JPWO2014010072A1 - 照明装置 - Google Patents
照明装置 Download PDFInfo
- Publication number
- JPWO2014010072A1 JPWO2014010072A1 JP2014524564A JP2014524564A JPWO2014010072A1 JP WO2014010072 A1 JPWO2014010072 A1 JP WO2014010072A1 JP 2014524564 A JP2014524564 A JP 2014524564A JP 2014524564 A JP2014524564 A JP 2014524564A JP WO2014010072 A1 JPWO2014010072 A1 JP WO2014010072A1
- Authority
- JP
- Japan
- Prior art keywords
- flexible substrate
- transparent flexible
- housing
- light
- reflective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 73
- 238000002834 transmittance Methods 0.000 claims description 4
- 238000005286 illumination Methods 0.000 abstract description 18
- 230000031700 light absorption Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 31
- 238000005516 engineering process Methods 0.000 description 13
- 239000000463 material Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000004020 conductor Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/10—Light sources with three-dimensionally disposed light-generating elements on concave supports or substrates, e.g. on the inner side of bowl-shaped supports
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
12、112:筺体
14、114:反射層
16、116:透明フレキシブル基板
18、118:発光ダイオード
26:プリント配線
28:端子
Claims (5)
- 筺体と、
前記筺体の表面に配置された透明フレキシブル基板と、
前記透明フレキシブル基板に実装された少なくとも一つの光源と、
前記筺体と前記透明フレキシブル基板との面の間に位置し、前記透明フレキシブル基板を透過した光を反射する反射層と、
を備える照明装置。 - 前記透明フレキシブル基板は、少なくとも前記光源が発する可視光域の光に対して、80パーセント以上の透過率を有することを特徴とする請求項1に記載の照明装置。
- 前記反射層は、前記筺体の表面に形成された被膜であることを特徴とする請求項1又は2に記載の照明装置。
- 前記筺体は、開口部を有するとともに、開口部の中心軸に対して回転対称の形状を有する内側表面を有し、
前記透明フレキシブル基板は、前記筺体の内側表面に配置されていることを特徴とする請求項1から3のいずれか一項に記載の照明装置。 - 前記光源は、発光ダイオードであることを特徴とする請求項1から4のいずれか一項に記載の照明装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/067890 WO2014010072A1 (ja) | 2012-07-13 | 2012-07-13 | 照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2014010072A1 true JPWO2014010072A1 (ja) | 2016-06-20 |
JP5956577B2 JP5956577B2 (ja) | 2016-07-27 |
Family
ID=49915574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014524564A Active JP5956577B2 (ja) | 2012-07-13 | 2012-07-13 | 照明装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5956577B2 (ja) |
WO (1) | WO2014010072A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015155663A1 (en) * | 2014-04-11 | 2015-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device |
JP7236821B2 (ja) * | 2018-06-19 | 2023-03-10 | 三菱電機株式会社 | 照明具、照明装置、及び、照明具の製造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002184209A (ja) * | 2000-12-19 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 照明装置 |
JP2006180855A (ja) * | 2004-12-25 | 2006-07-13 | N Bii T Kk | 光を用いた移動式昆虫捕獲器 |
WO2007020820A1 (ja) * | 2005-08-12 | 2007-02-22 | Sharp Kabushiki Kaisha | バックライトユニット、及び液晶表示装置 |
JP2011091058A (ja) * | 2011-01-25 | 2011-05-06 | Semiconductor Energy Lab Co Ltd | 照明器具 |
WO2011142097A1 (ja) * | 2010-05-13 | 2011-11-17 | パナソニック株式会社 | 実装用基板及びその製造方法、発光モジュール並びに照明装置 |
WO2012081498A1 (ja) * | 2010-12-17 | 2012-06-21 | ソニー株式会社 | 照明装置および表示装置 |
JP2012119585A (ja) * | 2010-12-02 | 2012-06-21 | Showa Denko Kk | 発光ダイオード、発光ダイオードランプ及び照明装置 |
-
2012
- 2012-07-13 WO PCT/JP2012/067890 patent/WO2014010072A1/ja active Application Filing
- 2012-07-13 JP JP2014524564A patent/JP5956577B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002184209A (ja) * | 2000-12-19 | 2002-06-28 | Matsushita Electric Ind Co Ltd | 照明装置 |
JP2006180855A (ja) * | 2004-12-25 | 2006-07-13 | N Bii T Kk | 光を用いた移動式昆虫捕獲器 |
WO2007020820A1 (ja) * | 2005-08-12 | 2007-02-22 | Sharp Kabushiki Kaisha | バックライトユニット、及び液晶表示装置 |
WO2011142097A1 (ja) * | 2010-05-13 | 2011-11-17 | パナソニック株式会社 | 実装用基板及びその製造方法、発光モジュール並びに照明装置 |
JP2012119585A (ja) * | 2010-12-02 | 2012-06-21 | Showa Denko Kk | 発光ダイオード、発光ダイオードランプ及び照明装置 |
WO2012081498A1 (ja) * | 2010-12-17 | 2012-06-21 | ソニー株式会社 | 照明装置および表示装置 |
JP2011091058A (ja) * | 2011-01-25 | 2011-05-06 | Semiconductor Energy Lab Co Ltd | 照明器具 |
Also Published As
Publication number | Publication date |
---|---|
JP5956577B2 (ja) | 2016-07-27 |
WO2014010072A1 (ja) | 2014-01-16 |
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