JPWO2016072403A1 - プリント基板へのフレキシブルケーブルの接続構造 - Google Patents
プリント基板へのフレキシブルケーブルの接続構造 Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims abstract description 67
- 239000010410 layer Substances 0.000 claims description 96
- 239000004020 conductor Substances 0.000 claims description 50
- 238000004804 winding Methods 0.000 claims description 11
- 239000011229 interlayer Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 11
- 229910000859 α-Fe Inorganic materials 0.000 description 6
- 239000011324 bead Substances 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000003475 lamination Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/79—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7082—Coupling device supported only by cooperation with PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/77—Coupling devices for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/777—Coupling parts carrying pins, blades or analogous contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/719—Structural association with built-in electrical component specially adapted for high frequency, e.g. with filters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10356—Cables
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
図1は、実施形態1に係るコネクタモジュール1の斜視図である。図2は、コネクタモジュール1をプリント基板100に実装した状態を示す図である。図3は、コネクタモジュール1の断面図である。
図7は、実施形態2に係るコネクタモジュール2の断面図である。
G1,G2,G7…グランド用電極
G3,G4,G5,G6…側面電極
G8…グランド用外部電極
L1…インダクタンス成分
1,2…コネクタモジュール
10…表面実装型コネクタ
10A…差込部
10B…止め部
10C…フレキシブルケーブル
11…基板
11A…実装用電極
11B…外部実装電極
11C…グランド接続電極
12…インダクタ
13…半田
14,30…グランド電極
15,24,27,31…ビアホール導体
17,22,28,28A…電極
21…実装用電極
25A…コイル状電極パターン
25A,25B,26A,26B…コイル状電極パターン
29…外部実装電極
29A…ダミー実装電極
31,32,33,34…ビアホール導体
35…グランド接続電極
100…プリント基板
101…配線パターン
111,112,113,114,115,116,117,118…磁性体層
Claims (8)
- コネクタと、
複数の磁性体層を含み、対向する第1主面及び第2主面を有する基板と、
前記基板の前記第1主面に設けられ、前記コネクタが実装されるコネクタ接続端子と、
前記基板の前記第2主面に設けられた第1外部接続端子と、
前記磁性体層の内部に形成され、前記コネクタ接続端子と前記第1外部接続端子との間に設けられたインダクタンス素子と
を備えるコネクタモジュール。 - 前記コネクタ接続端子を複数有し、
前記第2主面には、複数の前記コネクタ接続端子それぞれに対応して、複数の前記第1外部接続端子が設けられ、
前記基板内部には、複数の前記コネクタ接続端子と、複数の前記第1外部接続端子との間にそれぞれにインダクタンス素子が形成されている、
請求項1に記載のコネクタモジュール。 - 複数の前記コネクタ接続端子は、前記第1主面の所定方向に離れて設けられ、
複数の前記第1外部接続端子それぞれは、前記複数のコネクタ接続端子それぞれに対向する位置に設けられ、
前記インダクタンス素子は、前記コネクタ接続端子と前記第1外部接続端子との間に形成されている、
請求項2に記載のコネクタモジュール。 - 前記コネクタ接続端子を複数有し、
前記第2主面には、複数の前記コネクタ接続端子それぞれに対応して、複数の前記第1外部接続端子が設けられ、
前記コネクタ接続端子の少なくとも一つと、前記第1外部接続端子の少なくとも一つとは、前記インダクタンス素子を介して接続され、
前記コネクタ接続端子の少なくとも一つと、前記第1外部接続端子の少なくとも一つとは、前記基板の側面に引き回された配線を介して接続されている、
請求項1に記載のコネクタモジュール。 - 前記インダクタンス素子は、前記磁性体層の積層方向を巻回軸としたコイル状導体パターンである、請求項1から4の何れかに記載のコネクタモジュール。
- 前記基板に形成され、前記磁性体層の積層方向において前記インダクタンス素子と重なるグランド導体を備える、請求項1から5の何れかに記載のコネクタモジュール。
- 前記グランド導体は、前記インダクタンス素子と前記第1主面との間に形成されている、請求項6に記載のコネクタモジュール。
- 前記基板の前記第2主面に設けられた第2外部接続端子と、
前記基板に形成され、前記グランド導体と前記第2外部接続端子とを接続する層間接続導体と、
を備える請求項7に記載のコネクタモジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014226636 | 2014-11-07 | ||
JP2014226636 | 2014-11-07 | ||
PCT/JP2015/080983 WO2016072403A1 (ja) | 2014-11-07 | 2015-11-04 | コネクタモジュール |
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JPWO2016072403A1 true JPWO2016072403A1 (ja) | 2017-06-08 |
JP6344482B2 JP6344482B2 (ja) | 2018-06-20 |
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JP2016557767A Active JP6344482B2 (ja) | 2014-11-07 | 2015-11-04 | プリント基板へのフレキシブルケーブルの接続構造 |
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Country | Link |
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US (1) | US10004144B2 (ja) |
JP (1) | JP6344482B2 (ja) |
CN (1) | CN207134191U (ja) |
WO (1) | WO2016072403A1 (ja) |
Families Citing this family (2)
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KR101996460B1 (ko) * | 2017-12-22 | 2019-07-04 | 주식회사 유라코퍼레이션 | 커넥터 모듈 |
US10312631B1 (en) * | 2018-02-20 | 2019-06-04 | The Boeing Company | Detachable communications connector for vehicle stores and method therefor |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005229434A (ja) * | 2004-02-13 | 2005-08-25 | Tdk Corp | 積層型フィルタ及び積層型フィルタアレイ |
JP2005302810A (ja) * | 2004-04-07 | 2005-10-27 | Murata Mfg Co Ltd | ノイズ対策部品 |
WO2012153691A1 (ja) * | 2011-05-09 | 2012-11-15 | 株式会社村田製作所 | インピーダンス変換回路および通信端末装置 |
WO2014129279A1 (ja) * | 2013-02-19 | 2014-08-28 | 株式会社村田製作所 | インダクタブリッジおよび電子機器 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000269613A (ja) | 1999-03-18 | 2000-09-29 | Matsushita Electric Ind Co Ltd | 不要輻射対応プリント基板 |
US7350292B2 (en) * | 2004-03-19 | 2008-04-01 | Hewlett-Packard Development Company, L.P. | Method for affecting impedance of an electrical apparatus |
US8440917B2 (en) * | 2007-11-19 | 2013-05-14 | International Business Machines Corporation | Method and apparatus to reduce impedance discontinuity in packages |
-
2015
- 2015-11-04 CN CN201590001041.0U patent/CN207134191U/zh active Active
- 2015-11-04 WO PCT/JP2015/080983 patent/WO2016072403A1/ja active Application Filing
- 2015-11-04 JP JP2016557767A patent/JP6344482B2/ja active Active
-
2017
- 2017-04-14 US US15/487,454 patent/US10004144B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005229434A (ja) * | 2004-02-13 | 2005-08-25 | Tdk Corp | 積層型フィルタ及び積層型フィルタアレイ |
JP2005302810A (ja) * | 2004-04-07 | 2005-10-27 | Murata Mfg Co Ltd | ノイズ対策部品 |
WO2012153691A1 (ja) * | 2011-05-09 | 2012-11-15 | 株式会社村田製作所 | インピーダンス変換回路および通信端末装置 |
WO2014129279A1 (ja) * | 2013-02-19 | 2014-08-28 | 株式会社村田製作所 | インダクタブリッジおよび電子機器 |
Also Published As
Publication number | Publication date |
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US20170223836A1 (en) | 2017-08-03 |
CN207134191U (zh) | 2018-03-23 |
WO2016072403A1 (ja) | 2016-05-12 |
JP6344482B2 (ja) | 2018-06-20 |
US10004144B2 (en) | 2018-06-19 |
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