JPWO2019021507A1 - 半導体装置及び半導体モジュール - Google Patents
半導体装置及び半導体モジュール Download PDFInfo
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Abstract
Description
本発明の実施の形態1に係る半導体装置について、図1から図5を用いて説明する。図1は、本発明の実施の形態1に係る半導体装置の断面図である。図1に示すように、半導体装置100は、リードフレーム1と、絶縁基材2と、半導体素子3と、端子台6と、封止樹脂10とを備える。
本発明を実施するための実施の形態2に係る半導体装置について、図6を参照して説明する。図6は、本発明の実施の形態2に係る半導体装置の概略構成を示す斜視図である。である。図6中、図1と同一符号は同一又は相当部分を示す。本実施の形態における半導体装置100は、制御回路基板12が設けられた点が実施の形態1と異なり、その他の構成は同じである。
本発明を実施するための実施の形態3に係る半導体装置について、図7を参照して説明する。図7は、本実施の形態3に係る半導体装置の一部を拡大した概略構成を示す断面図である。図7中、図1と同一符号は同一又は相当部分を示す。本実施の形態における半導体装置100は、端子台6の端子部材7の構造が実施の形態1と異なっており、その他の構成は同じである。
本発明を実施するための実施の形態4に係る半導体装置について、図8を参照して説明する。図8は、本実施の形態4に係る半導体装置の一部を拡大した概略構成を示す断面図である。である。図8中、図1と同一符号は同一又は相当部分を示す。本実施の形態における半導体装置100は、端子台6の基台8の構造が実施の形態1と異なっており、その他の構成は同じである。
本発明を実施するための実施の形態5に係る半導体装置について、図9を参照して説明する。図9は、本実施の形態5に係る半導体装置の概略構成を示す断面図である。図9中、図1と同一符号は同一又は相当部分を示す。本実施の形態における半導体装置100は、端子台6の構造が実施の形態1と異なるだけであり、その他の構成は同じである。
本発明を実施するための実施の形態6に係る半導体装置について、図10、図11を参照して説明する。図10は、実施の形態6に係る半導体装置を示す斜視図である。図11は、実施の形態6に係る半導体装置を製造する一工程を示す斜視図である。図10、図11中、図1と同一符号は同一又は相当部分を示す。実施の形態1において、端子1bを形成したリードフレーム1を封止樹脂10から取り出す際、封止樹脂10の側面から屈曲させて取り出していたのに対し、本実施の形態では、封止樹脂10の上面から取り出す点が異なっている。
本発明を実施するための実施の形態7に係る半導体装置について、図12を参照して説明する。図12は、実施の形態7に係る半導体モジュールを示す断面図である。図12中、図1と同一符号は同一又は相当部分を示す。本実施の形態では、実施の形態1の半導体装置100にヒートシンク16を取り付け、半導体モジュール200とした。
Claims (9)
- 絶縁基材と、
前記絶縁基材上に設けられたリードフレームと、
前記リードフレームに搭載された半導体素子と、
前記絶縁基材、前記リードフレーム、及び前記半導体素子を一体的に封止する封止樹脂と、
一端が前記封止樹脂内で前記リードフレームに接合され、他端が前記封止樹脂から露出されて外部配線と接続される端子部材、及び一部が前記封止樹脂と接し前記端子部材を支持する基台を具備する端子台とを
備えることを特徴とする半導体装置。 - 基台は、水平部と前記水平部の一端が立ち上った隔壁部を有することを特徴とする請求項1に記載の半導体装置。
- 端子部材は、嵌込口が形成され、前記嵌込口にリードフレームが挿入されて接続されることを特徴とする請求項1に記載の半導体装置。
- 基台は、切込部が形成され、前記切込部には、封止樹脂が充填されていることを特徴とする請求項1に記載の半導体装置。
- 端子台は、複数の端子部材を備え、前記複数の端子部材は、仕切板によって少なくとも1つが仕切られたことを特徴とする請求項1に記載の半導体装置。
- リードフレームは、封止樹脂の上面から突出するように設けられたことを特徴とする請求項1に記載の半導体装置。
- 端子部材の外部配線と接続される他端は、封止樹脂の側面から露出するように設けられたことを特徴とする請求項1に記載の半導体装置。
- リードフレームは、封止樹脂から取り出され、半導体素子が搭載された面に対向して設けられた制御回路基板に接続されることを特徴とする請求項1から7のいずれか1項に記載の半導体装置。
- 請求項1から請求項8のいずれか1項に記載の半導体装置の半導体素子が搭載された面の反対面には、ヒートシンクが取り付けられたことを特徴とする半導体モジュール。
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PCT/JP2018/001939 WO2019021507A1 (ja) | 2017-07-28 | 2018-01-23 | 半導体装置及び半導体モジュール |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH10150069A (ja) * | 1996-11-21 | 1998-06-02 | Sony Corp | 半導体パッケージ及びその製造方法 |
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