JPWO2013180288A1 - 電子素子搭載用基板および電子装置 - Google Patents
電子素子搭載用基板および電子装置 Download PDFInfo
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Abstract
Description
果的に防止することが可能となるものである。
図1〜図3を参照して本発明の第1の実施形態における電子装置について説明する。本実施形態における電子装置は、電子素子搭載用基板1と、電子素子搭載用基板1に配置された電子素子11を有している。
粉末に適当な有機溶剤および溶媒を添加混合して泥漿状となすとともに、これを従来周知のドクターブレード法またはカレンダーロール法等を採用してシート状に成形することによってセラミックグリーンシートを得て、次に、セラミックグリーンシートに適当な打ち抜きまたはレーザー加工を施すとともに必要に応じて複数枚積層し、高温(約1500〜1800℃)で焼成することによって製作される。なお、絶縁基体2の凹部2aおよび開口部3を形成するには、上述の打ち抜きまたはレーザー加工時に、絶縁基体2用のセラミックグリーンシートのいくつかに、凹部2a用および開口部3用の貫通孔を金型、パンチングによる打ち抜きまたはレーザー加工等により形成しておけばよい。また、絶縁基体2に凹部2aを形成する場合は、それぞれのセラミックグリーンシートに凹部2a用の貫通孔が開口部3用の貫通孔よりも大きくなるように形成しておけばよい。
搭載用基板1が変形しようとする方向と補強部4の配置方向とが直交するため、応力を緩和する効果が増して、絶縁基体2に発生する可能性のあるクラックをより防止することができる。
図4〜図7を参照して本発明の第2の実施形態における電子装置について説明する。本実施形態の電子装置において、第1の実施形態と異なる点は、補強部4の形状である。図4、図5においては、補強部4は、1対の辺が他の1対の辺よりも長い矩形の形状をしており、近傍に電子素子接続用電極5が形成された開口部3の対向する2辺に対し、他の対向する2辺に沿って配置され、補強部4の両端部は電子素子接続用電極5の外側端部よりも外側に位置している。この場合、補強部4は、近傍に電子素子接続用電極5が形成された開口部3の対向する2辺とは異なる他の対向する2辺よりも補強部4の長辺が長く、開口部3の対向する2辺全体を補強するとともに、開口部3の角部およびその近傍、さらに電子素子11を実装するときに応力が加わる電子素子接続用電極5およびその近傍を補強することができ、開口部3およびその周辺にかかるストレスをより広い範囲で補強できて、絶縁基体2の開口部3周辺の変形を抑える効果がより高まるため、絶縁基体2の開口部3の角部のクラックの発生を防止することができる。
2・・・・・絶縁基体
2a・・・・凹部
2b・・・・傾斜部
3・・・・・開口部
4・・・・・補強部
5・・・・・電子素子接続用電極
11・・・・電子素子
Claims (6)
- 開口部を有しており、平面透視で前記開口部と重なるように電子素子が配置される絶縁基体と、
該絶縁基体の表面または内部に設けられているとともに平面透視において前記絶縁基体の前記開口部の周辺に配置された補強部とを備えていることを特徴とする電子素子搭載用基板。 - 平面透視において、前記補強部が前記開口部に沿って配置されていることを特徴とする請求項1記載の電子素子搭載用基板。
- 平面透視において、前記開口部が多角形であり、前記補強部が前記多角形の1辺に沿って配置されていることを特徴とする請求項1記載の電子素子搭載用基板。
- 平面透視において、前記開口部が多角形であり、前記補強部が前記多角形の隣り合う2辺に沿って配置されていることを特徴とする請求項1記載の電子素子搭載用基板。
- 前記絶縁基体の表面に設けられているとともに平面透視において前記絶縁基体の前記開口部の周辺に配置された電子素子接続用電極を備えており、
前記絶縁基体は、平面透視における前記開口部の周辺に前記電子素子が配置される側へ傾斜した傾斜部を有しており、
前記補強部は、前記絶縁基体の表面の前記電子素子が配置される側に設けられていることを特徴とする請求項1記載の電子素子搭載用基板。 - 請求項1または請求項5に記載された電子素子搭載用基板と、
平面透視で該電子素子搭載用基板に形成された前記開口部と重なるように配置された電子素子とを備えていることを特徴とする電子装置。
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004327916A (ja) * | 2003-04-28 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2005051015A (ja) * | 2003-07-28 | 2005-02-24 | Matsushita Electric Works Ltd | 立体回路板及び撮像装置 |
JP2006020014A (ja) * | 2004-07-01 | 2006-01-19 | Matsushita Electric Ind Co Ltd | 撮像装置および撮像装置を搭載した携帯無線端末 |
JP2008263552A (ja) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2009099642A (ja) * | 2007-10-15 | 2009-05-07 | Sumitomo Metal Electronics Devices Inc | 電子部品収納用パッケージ |
JP2009140968A (ja) * | 2007-12-03 | 2009-06-25 | Sharp Corp | 固体撮像装置およびその製造方法 |
WO2011084900A1 (en) * | 2010-01-11 | 2011-07-14 | Flextronics Ap Llc | Camera module with molded tape flip chip imager mount and method of manufacture |
WO2012002378A1 (ja) * | 2010-06-28 | 2012-01-05 | 京セラ株式会社 | 配線基板および撮像装置ならびに撮像装置モジュール |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6445254B1 (en) * | 2000-04-06 | 2002-09-03 | Nihon Dempa Kogyo Co., Ltd. | Crystal oscillator and method of bonding IC chip useful for fabricating crystal oscillator |
JP2006201427A (ja) | 2005-01-20 | 2006-08-03 | Kyocera Corp | 撮像素子収納用パッケージ、撮像装置および撮像モジュール |
JP2008263550A (ja) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
WO2008132802A1 (ja) * | 2007-04-13 | 2008-11-06 | Panasonic Corporation | 固体撮像装置およびその製造方法 |
US8659105B2 (en) * | 2009-11-26 | 2014-02-25 | Kyocera Corporation | Wiring substrate, imaging device and imaging device module |
-
2013
- 2013-05-31 CN CN201380024215.0A patent/CN104321861B/zh active Active
- 2013-05-31 US US14/400,585 patent/US9826641B2/en active Active
- 2013-05-31 JP JP2014518763A patent/JP6042885B2/ja active Active
- 2013-05-31 WO PCT/JP2013/065246 patent/WO2013180288A1/ja active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004327916A (ja) * | 2003-04-28 | 2004-11-18 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2005051015A (ja) * | 2003-07-28 | 2005-02-24 | Matsushita Electric Works Ltd | 立体回路板及び撮像装置 |
JP2006020014A (ja) * | 2004-07-01 | 2006-01-19 | Matsushita Electric Ind Co Ltd | 撮像装置および撮像装置を搭載した携帯無線端末 |
JP2008263552A (ja) * | 2007-04-13 | 2008-10-30 | Matsushita Electric Ind Co Ltd | 固体撮像装置およびその製造方法 |
JP2009099642A (ja) * | 2007-10-15 | 2009-05-07 | Sumitomo Metal Electronics Devices Inc | 電子部品収納用パッケージ |
JP2009140968A (ja) * | 2007-12-03 | 2009-06-25 | Sharp Corp | 固体撮像装置およびその製造方法 |
WO2011084900A1 (en) * | 2010-01-11 | 2011-07-14 | Flextronics Ap Llc | Camera module with molded tape flip chip imager mount and method of manufacture |
JP2013516656A (ja) * | 2010-01-11 | 2013-05-13 | フレクストロニクス エイピー エルエルシー | 成形テープフリップチップ画像装置実装を備えたカメラモジュールおよび製造方法 |
WO2012002378A1 (ja) * | 2010-06-28 | 2012-01-05 | 京セラ株式会社 | 配線基板および撮像装置ならびに撮像装置モジュール |
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