JPWO2019229610A5 - - Google Patents
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- JPWO2019229610A5 JPWO2019229610A5 JP2020566671A JP2020566671A JPWO2019229610A5 JP WO2019229610 A5 JPWO2019229610 A5 JP WO2019229610A5 JP 2020566671 A JP2020566671 A JP 2020566671A JP 2020566671 A JP2020566671 A JP 2020566671A JP WO2019229610 A5 JPWO2019229610 A5 JP WO2019229610A5
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- JP
- Japan
- Prior art keywords
- polishing
- layer
- rotary tool
- assembly
- rigid support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005498 polishing Methods 0.000 claims 79
- 210000001699 lower leg Anatomy 0.000 claims 12
- 230000001808 coupling Effects 0.000 claims 4
- 238000010168 coupling process Methods 0.000 claims 4
- 238000005859 coupling reaction Methods 0.000 claims 4
- 238000003754 machining Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000003302 ferromagnetic material Substances 0.000 claims 2
- 230000005291 magnetic Effects 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
Claims (21)
前記回転工具の回転軸を画定するシャンクを備える研磨アセンブリホルダと、
研磨アセンブリであって、
約90を超えるショアA硬度を有する剛性支持層、及び
接触面を有する研磨層を備える、研磨アセンブリと、
前記シャンクと前記研磨層との間に配置された弾性層であって、約70未満のショアA硬度を有する弾性層と、を備える研磨用回転工具。 It is a polishing rotary tool
A polishing assembly holder with a shank defining the axis of rotation of the rotary tool,
It ’s a polishing assembly,
A polishing assembly comprising a rigid support layer having a Shore A hardness of greater than about 90 and a polishing layer having a contact surface.
A rotary tool for polishing comprising an elastic layer arranged between the shank and the polishing layer and having an elastic layer having a shore A hardness of less than about 70 .
前記回転工具の回転軸を画定するシャンクを備える研磨アセンブリホルダと、
研磨アセンブリであって、
約1GPaを超える圧縮弾性率を有する剛性支持層、及び
接触面を有する研磨層を備える研磨アセンブリと、
前記シャンクと前記研磨層との間に配置された弾性層であって、約0.1GPa未満の弾性率を有する弾性層と、を備える研磨用回転工具。 It is a rotary tool for polishing,
A polishing assembly holder with a shank defining the axis of rotation of the rotary tool,
It ’s a polishing assembly,
A polishing assembly with a rigid support layer having a compressive modulus of more than about 1 GPa and a polishing layer having a contact surface.
A rotary tool for polishing, comprising an elastic layer arranged between the shank and the polishing layer and having an elastic modulus of less than about 0.1 GPa .
前記回転工具の回転軸を画定するシャンクを備える研磨アセンブリホルダと、
第1の剛性支持層、及び第1の接触面を有する第1の研磨層を備え、かつ前記研磨アセンブリホルダに結合された第1の研磨アセンブリと、
前記シャンクと前記研磨層との間に配置された結合層と、を備える研磨用回転工具と、
第2の剛性支持層、及び第2の接触面を有する第2の研磨層を備える第2の研磨アセンブリと、
前記第1の研磨アセンブリを前記回転工具から取り外し、前記第2の研磨アセンブリを前記研磨アセンブリホルダに取り付けるように構成された回転工具交換装置と、を備えるポリッシングシステム。 It is a rotary tool for polishing,
A polishing assembly holder with a shank defining the axis of rotation of the rotary tool,
A first polishing assembly comprising a first rigid support layer and a first polishing layer having a first contact surface and coupled to the polishing assembly holder.
A polishing rotary tool comprising a bonding layer disposed between the shank and the polishing layer.
A second polishing assembly with a second rigid support layer and a second polishing layer with a second contact surface.
A polishing system comprising a rotary tool changer configured to remove the first polishing assembly from the rotary tool and attach the second polishing assembly to the polishing assembly holder.
前記第1の剛性支持層及び前記第2の剛性支持層は、約90を超えるショアA硬度を有する、請求項15に記載のポリッシングシステム。 The polishing rotary tool further comprises an elastic layer disposed between the shank and the polishing layer, the elastic layer having a shore A hardness of less than about 70.
The polishing system according to claim 15 , wherein the first rigid support layer and the second rigid support layer have a shore A hardness of more than about 90.
前記第1の剛性支持層及び前記第2の剛性支持層は、25%たわみにおいて約2MPaを超える圧縮率を有する、請求項15に記載のポリッシングシステム。 The polishing rotary tool further comprises an elastic layer disposed between the shank and the polishing layer, which has a compressibility of less than about 1.5 MPa at 25% deflection.
The polishing system according to claim 15 , wherein the first rigid support layer and the second rigid support layer have a compressibility of more than about 2 MPa at 25% deflection .
前記基材プラットフォームに固定された基材と、
請求項1に記載の研磨用回転工具と、を備えるアセンブリ。 Computer-controlled machining system with computer-controlled rotary tool holder and substrate platform,
The base material fixed to the base material platform and
An assembly comprising the rotary tool for polishing according to claim 1 .
前記第1の研磨アセンブリを前記回転工具の前記研磨アセンブリホルダから取り外し、
第2の研磨アセンブリを前記回転工具の研磨アセンブリホルダに取り付けるように構成されている、請求項18に記載のアセンブリ。 The polishing assembly of the rotary tool for polishing is a first polishing assembly, the assembly further comprising a rotary tool changer, the rotary tool changer.
The first polishing assembly is removed from the polishing assembly holder of the rotary tool.
18. The assembly of claim 18 , wherein the second polishing assembly is configured to attach to the polishing assembly holder of the rotary tool.
コンピュータ制御回転工具ホルダ及び基材プラットフォームを含むコンピュータ制御機械加工システムを提供することと、
研磨用回転工具を前記コンピュータ制御機械加工システムの前記回転工具ホルダに固定することと、ここで、前記研磨用回転工具は、
前記回転工具の回転軸を画定するシャンクを備える研磨アセンブリホルダと、
第1の剛性支持層及び第1の接触面を有する第1の研磨層を備え、研磨アセンブリホルダに結合された第1の研磨アセンブリと、
前記シャンクと前記研磨層との間に配置された結合層と、を備えており、
前記コンピュータ制御機械加工システムを作動して、前記研磨用回転工具の前記第1の研磨アセンブリを使用して前記基材の接触面を研磨することと、
前記研磨用回転工具の前記研磨アセンブリホルダから前記第1の研磨アセンブリを取り外すことと、
第2の研磨アセンブリを前記研磨用回転工具の前記研磨アセンブリホルダに取り付けることであって、前記第2の研磨アセンブリは、
第2の剛性支持層と、第2の接触面を有する第2の研磨層とを備える、取り付けることと、を含む方法。 A method for polishing the substrate,
To provide a computer controlled machining system including a computer controlled rotary tool holder and a substrate platform.
The polishing rotary tool is fixed to the rotary tool holder of the computer-controlled machining system, and here, the polishing rotary tool is used.
A polishing assembly holder with a shank defining the axis of rotation of the rotary tool,
A first polishing assembly comprising a first rigid support layer and a first polishing layer having a first contact surface and coupled to a polishing assembly holder.
It comprises a bonding layer disposed between the shank and the polishing layer.
To activate the computer-controlled machining system and use the first polishing assembly of the polishing rotary tool to polish the contact surface of the substrate.
Removing the first polishing assembly from the polishing assembly holder of the rotating tool for polishing
The second polishing assembly is attached to the polishing assembly holder of the rotating tool for polishing, and the second polishing assembly is
A method comprising attaching, comprising a second rigid support layer and a second polishing layer having a second contact surface .
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862678115P | 2018-05-30 | 2018-05-30 | |
US62/678,115 | 2018-05-30 | ||
PCT/IB2019/054339 WO2019229610A1 (en) | 2018-05-30 | 2019-05-24 | Abrasive rotary tool |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021525656A JP2021525656A (en) | 2021-09-27 |
JPWO2019229610A5 true JPWO2019229610A5 (en) | 2022-05-31 |
Family
ID=68697574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020566671A Withdrawn JP2021525656A (en) | 2018-05-30 | 2019-05-24 | Rotating tool for polishing |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2021525656A (en) |
CN (1) | CN112166009A (en) |
WO (1) | WO2019229610A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20220395962A1 (en) * | 2019-11-05 | 2022-12-15 | 3M Innovative Properties Company | Molded Abrasive Rotary Tool |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB329323A (en) * | 1929-02-14 | 1930-05-14 | Herbert Ralph Stratford | Improvements in or relating to the abrading or surfacing of wood, metal and other panels and the like |
CA1027761A (en) * | 1975-11-26 | 1978-03-14 | Miksa Marton | Vacuum sander |
SE506665C2 (en) * | 1993-01-12 | 1998-01-26 | Sl Innovation Ab | Cushion roller with joint tensioning member for elastic sleeve and abrasive sheets |
US6773339B2 (en) * | 2002-12-10 | 2004-08-10 | Universal Photonics, Inc. | Abrasive pad, and method of making the same |
WO2012020275A1 (en) * | 2010-08-10 | 2012-02-16 | Miksa Marton | Sanding apparatus |
EP3347162A4 (en) * | 2015-09-08 | 2019-05-15 | 3M Innovative Properties Company | Flexible abrasive rotary tool |
-
2019
- 2019-05-24 WO PCT/IB2019/054339 patent/WO2019229610A1/en active Application Filing
- 2019-05-24 JP JP2020566671A patent/JP2021525656A/en not_active Withdrawn
- 2019-05-24 CN CN201980035735.9A patent/CN112166009A/en active Pending
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