EP18929553.8A patent/EP3836380B1/en active Active
- 2018-08-09 CN CN201880096171.5A patent/CN112534701B/zh active Active
- 2018-08-09 WO PCT/IB2018/001045 patent/WO2020030939A1/ja unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006264473A (ja) * | 2005-03-23 | 2006-10-05 | Toyota Motor Corp | 冷却システムおよびハイブリッド自動車 |
JP2012170177A (ja) * | 2011-02-10 | 2012-09-06 | Toyota Motor Corp | 電力制御装置の搭載構造 |
JP2013128051A (ja) * | 2011-12-19 | 2013-06-27 | Mahle Filter Systems Japan Corp | インバータ回路の冷却装置 |
JP2017103944A (ja) * | 2015-12-03 | 2017-06-08 | 富士電機株式会社 | 冷却システムの制御装置 |
JP2018114833A (ja) * | 2017-01-18 | 2018-07-26 | 日野自動車株式会社 | 電動車両用冷却装置 |
Also Published As
Publication number | Publication date |
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EP3836380B1 (en) | 2023-12-20 |
EP3836380A1 (en) | 2021-06-16 |
US11729956B2 (en) | 2023-08-15 |
WO2020030939A1 (ja) | 2020-02-13 |
EP3836380A4 (en) | 2021-08-11 |
CN112534701A (zh) | 2021-03-19 |
CN112534701B (zh) | 2024-07-05 |
US20210243922A1 (en) | 2021-08-05 |
JP7031746B2 (ja) | 2022-03-08 |
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