JPWO2016013536A1 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
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- JPWO2016013536A1 JPWO2016013536A1 JP2016535930A JP2016535930A JPWO2016013536A1 JP WO2016013536 A1 JPWO2016013536 A1 JP WO2016013536A1 JP 2016535930 A JP2016535930 A JP 2016535930A JP 2016535930 A JP2016535930 A JP 2016535930A JP WO2016013536 A1 JPWO2016013536 A1 JP WO2016013536A1
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- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
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- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
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Abstract
Description
気体置換ユニットは、給気弁から流入した基板用保護気体を貯留するハウジング部材と、このハウジング部材の開口面を覆うカバー部材とを含み、ハウジング部材の下部を基板用保護気体が流通するよう給気弁に接続し、ハウジング部材とカバー部材のいずれか一方に、ハウジング部材内の基板用保護気体を容器本体の正面方向に吹き出す複数の吹出孔を設けたことを特徴としている。
また、気体置換ユニットのハウジング部材の開口した正面を容器本体の背面壁方向に向けてハウジングの閉じた背面壁を容器本体の正面方向に向け、ハウジング部材の背面壁に複数の吹出孔を設け、ハウジング部材の正面を吹出孔無のカバー部材により覆うことができる。
気体置換ユニットのハウジング部材を容器本体の上下方向に伸ばしてその大きさを容器本体の背面壁の少なくとも大部分に対向可能な大きさとし、ハウジング部材の内部を複数の貯留空間に区画し、この複数の貯留空間の間に基板視認用の観察窓を形成するとともに、複数の貯留空間の上部間と下部間の少なくともいずれか一方を基板用保護気体が流通するよう連通させ、
気体置換ユニットのカバー部材に、ハウジング部材の観察窓に対応する切り欠きを形成し、カバー部材の縦横方向に複数の吹出孔を配列することもできる。
また、気体置換ユニットは、容器本体の底部と天井のうち、少なくとも天井との間に隙間を区画するよう対向する整風板部材を含み、この整風板部材が区画する隙間を容器本体の背面壁内面とハウジング部材との間の空隙と連通させて気体流通路とし、カバー部材の複数の吹出孔のうち、下方の吹出孔の位置を、最下方に位置する基板の下面に基板用保護気体が触れないよう調整することが可能である。
また、気体置換ユニットを導電材料により形成し、この気体置換ユニットの容器本体との接続部により、気体置換ユニットの静電気を容器本体の外部に接地可能とすることが可能である。
また、気体置換ユニットは、ハウジング部材とカバー部材との間に介在される通気性のフィルタ部材を含むと良い。
また、容器本体の背面壁の内面上部に、気体置換ユニット用の係止片を容器本体の正面方向に向けて形成し、ハウジング部材の観察窓の周縁部上方に、容器本体の背面壁の係止片と接続される係合片を形成することもできる。
また、気体置換ユニットの整風板部材に、気体用のガイドを平面V字形状に形成し、このガイドの屈曲部を容器本体の背面壁方向に向けても良い。
カバー52は、ハウジング41の区画構造に対応するよう、隣接する左右一対のカバー領域53に分割され、各カバー領域53が縦長に形成されてハウジング41の貯留空間44を被覆する。その他の部分については、上記実施形態と同様であるので説明を省略する。
2 正面
3 支持片
5 基板収納領域
6 底板(底部)
7 取付孔
10 給気弁
13 排気弁
16 天井板(天井)
18 背面壁
19 係止片
30 蓋体
36 施錠機構
40 気体置換ユニット
41 ハウジング(ハウジング部材)
42 正面
43 空隙
44 貯留空間
46 観察窓
47 一対の貯留空間の上部間(複数の貯留空間の上部間)
48 一対の貯留空間の下部間(複数の貯留空間の下部間)
49 係合片
50 流通筒部
52 カバー(カバー部材)
53 カバー領域
54 切り欠き
55 吹出孔
56 フィルタ(フィルタ部材)
57 整風板(整風板部材)
59 隙間
60 気体流通路
61 接触突起
80 EFEM
82 ファンフィルターユニット
S 澱み
W 半導体ウェーハ(基板)
Claims (9)
- 複数枚の基板を収納可能な容器本体と、この容器本体の外部から内部に基板用保護気体を供給する給気弁と、この給気弁からの基板用保護気体を容器本体の内部に吹き出す気体置換ユニットとを備え、容器本体をフロントオープンボックスに形成してその底部後方に給気弁を取り付けた基板収納容器であって、
気体置換ユニットは、給気弁から流入した基板用保護気体を貯留するハウジング部材と、このハウジング部材の開口面を覆うカバー部材とを含み、ハウジング部材の下部を基板用保護気体が流通するよう給気弁に接続し、ハウジング部材とカバー部材のいずれか一方に、ハウジング部材内の基板用保護気体を容器本体の正面方向に吹き出す複数の吹出孔を設けたことを特徴とする基板収納容器。 - 気体置換ユニットのハウジング部材の開口面を正面とし、このハウジング部材の開口した正面を容器本体の正面方向に向け、ハウジング部材の正面をカバー部材により覆うとともに、このカバー部材に複数の吹出孔を設けた請求項1記載の基板収納容器。
- 容器本体に複数枚の基板を上下方向に並べて収納可能とし、この容器本体の少なくとも背面壁に透明性を付与し、
気体置換ユニットのハウジング部材を容器本体の上下方向に伸ばしてその大きさを容器本体の背面壁の少なくとも大部分に対向可能な大きさとし、ハウジング部材の内部を複数の貯留空間に区画し、この複数の貯留空間の間に基板視認用の観察窓を形成するとともに、複数の貯留空間の上部間と下部間の少なくともいずれか一方を基板用保護気体が流通するよう連通させ、
気体置換ユニットのカバー部材に、ハウジング部材の観察窓に対応する切り欠きを形成し、カバー部材の縦横方向に複数の吹出孔を配列した請求項2記載の基板収納容器。 - 気体置換ユニットのハウジング部材の上部と中央部の少なくともいずれか一方を容器本体の内部に支持させた請求項1、2、又は3記載の基板収納容器。
- 気体置換ユニットは、容器本体の背面壁内面との間に空隙を形成するよう配置され、容器本体の底部と天井のうち、少なくとも天井との間に隙間を区画するよう対向する整風板部材を含み、この整風板部材が区画する隙間を空隙と連通させて気体流通路とし、カバー部材の複数の吹出孔のうち、下方の吹出孔の位置を、最下方に位置する基板の下面に基板用保護気体が触れないよう調整した請求項2、3、又は4記載の基板収納容器。
- 気体置換ユニットの複数の吹出孔のうち、上方の吹出孔の位置を、最上方に位置する基板の上面に基板用保護気体が触れないよう調整した請求項1ないし5いずれか一項に記載の基板収納容器。
- 気体置換ユニットを導電材料により形成し、この気体置換ユニットの容器本体との接続部により、気体置換ユニットの静電気を容器本体の外部に接地可能とした請求項1ないし6いずれか一項に記載の基板収納容器。
- 気体置換ユニットを導電材料により形成してその表面抵抗値を103〜1012Ωの範囲内とした請求項1ないし8いずれか一項に記載の基板収納容器。
- 気体置換ユニットは、ハウジング部材とカバー部材との間に介在される通気性のフィルタ部材を含んでなる請求項1ないし8いずれか一項に記載の基板収納容器。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2014151855 | 2014-07-25 | ||
JP2014151855 | 2014-07-25 | ||
PCT/JP2015/070655 WO2016013536A1 (ja) | 2014-07-25 | 2015-07-21 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
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JPWO2016013536A1 true JPWO2016013536A1 (ja) | 2017-05-25 |
JP6532466B2 JP6532466B2 (ja) | 2019-06-19 |
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JP2016535930A Active JP6532466B2 (ja) | 2014-07-25 | 2015-07-21 | 基板収納容器 |
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US (1) | US10312122B2 (ja) |
JP (1) | JP6532466B2 (ja) |
KR (1) | KR102397525B1 (ja) |
CN (1) | CN106537574B (ja) |
DE (1) | DE112015003423T5 (ja) |
SG (1) | SG11201700505UA (ja) |
TW (1) | TWI661503B (ja) |
WO (1) | WO2016013536A1 (ja) |
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JP6553498B2 (ja) * | 2015-12-15 | 2019-07-31 | 信越ポリマー株式会社 | 基板収納容器 |
KR101865636B1 (ko) * | 2016-07-06 | 2018-06-08 | 우범제 | 웨이퍼 수납용기 |
JP6977217B2 (ja) * | 2016-09-06 | 2021-12-08 | 信越ポリマー株式会社 | 基板収納容器及び気体置換ユニット |
JP6623988B2 (ja) * | 2016-09-09 | 2019-12-25 | 株式会社ダイフク | 容器収納設備 |
US10115607B2 (en) * | 2016-09-16 | 2018-10-30 | Applied Materials, Inc. | Method and apparatus for wafer outgassing control |
US10262884B2 (en) * | 2016-11-10 | 2019-04-16 | Applied Materials, Inc. | Systems, apparatus, and methods for an improved load port |
JP6710861B2 (ja) * | 2017-01-24 | 2020-06-17 | 信越ポリマー株式会社 | 基板収納容器及び基板収納容器の製造方法 |
KR102461290B1 (ko) * | 2017-03-27 | 2022-11-01 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
WO2018203384A1 (ja) * | 2017-05-02 | 2018-11-08 | ミライアル株式会社 | 基板収納容器 |
KR102066175B1 (ko) * | 2017-12-28 | 2020-01-14 | 우범제 | 웨이퍼 수납용기 |
WO2019194326A1 (ko) * | 2018-04-02 | 2019-10-10 | 우범제 | 웨이퍼 수납용기 |
US11355371B2 (en) * | 2018-04-02 | 2022-06-07 | Bum Je WOO | Wafer storage container |
JP7299474B2 (ja) * | 2019-03-13 | 2023-06-28 | シンフォニアテクノロジー株式会社 | Efem |
CN112289718A (zh) * | 2019-07-13 | 2021-01-29 | 家登精密工业股份有限公司 | 基板载具及其气体扩散模块 |
US11104496B2 (en) * | 2019-08-16 | 2021-08-31 | Gudeng Precision Industrial Co., Ltd. | Non-sealed reticle storage device |
KR102272005B1 (ko) * | 2019-10-17 | 2021-07-02 | (주)에스티아이 | 풉 세정 장치 |
CN113937041A (zh) * | 2021-06-30 | 2022-01-14 | 家登精密工业股份有限公司 | 基板容器*** |
TWI832599B (zh) * | 2022-07-27 | 2024-02-11 | 家登精密工業股份有限公司 | 上開式載板載具 |
TWI817828B (zh) | 2022-08-11 | 2023-10-01 | 家登精密工業股份有限公司 | 內建負壓氣室之基板容器 |
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2015
- 2015-07-21 JP JP2016535930A patent/JP6532466B2/ja active Active
- 2015-07-21 KR KR1020177004770A patent/KR102397525B1/ko active IP Right Grant
- 2015-07-21 US US15/329,078 patent/US10312122B2/en active Active
- 2015-07-21 DE DE112015003423.4T patent/DE112015003423T5/de not_active Withdrawn
- 2015-07-21 SG SG11201700505UA patent/SG11201700505UA/en unknown
- 2015-07-21 WO PCT/JP2015/070655 patent/WO2016013536A1/ja active Application Filing
- 2015-07-21 CN CN201580040567.4A patent/CN106537574B/zh active Active
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002122382A (ja) * | 2000-01-28 | 2002-04-26 | Ebara Corp | 基板容器 |
JP2002170876A (ja) * | 2000-12-04 | 2002-06-14 | Ebara Corp | 基板搬送容器 |
JP2013513951A (ja) * | 2009-12-10 | 2013-04-22 | インテグリス・インコーポレーテッド | 微小環境中に均一に分布した浄化ガスを得るための多孔質バリア |
WO2011102318A1 (ja) * | 2010-02-19 | 2011-08-25 | 信越ポリマー株式会社 | 基板収納容器 |
Also Published As
Publication number | Publication date |
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CN106537574A (zh) | 2017-03-22 |
JP6532466B2 (ja) | 2019-06-19 |
TW201622047A (zh) | 2016-06-16 |
US10312122B2 (en) | 2019-06-04 |
KR20170038846A (ko) | 2017-04-07 |
TWI661503B (zh) | 2019-06-01 |
KR102397525B1 (ko) | 2022-05-12 |
SG11201700505UA (en) | 2017-02-27 |
CN106537574B (zh) | 2020-06-05 |
WO2016013536A1 (ja) | 2016-01-28 |
DE112015003423T5 (de) | 2017-05-04 |
US20170213752A1 (en) | 2017-07-27 |
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