JPWO2008108463A1 - Polishing tool and polishing apparatus - Google Patents

Polishing tool and polishing apparatus Download PDF

Info

Publication number
JPWO2008108463A1
JPWO2008108463A1 JP2009502631A JP2009502631A JPWO2008108463A1 JP WO2008108463 A1 JPWO2008108463 A1 JP WO2008108463A1 JP 2009502631 A JP2009502631 A JP 2009502631A JP 2009502631 A JP2009502631 A JP 2009502631A JP WO2008108463 A1 JPWO2008108463 A1 JP WO2008108463A1
Authority
JP
Japan
Prior art keywords
annular
holding member
air phase
grindstone
grindstone holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009502631A
Other languages
Japanese (ja)
Inventor
大西　一正
一正 大西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPWO2008108463A1 publication Critical patent/JPWO2008108463A1/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D5/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting only by their periphery; Bushings or mountings therefor
    • B24D5/16—Bushings; Mountings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/16—Bushings; Mountings

Abstract

研磨対象物（１１）の支持テーブル（１２）；支持テーブルの上方に垂直に配置された回転軸（１３ａ）；そして回転軸に接続されている、環状超音波振動子（３１ａ、３１ｂ）を固定した砥石保持部材（３２）と、砥石保持部材の周縁部の下端に備えられた環状の砥石（３３）とを含む研磨具（４０）から構成され、前記の砥石保持部材の環状超音波振動子の固定位置と回転軸との接続位置との間の位置に、環状に配置した非連続の空気相を含む環状空気相含有帯域を多重に形成してなる環状空気相含有領域（３６）が設けられていて、この環状空気相含有領域により、環状超音波振動子から発生される超音波振動が砥石保持部材の環状空気相含有領域よりも回転軸との接続位置の側の領域に直線的に伝達されないようにされていることを特徴とする研磨装置（１０）は、超音波振動子から発生される超音波振動を砥石に効率良く付与することができるため、研磨対象物を高い精度で研磨することができる。The support table (12) of the object to be polished (11); the rotary shaft (13a) vertically disposed above the support table; and the annular ultrasonic transducers (31a, 31b) connected to the rotary shaft are fixed. The grindstone holding member (32) and a polishing tool (40) including an annular grindstone (33) provided at the lower end of the peripheral edge of the grindstone holding member, and the annular ultrasonic vibrator of the grindstone holding member An annular air phase containing region (36) formed by multiply forming an annular air phase containing zone including a discontinuous air phase arranged in an annular shape is provided at a position between the fixed position of the rotating shaft and the connecting position of the rotating shaft. By this annular air phase-containing region, the ultrasonic vibration generated from the annular ultrasonic transducer is linearly applied to the region closer to the connection position with the rotation shaft than the annular air phase-containing region of the grindstone holding member. That it is not communicated. The polishing apparatus according to symptoms (10), the ultrasonic vibrations generated by the ultrasonic vibrator it is possible to efficiently impart the grindstone, it is possible to polish the polishing object with high accuracy.

Description

本発明は、ガラスやシリコンなどから形成された研磨対象物の表面の研磨に有利に用いることができる研磨具及び研磨装置に関する。   The present invention relates to a polishing tool and a polishing apparatus that can be advantageously used for polishing the surface of an object to be polished formed of glass or silicon.

従来より、薄膜型電子デバイスを形成するために、ガラス基板、シリコン基板、シリコンナイトライド基板、サファイア基板、あるいはシリコンカーバイド基板などの各種の基板が用いられている。これらの基板の表面は、研磨装置を用いて平滑に研磨される。また、レンズやプリズムなどの光学部品にも、その表面を平滑に研磨することが必要とされる場合がある。研磨装置は、このような各種の研磨対象物の表面を研磨したり、あるいは研磨対象物をその表面の研磨を繰り返して所定の厚みに加工したりするために用いられている。   Conventionally, various substrates such as a glass substrate, a silicon substrate, a silicon nitride substrate, a sapphire substrate, or a silicon carbide substrate have been used to form a thin film electronic device. The surfaces of these substrates are polished smoothly using a polishing apparatus. In addition, it may be necessary to smoothly polish the surface of optical components such as lenses and prisms. The polishing apparatus is used for polishing the surface of such various polishing objects or processing the polishing object to a predetermined thickness by repeatedly polishing the surface.

図１は、特許文献１に記載の研磨装置が備える研磨具の構成例を示す平面図であり、そして図２は、図１に記入した切断線Ｉ−Ｉ線に沿って切断した研磨具１の断面図である。   FIG. 1 is a plan view illustrating a configuration example of a polishing tool provided in a polishing apparatus described in Patent Document 1, and FIG. 2 is a polishing tool 1 cut along a cutting line II line written in FIG. FIG.

図１及び図２に示す研磨具１は、回転駆動装置（例、モータ）の回転軸に接続される接続板２、接続板２の周囲に複数の連結部３ａとスペース部３ｂとからなる連結手段３を介して連結されている環状弾性体４、環状弾性体４に環状に配置された状態で固定されている超音波振動子５、および環状弾性体４の周縁部の下端に備えられた環状の砥石６から構成されている。この研磨具１の接続板２は、円盤状の取り付け部材を介して回転軸に固定される。接続板２が備える合計で四個のねじ孔７の各々には、接続板２を前記の取り付け部材に取り付けるためのボルトが挿入される。   The polishing tool 1 shown in FIGS. 1 and 2 includes a connection plate 2 connected to a rotation shaft of a rotary drive device (eg, a motor), and a connection made up of a plurality of connection portions 3a and space portions 3b around the connection plate 2. An annular elastic body 4 connected through means 3, an ultrasonic transducer 5 fixed in an annularly arranged state on the annular elastic body 4, and a lower end of the peripheral edge of the annular elastic body 4. An annular grindstone 6 is used. The connection plate 2 of the polishing tool 1 is fixed to the rotating shaft via a disk-shaped attachment member. Bolts for attaching the connection plate 2 to the attachment member are inserted into each of the four screw holes 7 provided in the connection plate 2 in total.

この研磨具を備える研磨装置では、回転軸を駆動して研磨具１を回転させ、そして各々の超音波振動子５から発生される超音波振動を環状弾性体４を介して砥石６に付与しながら、この砥石６の下面を加工対象物の表面に接触させることにより、加工対象物の表面の研磨が行なわれる。   In a polishing apparatus provided with this polishing tool, the rotating tool is driven to rotate the polishing tool 1, and ultrasonic vibration generated from each ultrasonic vibrator 5 is applied to the grindstone 6 via the annular elastic body 4. However, the surface of the workpiece is polished by bringing the lower surface of the grindstone 6 into contact with the surface of the workpiece.

この研磨具１の環状弾性体４の前記連結部３ａと連結部３ａとの間の部分は、連結部３ａと接続している部分よりも大きく超音波振動し易い。このため、各々の超音波振動子５から発生される超音波振動は、連結部３ａ、そして接続板２を介して回転軸には伝わり難く、その大部分が砥石６に付与される。このように、砥石６に超音波振動が効率良く付与されると、砥石６が大きな振幅で超音波振動して砥石と研磨対象物との摩擦抵抗が低減されるため、不要な機械振動の発生が抑制される。このため、同文献の研磨具１を用いることにより、研磨対象物を高い精度で研磨することができる。
国際公開第０６／１３７４５３号パンフレット A portion between the connecting portion 3a and the connecting portion 3a of the annular elastic body 4 of the polishing tool 1 is more easily ultrasonically vibrated than a portion connected to the connecting portion 3a. For this reason, the ultrasonic vibration generated from each ultrasonic vibrator 5 is hardly transmitted to the rotating shaft via the connecting portion 3 a and the connection plate 2, and most of the vibration is applied to the grindstone 6. In this way, when ultrasonic vibration is efficiently applied to the grindstone 6, the grindstone 6 is ultrasonically vibrated with a large amplitude to reduce the frictional resistance between the grindstone and the object to be polished. Is suppressed. For this reason, it is possible to polish the object to be polished with high accuracy by using the polishing tool 1 of the same document.
International Publication No. 06/137453 Pamphlet

前記の特許文献１の研磨具を用いることにより、研磨対象物を高い精度で研磨することはできる。しかしながら、超音波振動子から発生される超音波振動の一部分が、連結手段の連結部、そして接続板などを通して回転軸へと伝わり、僅かではあるが超音波振動のエネルギーの損失を生じる。   By using the polishing tool of Patent Document 1, the object to be polished can be polished with high accuracy. However, a part of the ultrasonic vibration generated from the ultrasonic vibrator is transmitted to the rotating shaft through the connecting portion of the connecting means, the connecting plate, and the like, causing a slight loss of energy of the ultrasonic vibration.

本発明の課題は、超音波振動子から発生される超音波振動を砥石に効率良く付与することができる研磨具及び研磨装置を提供することにある。   An object of the present invention is to provide a polishing tool and a polishing apparatus that can efficiently apply ultrasonic vibration generated from an ultrasonic vibrator to a grindstone.

本発明は、上側表面に研磨対象物を支持する支持テーブル；支持テーブルの上方に、支持テーブルに対して垂直に配置された回転軸；そして、回転軸の下端部に支持テーブルと平行に接続されている、電源に電気的に接続する環状超音波振動子を固定した砥石保持部材と砥石保持部材の周縁部の下端に備えられた環状の砥石とを含む研磨具から構成された研磨装置であって、前記の研磨具の砥石保持部材の環状超音波振動子の固定位置と回転軸との接続位置との間の位置に、環状に形成もしくは配置した連続もしくは非連続の空気相を含む環状空気相含有帯域を多重に形成してなる環状空気相含有領域が設けられていて、この環状空気相含有領域により、環状超音波振動子から発生される超音波振動が砥石保持部材の環状空気相含有領域よりも回転軸との接続位置の側の領域に直線的に伝達されないようにされていることを特徴とする研磨装置にある。   The present invention includes a support table for supporting an object to be polished on an upper surface; a rotary shaft disposed above the support table and perpendicular to the support table; and a lower end portion of the rotary shaft connected in parallel to the support table. A polishing apparatus comprising a grindstone holding member to which an annular ultrasonic vibrator electrically connected to a power source is fixed, and an annular grindstone provided at the lower end of the peripheral edge of the grindstone holding member. An annular air containing a continuous or discontinuous air phase formed or arranged in an annular shape at a position between the fixed position of the annular ultrasonic transducer of the grindstone holding member of the polishing tool and the connecting position of the rotating shaft. An annular air phase-containing region formed by multiply forming the phase-containing zone is provided, and by this annular air phase-containing region, the ultrasonic vibration generated from the annular ultrasonic vibrator is contained in the annular air phase of the grindstone holding member. From area There it is so as not to be linearly transmitted to the side of the region of the connecting position of the rotation axis in a polishing apparatus according to claim.

本発明の研磨装置の好ましい態様は、下記の通りである。
（１）環状空気相含有領域が、砥石保持部材に連結領域を介して断続的に形成された内周側の複数の貫通溝と連結領域を介して断続的に形成された外周側の複数の貫通溝とから構成されていて、内周側の連結領域は、外周側の貫通溝に接するように配置され、かつ外周側の連結領域は、内周側の貫通溝に接するように配置されている。
（２）環状空気相含有領域が、砥石保持部材に連結領域を介して断続的に形成された内周側の複数の貫通孔と連結領域を介して断続的に形成された外周側の複数の貫通孔とから構成されていて、内周側の連結領域は、外周側の貫通孔に接するように配置され、かつ外周側の連結領域は、内周側の貫通孔に接するように配置されている。
（３）環状空気相含有領域が、砥石保持部材の上側から上下方向に延びた非貫通の円環状上側溝と砥石保持部材の下側から上下方向に延びた非貫通の円環状下側溝とから構成されていて、上側溝と下側溝との深さの合計が砥石保持部材の上下方向の厚みよりも大きい。
（４）環状空気相含有領域が、砥石保持部材の内部で、かつ環状超音波振動子の内周側に備えられた多孔質環状部材から構成されている。
（５）上記砥石保持部材が円板部材と円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、円筒状部材に連結領域を介して断続的に形成された上側の複数の貫通溝と連結領域を介して断続的に形成された下側の複数の貫通溝とから構成されていて、上側の連結領域は、下側の貫通溝に接するように配置され、かつ下側の連結領域は、上側の貫通溝に接するように配置されている。
（６）上記砥石保持部材が円板部材と円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、円筒状部材の外側から厚み方向に延びた非貫通の円環状外側溝と円筒状部材の内側から厚み方向に延びた非貫通の円環状内側溝とから構成されていて、外側溝と内側溝との深さの合計が円筒状部材の厚みよりも大きい。
（７）上記砥石保持部材が円板部材と円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、円筒状部材の内部で、かつ環状超音波振動子の上側に備えられた多孔質環状部材から構成されている。
（８）支持テーブルが回転する。Preferred embodiments of the polishing apparatus of the present invention are as follows.
(1) The annular air phase-containing region has a plurality of inner circumferential side through grooves formed intermittently on the grindstone holding member via the connection region, and a plurality of outer peripheral sides formed intermittently via the connection region. The inner peripheral connection region is disposed so as to be in contact with the outer peripheral side through groove, and the outer peripheral connection region is disposed so as to be in contact with the inner peripheral side through groove. Yes.
(2) The annular air phase-containing region has a plurality of inner peripheral side through-holes intermittently formed in the grindstone holding member via the connection region and a plurality of outer peripheral side holes formed intermittently through the connection region. The inner peripheral side connection region is disposed so as to contact the outer peripheral side through hole, and the outer peripheral side connection region is disposed so as to be in contact with the inner peripheral side through hole. Yes.
(3) The annular air phase-containing region includes a non-penetrating annular upper groove extending in the vertical direction from the upper side of the grindstone holding member and a non-penetrating annular lower groove extending in the vertical direction from the lower side of the grindstone holding member. It is comprised and the sum total of the depth of an upper side groove | channel and a lower side groove | channel is larger than the thickness of the up-down direction of a grindstone holding member.
(4) The annular air phase-containing region is composed of a porous annular member provided inside the grindstone holding member and on the inner peripheral side of the annular ultrasonic transducer.
(5) The grindstone holding member includes a disc member and a cylindrical member extending downward from the periphery of the disc member, and the annular air phase-containing region is intermittently formed in the cylindrical member via the connection region. A plurality of upper through-grooves and a plurality of lower through-grooves intermittently formed through the connection region, and the upper connection region is arranged to contact the lower through-groove. And the lower connection area | region is arrange | positioned so that an upper penetration groove | channel may be touched.
(6) The grindstone holding member includes a disk member and a cylindrical member extending downward from the periphery of the disk member, and the annular air phase-containing region extends in the thickness direction from the outside of the cylindrical member. It is composed of an annular outer groove and a non-penetrating annular inner groove extending in the thickness direction from the inside of the cylindrical member, and the total depth of the outer groove and the inner groove is larger than the thickness of the cylindrical member. .
(7) The grindstone holding member includes a disk member and a cylindrical member extending downward from the periphery of the disk member, and the annular air phase-containing region is inside the cylindrical member and of the annular ultrasonic transducer. It is comprised from the porous annular member with which the upper side was equipped.
(8) The support table rotates.

本発明はまた、中央に回転軸接続部を備え、電源に電気的に接続する環状超音波振動子を固定した砥石保持部材と砥石保持部材の周縁部の下端に備えられた環状の砥石とを含む研磨具であって、前記の砥石保持部材の環状超音波振動子の固定位置と回転軸接続部との間の位置に、環状に形成もしくは配置した連続もしくは非連続の空気相を含む環状空気相含有帯域を多重に形成してなる環状空気相含有領域が設けられていて、この環状空気相含有領域により、環状超音波振動子から発生される超音波振動が砥石保持部材の環状空気相含有領域よりも回転軸接続部の側の領域に直線的に伝達されないようにされていることを特徴とする研磨具にもある。   The present invention also includes a grindstone holding member having a rotating shaft connecting portion at the center and fixed with an annular ultrasonic vibrator that is electrically connected to a power source, and an annular grindstone provided at the lower end of the peripheral edge of the grindstone holding member. An annular air including a continuous or discontinuous air phase formed or arranged in an annular shape at a position between the fixed position of the annular ultrasonic transducer of the grindstone holding member and the rotary shaft connecting portion. An annular air phase-containing region formed by multiply forming the phase-containing zone is provided, and by this annular air phase-containing region, the ultrasonic vibration generated from the annular ultrasonic vibrator is contained in the annular air phase of the grindstone holding member. There is also a polishing tool characterized in that it is not linearly transmitted to the region closer to the rotating shaft connecting portion than the region.

本発明の研磨具の好ましい態様は、前記の研磨装置の好ましい態様を示す（１）〜（７）に記載された研磨具である。   A preferable aspect of the polishing tool of the present invention is the polishing tool described in (1) to (7) showing a preferable aspect of the polishing apparatus.

なお、本明細書において、「環状超音波振動子」には、環状に並べて配置された複数個の超音波振動子片の集合体も含まれる。同様に、「環状の砥石」には、環状に並べて配置された複数個の砥石片の集合体も含まれる。   In the present specification, the “annular ultrasonic transducer” includes an aggregate of a plurality of ultrasonic transducer pieces arranged in a ring. Similarly, the “annular grindstone” includes an aggregate of a plurality of grindstone pieces arranged in a ring shape.

本発明の研磨具の砥石保持部材には、環状超音波振動子の固定位置と回転軸接続部との間の位置に、空気相を含む環状空気相含有帯域を多重に形成してなる環状空気相含有領域が設けられている。この研磨具の環状超音波振動子から発生される超音波振動は、環状空気相含有領域に含まれる複数の空気相が形成する超音波反射面の何れかによって反射されて実質的に回転軸に漏れることはなく、このため環状の砥石に極めて効率良く付与される。従って、本発明の研磨具においては、環状の砥石が大きな振幅で超音波振動し、環状の砥石と研磨対象物との摩擦抵抗が低減されるため、不要な機械振動の発生が効果的に抑制される。このため、本発明の研磨具を用いることにより、研磨対象物を極めて高い精度で研磨することができる。   In the grindstone holding member of the polishing tool of the present invention, an annular air formed by multiply forming an annular air phase containing zone including an air phase at a position between the fixed position of the annular ultrasonic transducer and the rotating shaft connecting portion. A phase-containing region is provided. The ultrasonic vibration generated from the annular ultrasonic vibrator of this polishing tool is reflected by any of the ultrasonic reflecting surfaces formed by a plurality of air phases included in the annular air phase-containing region, and substantially rotates to the rotation axis. It does not leak and is therefore applied very efficiently to the annular grindstone. Therefore, in the polishing tool of the present invention, the annular grindstone is ultrasonically vibrated with a large amplitude, and the frictional resistance between the annular grindstone and the object to be polished is reduced, so that the occurrence of unnecessary mechanical vibration is effectively suppressed. Is done. For this reason, by using the polishing tool of the present invention, the object to be polished can be polished with extremely high accuracy.

本発明の研磨装置を添付の図面を用いて説明する。図３は、本発明の研磨装置の構成例を示す正面図である。図４は、図３に示す研磨具４０を、研磨具４０に接続する回転軸１３ａを図に記入した切断線II−II線に沿って切断した状態で示す平面図である。そして図５は、図４に記入した切断線III−III線に沿って切断した研磨具４０の拡大断面図である。   The polishing apparatus of the present invention will be described with reference to the accompanying drawings. FIG. 3 is a front view showing a configuration example of the polishing apparatus of the present invention. FIG. 4 is a plan view showing the polishing tool 40 shown in FIG. 3 in a state in which the rotary shaft 13a connected to the polishing tool 40 is cut along the cutting line II-II indicated in the drawing. FIG. 5 is an enlarged cross-sectional view of the polishing tool 40 cut along the cutting line III-III entered in FIG.

図３〜図５に示すように、本発明の研磨装置１０は、上側表面に研磨対象物１１を支持する支持テーブル１２；支持テーブル１２の上方に、支持テーブル１２に対して垂直に配置された回転軸１３ａ；そして、回転軸１３ａの下端部に支持テーブル１２と平行に接続されている、電源１４に電気的に接続する環状超音波振動子３１ａ、３１ｂを固定した砥石保持部材３２と、砥石保持部材３２の周縁部の下端に備えられた環状の砥石３３とを含む研磨具（本発明の研磨具）４０などから構成されている。この研磨装置１０は、研磨具４０の砥石保持部材３２の環状超音波振動子３１ａ、３１ｂの固定位置３４ａと、回転軸１３ａとの接続位置（研磨具４０の回転軸接続部）３４ｂとの間の位置に、環状に配置した非連続の空気相を含む環状空気相含有帯域を二重に形成してなる環状空気相含有領域３６が設けられていて、この環状空気相含有領域３６により、環状超音波振動子３１ａ、３１ｂから発生される超音波振動が砥石保持部材３２の環状空気相含有領域３６よりも回転軸との接続位置３４ｂの側の領域に直線的に伝達されないようにされていることに大きな特徴がある。   As shown in FIGS. 3 to 5, the polishing apparatus 10 of the present invention is disposed perpendicularly to the support table 12 above the support table 12; the support table 12 that supports the polishing object 11 on the upper surface. A rotating shaft 13a; and a grindstone holding member 32, which is connected to the lower end portion of the rotating shaft 13a in parallel with the support table 12 and fixed to the annular ultrasonic transducers 31a and 31b electrically connected to the power source 14, and the grindstone It comprises a polishing tool (a polishing tool of the present invention) 40 including an annular grindstone 33 provided at the lower end of the peripheral edge of the holding member 32. This polishing apparatus 10 is provided between a fixed position 34a of the annular ultrasonic transducers 31a and 31b of the grindstone holding member 32 of the polishing tool 40 and a connection position (rotation shaft connecting portion of the polishing tool 40) 34b to the rotation shaft 13a. Is provided with an annular air phase-containing region 36 formed by doubly forming an annular air phase-containing zone including a discontinuous air phase arranged in an annular shape. The ultrasonic vibration generated from the ultrasonic vibrators 31a and 31b is not transmitted linearly to the region closer to the connection position 34b with the rotation shaft than the annular air phase containing region 36 of the grindstone holding member 32. There is a big feature.

支持テーブル１２は、基台１５に設置された回転駆動装置（例、モータ）１６の回転軸１６ａに支持されて回転可能とされている。支持テーブルは、例えば、その表面に沿って直線的に移動（往復移動）させることもできる。   The support table 12 is supported by a rotation shaft 16 a of a rotation drive device (for example, a motor) 16 installed on the base 15 and is rotatable. The support table can be moved linearly (reciprocating) along the surface thereof, for example.

支持テーブル１２の上方には、研磨対象物１１の上面に研削液（代表例、水）を供給するパイプ１８ａを備えた研削液供給装置１８が配置されている。研削液供給装置１８は、基台１５の上面に立設された支柱２１の上部に支持固定されている。この支柱２１は、図３の紙面において支持テーブル１２の後方側に配置されている。なお、研削液は、公知の方法に従って、前記砥石保持部材の環状の砥石よりも内周側の位置に形成した透孔を介して研磨対象物の上面に供給することもできる。   Above the support table 12, a grinding fluid supply device 18 including a pipe 18 a that supplies a grinding fluid (typical example, water) to the upper surface of the polishing object 11 is disposed. The grinding fluid supply device 18 is supported and fixed to the upper portion of the support column 21 that is erected on the upper surface of the base 15. This support | pillar 21 is arrange | positioned at the back side of the support table 12 in the paper surface of FIG. The grinding liquid can also be supplied to the upper surface of the object to be polished through a through hole formed at a position on the inner peripheral side of the annular grindstone of the grindstone holding member according to a known method.

研磨具４０は、回転駆動装置１３の回転軸１３ａに接続されている。回転駆動装置１３は、送りねじ２３のナット２３ｂに支持固定されている。この送りねじ２３のねじ軸２３ａは、基台１５の上面に設置された回転駆動装置１７に接続されている。この回転駆動装置１７を駆動してねじ軸２３ａを回転させることにより、ナット２３ｂに支持された回転駆動装置１３を研磨具４０と共に昇降させることができる。また、前記のナット２３ｂは、基台１５の上面にねじ軸２３ａと平行に立設された支柱２２に備えられたベアリング２４に固定されている。このため、前記のようにねじ軸２３ａを回転させる際に、ナット２３ｂ、回転駆動装置１３及び研磨具４０が、ねじ軸２３ａを中心に回転することはない。   The polishing tool 40 is connected to the rotation shaft 13 a of the rotation drive device 13. The rotation drive device 13 is supported and fixed to the nut 23 b of the feed screw 23. A screw shaft 23 a of the feed screw 23 is connected to a rotation drive device 17 installed on the upper surface of the base 15. By driving the rotary drive device 17 and rotating the screw shaft 23a, the rotary drive device 13 supported by the nut 23b can be lifted and lowered together with the polishing tool 40. Further, the nut 23 b is fixed to a bearing 24 provided on a support column 22 erected on the upper surface of the base 15 in parallel with the screw shaft 23 a. For this reason, when rotating the screw shaft 23a as described above, the nut 23b, the rotation driving device 13, and the polishing tool 40 do not rotate around the screw shaft 23a.

研磨具４０は、環状超音波振動子３１ａ、３１ｂを備える砥石保持部材３２、そして砥石保持部材３２の周縁部の下端に備えられた環状の砥石３３などから構成されている。   The polishing tool 40 includes a grindstone holding member 32 having annular ultrasonic transducers 31a and 31b, an annular grindstone 33 provided at the lower end of the peripheral edge of the grindstone holding member 32, and the like.

環状の砥石３３としては、例えば、ダイヤモンド砥粒に代表される砥粒を、金属ボンドやレジンボンドで結着して環状に形成した砥石を用いることができる。通常、砥粒の平均粒径は０．１乃至５０μｍの範囲内に設定される。   As the annular grindstone 33, for example, a grindstone formed in an annular shape by binding abrasive grains represented by diamond abrasive grains with metal bonds or resin bonds can be used. Usually, the average grain size of the abrasive grains is set in the range of 0.1 to 50 μm.

なお、環状の砥石には、環状に並べて配置された複数個（例えば、２乃至５０個）の砥石片の集合体も含まれる。このように、環状の砥石を複数個の砥石片から構成すると、環状の砥石（特にサイズの大きいもの）の作製が容易になる。また、砥石への超音波振動の付与により、あるいは砥石と研磨対象物との摩擦により砥石内部に生じる応力が低減されるため、砥石の破損（例、クラックの発生）を防止することができる。   The annular grindstone includes an aggregate of a plurality of (for example, 2 to 50) grindstone pieces arranged in a ring. Thus, when an annular grindstone is composed of a plurality of grindstone pieces, it becomes easy to produce an annular grindstone (particularly a large one). Further, since the stress generated in the grindstone is reduced by applying ultrasonic vibration to the grindstone or by friction between the grindstone and the object to be polished, breakage of the grindstone (eg, generation of cracks) can be prevented.

砥石保持部材３２は、例えば、アルミニウム、青銅、ステンレススチール、もしくはアルミニウム合金（例、ジュラルミン）に代表される金属材料、あるいはセラミック材料などの超音波振動の伝達性に優れる材料から形成される。   The grindstone holding member 32 is made of, for example, a metal material typified by aluminum, bronze, stainless steel, or an aluminum alloy (eg, duralumin), or a material having excellent ultrasonic vibration transmission properties such as a ceramic material.

砥石保持部材３２は、回転軸１３ａの周囲に嵌め合わされてボルト３８ａにより固定されたスリーブ３２ａ、スリーブ３２ａの下面にボルト３８ｂにより固定された円板状の保持部材本体３２ｂ、そして保持部材本体３２ｂの下面に仮接着剤（例、ホットメルト接着剤）により固定され、更にボルト３８ｃにより締め付け固定された砥石保持リング３２ｃから構成されている。   The grindstone holding member 32 is fitted around the rotary shaft 13a and fixed by a bolt 38a, a disc-shaped holding member main body 32b fixed by a bolt 38b on the lower surface of the sleeve 32a, and a holding member main body 32b. It is composed of a grindstone holding ring 32c that is fixed to the lower surface by a temporary adhesive (eg, hot-melt adhesive) and further fastened and fixed by a bolt 38c.

スリーブ３２ａ、保持部材本体３２ｂ及び砥石保持リング３２ｃは、一体に形成することもできる。但し、スリーブ３２ａと保持部材本体３２ｂとを分離可能に構成すると、保持部材本体３２ｂの厚みを小さな値に設定することにより、環状超音波振動子３１ａ、３１ｂから発生される超音波振動により保持部材本体３２ｂを砥石３３と共に大きな振幅で超音波振動させることができる。その一方で、スリーブ３２ａの軸方向の長さを大きな値に設定することにより、保持部材本体３２ｂをスリーブ３２ａを介して回転軸１３ａに安定に支持固定することができる。また、保持部材本体３２ｂと砥石保持リング３２ｃとを分離可能に構成すると、後に説明するロータリートランス２５の電力受容ユニット２５ｂと、環状超音波振動子３１ａ、３１ｂとの電気配線２８ｂ、２８ｃを取り外すことなく、使用により摩耗した砥石３３を砥石保持リング３２ｃと共に取り外して別の新しいものに簡単に交換することができる。   The sleeve 32a, the holding member main body 32b, and the grindstone holding ring 32c can be integrally formed. However, when the sleeve 32a and the holding member main body 32b are configured to be separable, the holding member is set by the ultrasonic vibration generated from the annular ultrasonic transducers 31a and 31b by setting the thickness of the holding member main body 32b to a small value. The main body 32b can be ultrasonically vibrated with the grindstone 33 with a large amplitude. On the other hand, by setting the axial length of the sleeve 32a to a large value, the holding member main body 32b can be stably supported and fixed to the rotary shaft 13a via the sleeve 32a. Further, when the holding member main body 32b and the grindstone holding ring 32c are configured to be separable, the power receiving unit 25b of the rotary transformer 25 described later and the electric wirings 28b and 28c between the annular ultrasonic transducers 31a and 31b are removed. In addition, the grindstone 33 worn by use can be removed together with the grindstone holding ring 32c and easily replaced with another new one.

砥石保持部材３２の形状は、研磨具を安定に回転させるため、回転軸を中心として対称な形状に設定することが好ましい。例えば、砥石保持部材の保持部材本体の平面形状は、円形に限らず、多角形に設定することもできる。   The shape of the grindstone holding member 32 is preferably set to a symmetrical shape around the rotation axis in order to stably rotate the polishing tool. For example, the planar shape of the holding member main body of the grindstone holding member is not limited to a circle but can be set to a polygon.

砥石保持部材３２の環状超音波振動子３１ａ、３１ｂの固定位置３４ａと、回転軸１３ａとの接続位置３４ｂとの間の位置には、環状に配置した非連続の空気相を含む環状空気相含有帯域を二重に形成してなる環状空気相含有領域３６が設けられている。この環状空気相含有領域３６により、環状超音波振動子３１ａ、３１ｂから発生される超音波振動が砥石保持部材３２の環状空気相含有領域３６よりも回転軸との接続位置３４ｂの側（研磨具４０の場合には内周側）の領域に直線的に伝達されないようにされている。この環状空気相含有領域３６の機能については、後に詳しく説明する。   In the position between the fixed position 34a of the annular ultrasonic transducers 31a and 31b of the grindstone holding member 32 and the connection position 34b with the rotary shaft 13a, an annular air phase containing a discontinuous air phase arranged in an annular shape is contained. An annular air phase-containing region 36 formed by doubling the zone is provided. Due to the annular air phase-containing region 36, the ultrasonic vibration generated from the annular ultrasonic transducers 31 a and 31 b is closer to the rotating shaft than the annular air phase-containing region 36 of the grindstone holding member 32 (the polishing tool). In the case of 40, it is prevented from being transmitted linearly to the area on the inner circumference side. The function of the annular air phase-containing region 36 will be described in detail later.

なお、前記の「砥石保持部材の環状超音波振動子の固定位置」とは、研磨具４０のように砥石保持部材３２の環状超音波振動子３１ａ、３１ｂの内周側に環状空気相含有領域３６が形成されている場合には、砥石保持部材３２の環状超音波振動子３１ａ、３１ｂの内縁に対応する位置を意味する。但し、前記の「環状超音波振動子の内縁」とは、砥石保持部材３２に互いに内径の異なる二以上の環状超音波振動子が固定されている場合には、最も小さな内径を持つ環状超音波振動子の内縁を意味する。また、前記の「砥石保持部材の回転軸との接続位置」とは、砥石保持部材３２の回転軸１３ａに接触する位置を意味する。   The “fixed position of the annular ultrasonic transducer of the grindstone holding member” refers to an annular air phase-containing region on the inner peripheral side of the annular ultrasonic transducers 31 a and 31 b of the grindstone holding member 32 as in the polishing tool 40. When 36 is formed, it means a position corresponding to the inner edges of the annular ultrasonic transducers 31a and 31b of the grindstone holding member 32. However, the “inner edge of the annular ultrasonic transducer” refers to an annular ultrasonic transducer having the smallest inner diameter when two or more annular ultrasonic transducers having different inner diameters are fixed to the grindstone holding member 32. It means the inner edge of the vibrator. The “connection position of the grindstone holding member with the rotation shaft” means a position where the grindstone holding member 32 contacts the rotation shaft 13a.

環状超音波振動子３１ａ、３１ｂの各々としては、例えば、環状の圧電体４１と、圧電体４１の上面及び下面の各々に付設された一対の電極層４２とから構成される環状の圧電振動子が用いられている。   As each of the annular ultrasonic transducers 31 a and 31 b, for example, an annular piezoelectric transducer including an annular piezoelectric body 41 and a pair of electrode layers 42 attached to each of the upper and lower surfaces of the piezoelectric body 41. Is used.

圧電体４１の材料の代表例としては、ジルコン酸チタン酸鉛系の圧電セラミック材料が挙げられる。電極層４２の材料の例としては、銀やリン青銅などの金属材料が挙げられる。   A typical example of the material of the piezoelectric body 41 is a lead zirconate titanate-based piezoelectric ceramic material. Examples of the material of the electrode layer 42 include metal materials such as silver and phosphor bronze.

環状超音波振動子３１ａ、３１ｂの各々の圧電体４１は、例えば、その厚み方向に分極処理される。研磨具４０の場合には、例えば、環状超音波振動子３１ａの圧電体４１は垂直且つ上向きに、そして環状超音波振動子３１ｂの圧電体４１は垂直且つ下向きに分極処理されている。   For example, each piezoelectric body 41 of the annular ultrasonic transducers 31a and 31b is polarized in the thickness direction thereof. In the case of the polishing tool 40, for example, the piezoelectric body 41 of the annular ultrasonic transducer 31a is polarized vertically and upward, and the piezoelectric body 41 of the annular ultrasonic transducer 31b is polarized vertically and downward.

環状超音波振動子３１ａ、３１ｂの各々は、例えば、エポキシ樹脂を用いて砥石保持部材３２に固定される。このエポキシ樹脂により、環状超音波振動子３１ａ、３１ｂの各々と、砥石保持部材３２とが互いに電気的に絶縁される。また、環状超音波振動子３１ａ、３１ｂの各々の表面に、例えば、絶縁性の塗料を塗布することにより、環状超音波振動子の一対の電極層が、研磨の際に用いる研削液（代表例、水）を介して互いに電気的に短絡することを防止することができる。   Each of the annular ultrasonic transducers 31a and 31b is fixed to the grindstone holding member 32 using, for example, an epoxy resin. By this epoxy resin, each of the annular ultrasonic transducers 31a and 31b and the grindstone holding member 32 are electrically insulated from each other. Further, for example, an insulating paint is applied to the surface of each of the annular ultrasonic transducers 31a and 31b, so that a pair of electrode layers of the annular ultrasonic transducer is used for grinding (a typical example) , Water) can be prevented from being electrically short-circuited with each other.

なお、環状超音波振動子には、環状に並べて配置された複数個（例えば、２乃至３０個）の超音波振動子片の集合体も含まれる。このように、環状超音波振動子を、複数個の超音波振動子片から構成すると、環状の砥石の直径が大きい場合、すなわち砥石保持部材のサイズが大きい場合に、これに対応する大きな直径の環状超音波振動子を、複数個の超音波振動子片を用いて容易に構成することができる。   The annular ultrasonic transducer includes an aggregate of a plurality of ultrasonic transducer pieces (for example, 2 to 30) arranged in a ring. As described above, when the annular ultrasonic vibrator is composed of a plurality of ultrasonic vibrator pieces, when the diameter of the annular grindstone is large, that is, when the size of the grindstone holding member is large, the corresponding large diameter is obtained. The annular ultrasonic transducer can be easily configured using a plurality of ultrasonic transducer pieces.

また、環状超音波振動子の個数に特に制限はないが、実用的には、１乃至４個の範囲内にあることが好ましい。環状超音波振動子の個数が多いほど、環状の砥石を大きな振幅にて超音波振動させることができる。しかしながら、環状超音波振動子の個数が多すぎると、砥石保持部材に環状超音波振動子を付設し、各々の環状超音波振動子を電源に電気的に接続する作業に手間がかかる。   Further, the number of annular ultrasonic transducers is not particularly limited, but practically, it is preferably in the range of 1 to 4. As the number of annular ultrasonic transducers increases, the annular grindstone can be ultrasonically vibrated with a large amplitude. However, if the number of the annular ultrasonic transducers is too large, it takes time to attach the annular ultrasonic transducer to the grindstone holding member and electrically connect each annular ultrasonic transducer to the power source.

研磨装置１０が備えるロータリートランス２５は、研磨対象物１１を研磨する際に研磨具４０と共に回転する環状超音波振動子３１ａ、３１ｂの各々に、電源１４の電気エネルギーを供給するために用いられている。   The rotary transformer 25 provided in the polishing apparatus 10 is used to supply electric energy of the power source 14 to each of the annular ultrasonic transducers 31a and 31b that rotate together with the polishing tool 40 when the polishing object 11 is polished. Yes.

ロータリートランス２５は、電力供給ユニット２５ａと電力受容ユニット２５ｂとが互いに僅かに間隔をあけて近接配置された構成を有している。電力供給ユニット２５ａ及び電力受容ユニット２５ｂは、それぞれ円環状の形状に設定されている。前記の電力供給ユニット２５ａは、回転駆動装置１３の底部に固定されている。そして電力受容ユニット２５ｂは、砥石保持部材３２の頂部に固定されている。   The rotary transformer 25 has a configuration in which a power supply unit 25a and a power receiving unit 25b are arranged close to each other with a slight space therebetween. The power supply unit 25a and the power receiving unit 25b are each set in an annular shape. The power supply unit 25 a is fixed to the bottom of the rotary drive device 13. The power receiving unit 25 b is fixed to the top of the grindstone holding member 32.

電力供給ユニット２５ａは、円環状のステータコア２６ａ及びステータコイル２７ａから構成されている。そして電力受容ユニット２５ｂは、円環状のロータコア２６ｂ及びロータコイル２７ｂから構成されている。ステータコア２６ａ及びロータコア２６ｂの各々は、例えば、フェライトなどの磁性材料から形成され、その周方向に沿って円環状の溝が形成されている。ステータコイル２７ａ及びロータコイル２７ｂの各々は、ステータコア２６ａ及びロータコア２６ｂの各々に形成された円環状の溝に沿って導線をコイル状に巻いたものである。   The power supply unit 25a includes an annular stator core 26a and a stator coil 27a. The power receiving unit 25b includes an annular rotor core 26b and a rotor coil 27b. Each of the stator core 26a and the rotor core 26b is formed of, for example, a magnetic material such as ferrite, and an annular groove is formed along the circumferential direction thereof. Each of the stator coil 27a and the rotor coil 27b is obtained by winding a conducting wire in a coil shape along an annular groove formed in each of the stator core 26a and the rotor core 26b.

ステータコイル２７ａには、電気配線２８ａを介して電源１４が電気的に接続されている。そしてロータコイル２７ｂには、電気配線２８ｂ、２８ｃの各々を介して環状超音波振動子３１ａ、３１が電気的に接続されている。なお、電気配線２８ｃは、砥石保持部材３２に形成された透孔３２ｄを通って、下側の環状超音波振動子３１ｂに電気的に接続されている。   A power source 14 is electrically connected to the stator coil 27a via an electrical wiring 28a. And the annular ultrasonic transducer | vibrator 31a, 31 is electrically connected to the rotor coil 27b via each of the electrical wiring 28b, 28c. The electrical wiring 28c is electrically connected to the lower annular ultrasonic transducer 31b through a through hole 32d formed in the grindstone holding member 32.

このロータリートランス２５のステータコイル２７ａに、電源１４から発生される電気エネルギーを供給することにより、ステータコイル２７ａとロータコイル２７ｂとが互いに磁気的に結合される。このため、ステータコイル２７ａに供給された電気エネルギーは、ロータコイル２７ｂ（すなわち電力受容ユニット２５ｂ）が回転軸１３ａと共に回転している場合であってもロータコイル２７ｂに伝達する。従って、電源１４から発生される電気エネルギーを、研磨対象物１１を研磨する際に回転軸１３ａと共に回転する研磨具４０の環状超音波振動子３１ａ、３１ｂの各々に付与することができる。   By supplying electric energy generated from the power source 14 to the stator coil 27a of the rotary transformer 25, the stator coil 27a and the rotor coil 27b are magnetically coupled to each other. For this reason, the electric energy supplied to the stator coil 27a is transmitted to the rotor coil 27b even when the rotor coil 27b (that is, the power receiving unit 25b) is rotating together with the rotating shaft 13a. Therefore, electrical energy generated from the power source 14 can be applied to each of the annular ultrasonic transducers 31a and 31b of the polishing tool 40 that rotates together with the rotating shaft 13a when the polishing object 11 is polished.

そして、環状超音波振動子３１ａ、３１ｂの各々に（環状超音波振動子として用いる環状の圧電振動子の各々の電極層に）、電源１４から発生される電気エネルギー（例、交流電圧）を付与することにより発生した超音波振動は、砥石保持部材３２を介して環状の砥石３３に付与される。   Then, electrical energy (eg, AC voltage) generated from the power supply 14 is applied to each of the annular ultrasonic transducers 31a and 31b (to each electrode layer of the annular piezoelectric transducer used as the annular ultrasonic transducer). The ultrasonic vibration generated by doing so is applied to the annular grindstone 33 via the grindstone holding member 32.

前記のロータリートランスに代えて、例えば、スリップリングを用いることもできる。ロータリートランスは、互いに非接触に配置されている電力供給ユニットと電力受容ユニットを介して電気エネルギーを伝達するため、回転軸の回転数が１０００００回転／分程度までは、回転軸と共に回転する研磨具の環状超音波振動子に安定に電力を供給できるという利点を有している。一方、スリップリングは、回転軸の回転数が５０００回転／分程度を超えると、回転する研磨具の環状超音波振動子に安定に電力を供給することが難しくなる。   For example, a slip ring can be used instead of the rotary transformer. Since the rotary transformer transmits electric energy through the power supply unit and the power receiving unit that are arranged in a non-contact manner, the polishing tool rotates together with the rotation shaft until the rotation speed of the rotation shaft reaches about 100,000 rotations / minute. It has the advantage that electric power can be stably supplied to the annular ultrasonic transducer. On the other hand, when the rotational speed of the rotation shaft of the slip ring exceeds about 5000 rotations / minute, it becomes difficult to stably supply power to the annular ultrasonic vibrator of the rotating polishing tool.

研磨装置１０においては、例えば、下記の手順により加工対象物の研磨が行なわれる。   In the polishing apparatus 10, for example, the workpiece is polished by the following procedure.

先ず、研磨対象物１１を、例えば、ホットメルト型接着剤を用いて鋼製の保持具（図示していない）に仮固定する。そして、支持テーブル１２の上面に、前記の研磨対象物１１が仮固定された保持具を、例えば、電磁力を利用して固定する。   First, the polishing object 11 is temporarily fixed to a steel holder (not shown) using, for example, a hot-melt adhesive. And the holder to which the said grinding | polishing target object 11 was temporarily fixed to the upper surface of the support table 12 is fixed using an electromagnetic force, for example.

次に、回転駆動装置１６を作動させ、回転軸１６ａを支持テーブル１２と共に回転させる。そして研削液供給装置１８のパイプ１８ａの先端から研削液を噴出させ、研磨対象物１１の表面に研削液を供給する。その一方で、電源１４から発生される電気エネルギーをロータリートランス２５を介して環状超音波振動子３１ａ、３１ｂの各々に付与する。これにより、環状超音波振動子３１ａ、３１ｂの各々から発生される超音波振動は、砥石保持部材３２を介して環状の砥石３３に付与される。   Next, the rotation drive device 16 is operated to rotate the rotating shaft 16 a together with the support table 12. Then, the grinding liquid is ejected from the tip of the pipe 18 a of the grinding liquid supply device 18 to supply the grinding liquid to the surface of the object 11 to be polished. On the other hand, electric energy generated from the power source 14 is applied to each of the annular ultrasonic transducers 31 a and 31 b via the rotary transformer 25. Thereby, the ultrasonic vibration generated from each of the annular ultrasonic transducers 31 a and 31 b is applied to the annular grindstone 33 via the grindstone holding member 32.

続いて、駆動装置１３を作動させ、回転軸１３ａを研磨具４０と共に回転させ、次いで駆動装置１７を作動させ、研磨具４０を次第に下降させる。このような操作により、超音波振動が付与された環状の砥石３３の外周面の下端近傍の部位が、研磨対象物１１の側面の上端近傍の部位に接触し、そして研磨対象物１１の表面（上面）の全体が研磨（研削）される。そして、研磨具４０を更に下降させながら、所定の厚みになるまで研磨対象物１１の研磨を続ける。   Subsequently, the driving device 13 is operated, the rotating shaft 13a is rotated together with the polishing tool 40, then the driving device 17 is operated, and the polishing tool 40 is gradually lowered. By such an operation, a portion near the lower end of the outer peripheral surface of the annular grindstone 33 to which ultrasonic vibration is applied comes into contact with a portion near the upper end of the side surface of the polishing object 11 and the surface of the polishing object 11 ( The entire upper surface is polished (ground). Then, while the polishing tool 40 is further lowered, the polishing of the object 11 is continued until a predetermined thickness is reached.

次に、研磨具４０の砥石保持部材３２が備える環状空気相含有領域３６の機能について説明する。   Next, the function of the annular air phase-containing region 36 provided in the grindstone holding member 32 of the polishing tool 40 will be described.

研磨具４０の環状空気相含有領域３６は、砥石保持部材３２の内周側に備えられた合計で四個の空気相３５ａを含む環状空気相含有帯域３６ａと、外周側に備えられた合計で四個の空気相３５ｂを含む環状空気相含有帯域３６ｂとが二重に配置された構成を有している。   The annular air phase containing region 36 of the polishing tool 40 includes an annular air phase containing zone 36a including a total of four air phases 35a provided on the inner peripheral side of the grindstone holding member 32, and a total provided on the outer peripheral side. The annular air phase-containing zone 36b including the four air phases 35b is doubled.

一般に、異なる二つの物質が互いに接触して界面を形成している場合に、各々の物質に固有の音響インピーダンスの値が互いに大きく異なると、一方の物質中を他方の物質に向かって伝わる音波の大部分は前記界面にて反射され、他方の物質には殆ど伝わらないことが知られている。前記の音響インピーダンスは、物質の密度と、この物質中での音速との積により定まる。そして、固体と気体とでは、両者の密度の値、すなわち音響インピーダンスの値が互いに大きく異なるため、例えば、固体中を伝わる音波の大部分は、固体と気体との界面にて反射されて気体中には殆ど伝わらない。   In general, when two different materials are in contact with each other to form an interface, if the acoustic impedance values inherent in each material are significantly different from each other, the sound waves transmitted through one material toward the other It is known that most of the light is reflected at the interface and hardly transmitted to the other material. The acoustic impedance is determined by the product of the density of the substance and the speed of sound in the substance. Since the density value of the solid and the gas, that is, the value of the acoustic impedance are greatly different from each other, for example, most of the sound waves transmitted through the solid are reflected at the interface between the solid and the gas and are in the gas. Is hardly transmitted.

従って、前記のように砥石保持部材３２に空気相３５ａ、３５ｂが備えられていると、この砥石保持部材（固体）３２と空気相（気体）３５ａ、３５ｂの各々との界面からなる超音波（振動）反射面が形成される。   Therefore, when the grindstone holding member 32 is provided with the air phases 35a and 35b as described above, the ultrasonic wave (the ultrasonic wave (the solid) 32 and the air phase (gas) 35a and 35b are formed at the interfaces (each). (Vibration) reflective surface is formed.

そして研磨具４０では、前記のように各々空気相を含む環状空気相含有帯域３６ａ、３６ｂから構成される環状空気相含有領域３６により、環状超音波振動子３１ａ、３１ｂから発生される超音波振動が砥石保持部材３２の環状空気相含有領域３６よりも回転軸との接続位置３４ｂの側（研磨具４０の場合には内周側）の領域に直線的に伝達されないようにされている。   In the polishing tool 40, the ultrasonic vibrations generated from the annular ultrasonic transducers 31a and 31b by the annular air phase-containing region 36 composed of the annular air phase-containing zones 36a and 36b each containing an air phase as described above. Is not transmitted linearly to the region on the side of the connection position 34b with the rotating shaft (in the case of the polishing tool 40, the inner peripheral side) rather than the annular air phase containing region 36 of the grindstone holding member 32.

すなわち、砥石保持部材３２の内周側にて互いに隣接する空気相３５ａ、３５ａにより形成される超音波反射面の間の位置の外周側に、空気相３５ｂにより形成される超音波反射面を配置し、そして外周側にて互いに隣接する空気相３５ｂ、３５ｂにより形成される超音波反射面の間の位置の内周側に、空気相３５ａにより形成される超音波反射面を配置することにより、前記の超音波振動の伝達を防止している。   That is, the ultrasonic reflecting surface formed by the air phase 35b is arranged on the outer peripheral side of the position between the ultrasonic reflecting surfaces formed by the air phases 35a and 35a adjacent to each other on the inner peripheral side of the grindstone holding member 32. And by arranging the ultrasonic reflection surface formed by the air phase 35a on the inner peripheral side of the position between the ultrasonic reflection surfaces formed by the air phases 35b and 35b adjacent to each other on the outer peripheral side, Transmission of the ultrasonic vibration is prevented.

このため、環状超音波振動子３１ａ、３１ｂから発生される超音波振動は、前記の環状空気相含有領域３６に到達すると、空気相３５ａ、３５ｂにより形成される超音波反射面にて反射され、砥石保持部材３２の外周側、そして環状の砥石３３へと伝わり、この環状の砥石３３を超音波振動させるために有効に用いられる。このため、環状超音波振動子３１ａ、３１ｂから発生される超音波振動により、環状の砥石３３を大きな振幅にて超音波振動させることができる。前記のように、環状の砥石３３が大きな振幅にて超音波振動すると、環状の砥石３３と研磨対象物１１との摩擦抵抗が低減し、不要な機械振動の発生が十分に抑制される。このため、研磨具４０を用いることにより、研磨対象物を高い精度で研磨することができる。   For this reason, when the ultrasonic vibration generated from the annular ultrasonic transducers 31a and 31b reaches the annular air phase-containing region 36, it is reflected by the ultrasonic reflection surface formed by the air phases 35a and 35b. It is transmitted to the outer peripheral side of the grindstone holding member 32 and the annular grindstone 33, and is effectively used to ultrasonically vibrate the annular grindstone 33. For this reason, the annular grindstone 33 can be ultrasonically vibrated with a large amplitude by the ultrasonic vibration generated from the annular ultrasonic transducers 31a and 31b. As described above, when the annular grindstone 33 is ultrasonically vibrated with a large amplitude, the frictional resistance between the annular grindstone 33 and the object to be polished 11 is reduced, and generation of unnecessary mechanical vibration is sufficiently suppressed. For this reason, the polishing object 40 can be polished with high accuracy by using the polishing tool 40.

図４に示すように、環状空気相含有領域３６は、砥石保持部材３２に連結領域３７ａを介して断続的に形成された内周側の複数（例えば、四個）の貫通溝４３ａと、連結領域３７ｂを介して断続的に形成された外周側の複数（例えば、四個）の貫通溝４３ｂとから構成されていて、内周側の連結領域３７ａは、外周側の貫通溝４３ｂに接するように配置され、かつ外周側の連結領域３７ｂは、内周側の貫通溝４３ａに接するように配置されていることが好ましい。これにより、環状超音波振動子３１ａ、３１ｂから発生される超音波振動の殆どが、空気相３５ａ、３５ｂにより形成される超音波反射面の何れかによって反射され、環状の砥石３３を超音波振動させるために極めて有効に用いられる。   As shown in FIG. 4, the annular air phase-containing region 36 is connected to a plurality of (for example, four) through grooves 43 a on the inner peripheral side that are intermittently formed in the grindstone holding member 32 via the connection region 37 a. A plurality of (for example, four) through-grooves 43b on the outer peripheral side that are intermittently formed via the region 37b, and the inner peripheral connection region 37a is in contact with the outer-side through-groove 43b. The outer peripheral connection region 37b is preferably disposed so as to be in contact with the inner peripheral through-groove 43a. As a result, most of the ultrasonic vibrations generated from the annular ultrasonic transducers 31a and 31b are reflected by any of the ultrasonic reflecting surfaces formed by the air phases 35a and 35b, and the ultrasonic grindstone 33 is ultrasonically vibrated. It is used very effectively to

前記の貫通溝４３ａ、４３ｂの各々は、例えば、放電加工あるいは切削加工などを利用して容易に形成することができる。   Each of the through grooves 43a and 43b can be easily formed by using, for example, electric discharge machining or cutting.

研磨具４０のように、砥石保持部材３２の環状超音波振動子３１ａ、３１ｂの内周側に環状空気相含有領域３６を設ける場合には、超音波反射面を形成する空気相３５ａ、３５ｂが、砥石保持部材３２の環状超音波振動子３１ａ、３１ｂの固定位置３４ａに形成される円筒面（砥石保持部材を環状超音波振動子の内縁に沿って切断した断面が形成する円筒面）の面積の８５乃至１００％（特に、９０乃至１００％）の範囲内の領域に、前記円筒の直径方向に重ねて配置されていることが好ましい。   When the annular air phase-containing region 36 is provided on the inner peripheral side of the annular ultrasonic transducers 31a and 31b of the grindstone holding member 32 as in the polishing tool 40, the air phases 35a and 35b forming the ultrasonic reflection surfaces are provided. The area of the cylindrical surface (cylindrical surface formed by a cross section of the grinding wheel holding member cut along the inner edge of the annular ultrasonic transducer) formed at the fixed position 34a of the annular ultrasonic transducers 31a, 31b of the grinding wheel holding member 32 It is preferable to be disposed so as to overlap in the diameter direction of the cylinder in a region within a range of 85 to 100% (in particular, 90 to 100%).

なお、前記の図１及び図２に示す特許文献１の研磨具１のように、研磨具１を回転軸に接続するためにボルトが挿入されるねじ孔７は、ボルトが挿入されることでねじ孔７の内部の空気相が排除されて超音波反射面を形成しないため、本発明の研磨具の空気相を構成しない。   In addition, like the polishing tool 1 of Patent Document 1 shown in FIGS. 1 and 2, the screw hole 7 into which the bolt is inserted in order to connect the polishing tool 1 to the rotating shaft is formed by inserting the bolt. Since the air phase inside the screw hole 7 is eliminated and no ultrasonic reflection surface is formed, the air phase of the polishing tool of the present invention is not configured.

図６は、本発明の研磨具の別の構成例を示す平面図である。そして図７は、図６に記入した切断線IV−IV線に沿って切断した研磨具６０の拡大断面図である。   FIG. 6 is a plan view showing another configuration example of the polishing tool of the present invention. FIG. 7 is an enlarged cross-sectional view of the polishing tool 60 cut along the cutting line IV-IV entered in FIG.

図６及び図７に示す研磨具６０の構成は、環状空気相含有領域６６が、砥石保持部材６２の上側から上下方向に延びた非貫通の円環状上側溝７３ａと、砥石保持部材６２の下側から上下方向に延びた非貫通の円環状下側溝７３ｂとから構成されていて、上側溝７３ａと下側溝７３ｂとの深さの合計が砥石保持部材６２の上下方向の厚みよりも大きいこと以外は図４に示す研磨具４０と同様である。   The polishing tool 60 shown in FIGS. 6 and 7 has a structure in which the annular air phase-containing region 66 has a non-penetrating annular upper groove 73a extending in the vertical direction from the upper side of the grindstone holding member 62 and the lower part of the grindstone holding member 62. Except that the total depth of the upper groove 73a and the lower groove 73b is greater than the thickness of the grindstone holding member 62 in the vertical direction. Is the same as the polishing tool 40 shown in FIG.

この研磨具６０においては、前記の上側溝７３ａの内部の空気相（環状に形成した連続の空気相）６５ａと連結領域６７ａとにより環状空気相含有帯域６６ａが構成され、そして下側溝７３ｂの内部の空気相６５ｂと連結領域６７ｂとにより環状空気相含有帯域６６ｂが構成されている。そして、前記の環状空気相含有帯域６６ａと環状空気相含有帯域６６ｂとにより、環状空気相含有領域６６が構成されている。   In this polishing tool 60, an annular air phase-containing zone 66a is constituted by the air phase (a continuous air phase formed in an annular shape) 65a inside the upper groove 73a and the connecting region 67a, and the inside of the lower groove 73b. The air phase 65b and the connection region 67b constitute an annular air phase containing zone 66b. An annular air phase-containing region 66 is configured by the annular air phase-containing zone 66a and the annular air phase-containing zone 66b.

研磨具６０の空気相６５ａ、６５ｂ及び連結領域６７ａ、６７ｂは、ぞれぞれ連続した環状の形状にある。このため、研磨具６０は、図４の研磨具４０と比較して、超音波振動を付与することにより環状の砥石３３を周方向において均一に超音波振動させることができるため、研磨対象物を研磨する精度が高いという利点を有している。   The air phases 65a and 65b and the connecting regions 67a and 67b of the polishing tool 60 are in a continuous annular shape. Therefore, the polishing tool 60 can uniformly ultrasonically vibrate the annular grindstone 33 in the circumferential direction by applying ultrasonic vibration as compared with the polishing tool 40 of FIG. This has the advantage of high accuracy of polishing.

前記の上側溝７３ａと下側溝７３ｂとの深さの合計は、砥石保持部材６２の上下方向の厚みよりも大きく、前記厚みの１．５倍（特に、１．１倍）以下であることが好ましい。上側溝７３ａと下側溝７３ｂとの深さの合計が、砥石保持部材６２の厚みの１．５倍を超えると、砥石保持部材６２の剛性が低下して、この砥石保持部材６２に環状の砥石３３が不安定に支持されるため、研磨対象物を研磨する精度が低下する傾向にある。   The total depth of the upper groove 73a and the lower groove 73b is larger than the thickness in the vertical direction of the grindstone holding member 62, and may be 1.5 times (particularly 1.1 times) or less of the thickness. preferable. When the sum of the depths of the upper groove 73a and the lower groove 73b exceeds 1.5 times the thickness of the grindstone holding member 62, the rigidity of the grindstone holding member 62 decreases, and the grindstone holding ring 62 has an annular grindstone. Since 33 is supported in an unstable manner, the accuracy of polishing the object to be polished tends to decrease.

図８は、本発明の研磨具の更に別の構成例を示す平面図である。そして図９は、図８に記入した切断線Ｖ−Ｖ線に沿って切断した研磨具８０の拡大断面図である。   FIG. 8 is a plan view showing still another configuration example of the polishing tool of the present invention. FIG. 9 is an enlarged cross-sectional view of the polishing tool 80 cut along the cutting line VV entered in FIG.

図８及び図９に示す研磨具８０の構成は、環状空気相含有領域８６が、砥石保持部材８２の内部で、かつ環状超音波振動子３１ａ、３１ｂの内周側に備えられた多孔質環状部材９３から構成されていること以外は図４の研磨具４０と同様である。   The configuration of the polishing tool 80 shown in FIGS. 8 and 9 is a porous annular structure in which an annular air phase-containing region 86 is provided inside the grindstone holding member 82 and on the inner peripheral side of the annular ultrasonic transducers 31a and 31b. The polishing tool 40 is the same as the polishing tool 40 of FIG.

この研磨具８０の環状空気相含有領域８６は、多孔質環状部材９３の内部にて環状部材９３の周方向に沿って環状に配置している気泡（空気相）８５を含む環状空気相含有帯域が、環状空気相含有領域８６の径方向に多重に配置された構成を有している。   The annular air phase-containing region 86 of the polishing tool 80 includes an annular air phase-containing zone including bubbles (air phases) 85 that are annularly arranged along the circumferential direction of the annular member 93 inside the porous annular member 93. However, it has the structure arrange | positioned in multiple in the radial direction of the cyclic | annular air phase containing area | region 86. FIG.

研磨具８０の環状空気相含有領域８６の空気相は、多孔質環状部材９３の内部に均一に分散配置された多数の気泡８５から構成されている。このため、研磨具８０は、図４の研磨具４０と比較して、超音波振動を付与することにより環状の砥石３３を周方向において均一に超音波振動させることができ、また砥石保持部材８２の剛性も高いため、研磨対象物を研磨する精度が高いという利点を有している。   The air phase in the annular air phase-containing region 86 of the polishing tool 80 is composed of a large number of bubbles 85 that are uniformly distributed inside the porous annular member 93. Therefore, the polishing tool 80 can uniformly ultrasonically vibrate the annular grindstone 33 in the circumferential direction by applying ultrasonic vibration as compared with the polishing tool 40 of FIG. 4, and the grindstone holding member 82. Because of its high rigidity, it has an advantage of high accuracy in polishing the object to be polished.

砥石保持部材８２の保持部材本体８２ｂは、保持部材本体８２ｂの多孔質環状部材９３よりも外周側の部分と内周側の部分とを予め別々に作製しておき、両者の間に多孔質環状部材９３を配置して、これらを、例えば、接着あるいは溶接することにより容易に作製することができる。   In the holding member main body 82b of the grindstone holding member 82, a part on the outer peripheral side and a part on the inner peripheral side of the porous annular member 93 of the holding member main body 82b are separately prepared in advance, and a porous annular member is formed between the two. The members 93 can be arranged, and these can be easily produced by, for example, bonding or welding.

多孔質環状部材９３は、例えば、多孔質金属材料から形成される。多孔質環状部材９３は、例えば、青銅、ステンレススチール、ニッケル、あるいはチタンなどの金属粉末（もしくは金属繊維）を圧縮成形して焼結することにより作製することができる。多孔質環状部材９３の気泡８５の直径は、その製造方法にもよるが、一般に１０ｎｍ〜数ｍｍの範囲内にある。   The porous annular member 93 is made of, for example, a porous metal material. The porous annular member 93 can be produced, for example, by compressing and sintering metal powder (or metal fiber) such as bronze, stainless steel, nickel, or titanium. The diameter of the bubbles 85 of the porous annular member 93 is generally in the range of 10 nm to several mm, although it depends on the manufacturing method.

多孔質環状部材９３の密度（かさ密度）は、保持部材本体８２ｂの多孔質環状部材９３よりも外周側の部分の密度の５〜７５％の範囲内の値に設定することが好ましい。多孔質環状部材９３の密度を、前記の保持部材本体８２ｂの外周側の部分の密度の５％未満の値に設定すると、砥石保持部材８２の剛性が低下して、この砥石保持部材８２に環状の砥石３３が不安定に支持されるため、研磨対象物を研磨する精度が低下する傾向にある。その一方で、多孔質環状部材９３の密度を、前記の保持部材本体８２ｂの外周側の部分の密度の７５％を超える値に設定すると、環状部材９３に含まれる気泡（空気相）８５により形成される超音波反射面で反射される超音波振動の量が少なくなる。   The density (bulk density) of the porous annular member 93 is preferably set to a value within a range of 5 to 75% of the density of the portion on the outer peripheral side of the porous annular member 93 of the holding member main body 82b. If the density of the porous annular member 93 is set to a value of less than 5% of the density of the outer peripheral side portion of the holding member main body 82b, the rigidity of the grindstone holding member 82 decreases, and the grindstone holding member 82 is annular. Since the whetstone 33 is supported in an unstable manner, the accuracy of polishing the object to be polished tends to decrease. On the other hand, when the density of the porous annular member 93 is set to a value exceeding 75% of the density of the outer peripheral side portion of the holding member main body 82b, the porous annular member 93 is formed by the bubbles (air phase) 85 included in the annular member 93. The amount of ultrasonic vibration reflected by the ultrasonic reflection surface is reduced.

図１０は、本発明の研磨具の更に別の構成例を示す平面図である。そして図１１は、図１０に記入した切断線VI−VI線に沿って切断した研磨具１００の拡大断面図である。   FIG. 10 is a plan view showing still another configuration example of the polishing tool of the present invention. FIG. 11 is an enlarged cross-sectional view of the polishing tool 100 cut along the cutting line VI-VI entered in FIG.

図１０及び図１１に示す研磨具１００の構成は、環状空気相含有領域１０６が、砥石保持部材１０２に連結領域１０７ａを介して断続的に形成された内周側の複数の貫通孔１１３ａと、連結領域１０７ｂを介して断続的に形成された外周側の複数の貫通孔１１３ｂとから構成されていて、内周側の連結領域１０７ａは、外周側の貫通孔１１３ｂに接するように配置され、かつ外周側の連結領域１０７ｂは、内周側の貫通孔１１３ａに接するように配置されていること以外は図４の研磨具４０と同様である。   The configuration of the polishing tool 100 shown in FIGS. 10 and 11 includes a plurality of through holes 113a on the inner peripheral side in which the annular air phase-containing region 106 is intermittently formed in the grindstone holding member 102 via the connection region 107a, A plurality of outer peripheral side through-holes 113b formed intermittently via the connection region 107b, the inner peripheral side connection region 107a is disposed in contact with the outer peripheral side through-hole 113b, and The outer peripheral connection region 107b is the same as the polishing tool 40 of FIG. 4 except that the outer peripheral connection region 107b is disposed so as to contact the inner peripheral through hole 113a.

この研磨具１００においては、前記の複数の貫通孔１１３ａの内部の空気相１０５ａと複数の連結領域１０７ａとにより環状空気相含有帯域１０６ａが構成され、そして複数の貫通孔１１３ｂの内部の空気相１０５ｂと複数の連結領域１０７ｂとにより環状空気相含有帯域１０６ｂが構成されている。そして、前記の環状空気相含有帯域１０６ａと環状空気相含有帯域１０６ｂとにより、環状空気相含有領域１０６が構成されている。   In the polishing tool 100, the air phase 105a inside the plurality of through holes 113a and the plurality of connection regions 107a form an annular air phase containing zone 106a, and the air phase 105b inside the plurality of through holes 113b. And the plurality of connection regions 107b constitute an annular air phase-containing zone 106b. The annular air phase-containing region 106 is configured by the annular air phase-containing zone 106a and the annular air phase-containing zone 106b.

研磨具１００は、図４の研磨具４０と比較して、環状空気相含有領域１０６の貫通孔１１３ａ、１１３ｂを、例えば、ドリルを用いた孔あけ加工により簡単に形成することができるという利点を有している。   Compared with the polishing tool 40 of FIG. 4, the polishing tool 100 has an advantage that the through holes 113a and 113b of the annular air phase-containing region 106 can be easily formed by, for example, drilling using a drill. Have.

また、図１１に示すように、研磨具１００に接続される回転軸１３ａの周囲に二個（あるいは二個以上）のロータリートランス１１５ａ、１１５ｂを配置し、これらのロータリートランス１１５ａ、１１５ｂ各々を用いて、環状超音波振動子３１ａ、３１ｂの各々に電気エネルギーを供給することができる。なお、これらのロータリートランス１１５ａ、１１５ｂは、両者の間に配置されたパーマロイ製の筒体１１６により互いに磁気的に遮蔽されている。   Further, as shown in FIG. 11, two (or two or more) rotary transformers 115a and 115b are arranged around a rotating shaft 13a connected to the polishing tool 100, and each of these rotary transformers 115a and 115b is used. Thus, electric energy can be supplied to each of the annular ultrasonic transducers 31a and 31b. The rotary transformers 115a and 115b are magnetically shielded from each other by a permalloy cylinder 116 disposed between the rotary transformers 115a and 115b.

そして、例えば、ロータリートランス１１５ａ、１１５ｂを用いて、環状超音波振動子３１ａ、３１ｂの各々に互いに同相の交流電圧（例、正弦波電圧）を付与することにより、環状超音波振動子３１ａ、３１ｂの各々を、その直径方向に互いに同相にて超音波振動させることができる。これにより、環状超音波振動子３１ａがその直径が拡大するように変位する際には、これと同時に環状超音波振動子３１ｂもまたその直径が拡大するように変位するため、砥石保持部材１０２の外周縁部は外周側に変位する。そして環状超音波振動子３１ａがその直径が縮小するように変位する際には、これと同時に環状超音波振動子３１ｂもまたその直径が縮小するように変位するため、砥石保持部材１０２の外周縁部は内周側に変位する。その結果、砥石保持部材１０２の外周縁部は、環状の砥石３３と共に図１１に記入した矢印１１９ａが示す方向（研磨対象物の表面に対して平行な方向）に振動する。   Then, for example, by using the rotary transformers 115a and 115b, the annular ultrasonic transducers 31a and 31b are each provided with an AC voltage (eg, sine wave voltage) having the same phase to the annular ultrasonic transducers 31a and 31b. Can be ultrasonically vibrated in phase with each other in the diameter direction. As a result, when the annular ultrasonic transducer 31a is displaced so that its diameter is enlarged, the annular ultrasonic transducer 31b is also displaced so that its diameter is enlarged simultaneously. The outer peripheral edge is displaced to the outer peripheral side. When the annular ultrasonic transducer 31a is displaced so that its diameter is reduced, simultaneously with this, the annular ultrasonic transducer 31b is also displaced so that its diameter is reduced. The part is displaced to the inner peripheral side. As a result, the outer peripheral edge portion of the grindstone holding member 102 vibrates in the direction indicated by the arrow 119a written in FIG. 11 (direction parallel to the surface of the object to be polished) together with the annular grindstone 33.

環状の砥石３３を研磨対象物の表面に平行な方向に振動させることにより、研磨対象物の表面を高い精度にて研磨することができる。   By vibrating the annular grindstone 33 in a direction parallel to the surface of the object to be polished, the surface of the object to be polished can be polished with high accuracy.

その一方で、例えば、ロータリートランス１１５ａ、１１５ｂを用いて、環状超音波振動子３１ａ、３１ｂの各々に互いに逆相の交流電圧（例、正弦波交流電圧）を付与することにより、環状超音波振動子３１ａ、３１ｂの各々を、その直径方向に互いに逆相にて超音波振動させることができる。これにより、環状超音波振動子３１ａがその直径が拡大するように変位する際には、これと同時に環状超音波振動子３１ｂがその直径が縮小するように変位するため、砥石保持部材１０２は湾曲し、その外周縁部は下側に変位する。そして環状超音波振動子３１ａがその直径が縮小するように変位する際には、これと同時に環状超音波振動子３１ｂがその直径が拡大するように変位するため、砥石保持部材１０２は湾曲し、その外周縁部は上側に変位する。その結果、砥石保持部材１０２の外周縁部は、環状の砥石３３と共に図１１に記入した矢印１１９ｂが示す方向（研磨対象物の表面に対して概ね垂直な方向）に振動する。   On the other hand, for example, by using the rotary transformers 115a and 115b, the annular ultrasonic transducers 31a and 31b are each provided with an alternating voltage (for example, a sinusoidal alternating voltage) having a phase opposite to each other, thereby causing the annular ultrasonic vibration. Each of the children 31a and 31b can be ultrasonically vibrated in a phase opposite to each other in the diameter direction. As a result, when the annular ultrasonic transducer 31a is displaced so that its diameter is increased, the annular ultrasonic transducer 31b is simultaneously displaced so that its diameter is reduced, so that the grindstone holding member 102 is curved. The outer peripheral edge portion is displaced downward. When the annular ultrasonic transducer 31a is displaced so that its diameter is reduced, the annular ultrasonic transducer 31b is simultaneously displaced so that its diameter is enlarged, so that the grindstone holding member 102 is curved, The outer peripheral edge portion is displaced upward. As a result, the outer peripheral edge portion of the grindstone holding member 102 vibrates in the direction indicated by the arrow 119b shown in FIG. 11 (a direction substantially perpendicular to the surface of the object to be polished) together with the annular grindstone 33.

環状の砥石３３を研磨対象物の表面に概ね垂直な方向に振動させることにより、研磨対象物の表面を高い速度（短い時間）で研磨することができる。   By vibrating the annular grindstone 33 in a direction substantially perpendicular to the surface of the object to be polished, the surface of the object to be polished can be polished at a high speed (short time).

このように、ロータリートランス１１５ａ、１１５ｂを備える研磨装置を用いることにより、研磨対象物を荒加工する際には、超音波振動子３１ａ、３１ｂの各々に互いに逆相の交流電圧を付与して研磨対象物の表面を高い速度で研磨し、そして研磨対象物を仕上げ加工する際には、環状超音波振動子３１ａ、３１ｂの各々に互いに同相の交流電圧を付与して研磨対象物の表面を高い精度で研磨することができる。すなわち、このような研磨装置を用いることにより、研磨対象物を短時間で粗加工し、次いで高い精度で仕上げ加工することができる。   As described above, by using a polishing apparatus including the rotary transformers 115a and 115b, when roughing an object to be polished, an AC voltage having a phase opposite to each other is applied to each of the ultrasonic transducers 31a and 31b. When the surface of the object is polished at a high speed and the object to be polished is finished, an AC voltage having the same phase is applied to each of the annular ultrasonic transducers 31a and 31b to increase the surface of the object to be polished. It can be polished with accuracy. That is, by using such a polishing apparatus, the object to be polished can be roughly processed in a short time and then finished with high accuracy.

また、前記のように環状超音波振動子を複数個の超音波振動子片から構成し、これらの超音波振動子片に、複数個（例えば、二個）のロータリートランスを介して正弦波交流電圧及び余弦波交流電圧を適宜付与することにより、環状の砥石に超音波振動の進行波を励起することができる。環状超音波振動子により超音波振動の進行波を励起する方法は、前記の特許文献１に詳しく記載されている。また、環状超音波振動子により超音波振動の進行波を励起する方法としては、環状超音波振動子により超音波モータのステータに超音波振動の進行波を励起する公知の方法を適用することもできる。   Further, as described above, the annular ultrasonic transducer is composed of a plurality of ultrasonic transducer pieces, and sinusoidal alternating current is supplied to these ultrasonic transducer pieces via a plurality of (for example, two) rotary transformers. By appropriately applying the voltage and the cosine wave AC voltage, it is possible to excite the traveling wave of ultrasonic vibration in the annular grindstone. A method for exciting a traveling wave of ultrasonic vibration by an annular ultrasonic vibrator is described in detail in Patent Document 1 described above. In addition, as a method of exciting the traveling wave of the ultrasonic vibration by the annular ultrasonic vibrator, a known method of exciting the traveling wave of the ultrasonic vibration to the stator of the ultrasonic motor by the annular ultrasonic vibrator may be applied. it can.

図１２は、本発明の研磨具の更に別の構成例を示す斜視図である。そして図１３は、図１２に記入した切断線VII−VII線に沿って切断した研磨具１２０の拡大断面図である。   FIG. 12 is a perspective view showing still another configuration example of the polishing tool of the present invention. FIG. 13 is an enlarged sectional view of the polishing tool 120 cut along the cutting line VII-VII written in FIG.

図１２及び図１３に示す研磨具１２０の構成は、砥石保持部材１２２が円板部材１２２ａと、円板部材の１２２ａの周縁から下方に延びた円筒状部材１２２ｂとを含み、環状空気相含有領域１２６が、円筒状部材１２２ｂに連結領域１２７ａを介して断続的に形成された上側の複数の貫通溝１３３ａと、連結領域１２７ｂを介して断続的に形成された下側の複数の貫通溝１３３ｂとから構成されていて、上側の連結領域１２７ａは、下側の貫通溝１３３ｂに接するように配置され、かつ下側の連結領域１２７ｂは上側の貫通溝１３３ａに接するように配置されていること、そして前記円筒状部材１２２ｂの下面に環状超音波振動子３１が固定されていること以外は図４に示す研磨具４０と同様である。   12 and 13, the grindstone holding member 122 includes a disc member 122a and a cylindrical member 122b extending downward from the peripheral edge of the disc member 122a. 126, a plurality of upper through-grooves 133a intermittently formed in the cylindrical member 122b via the connection region 127a, and a plurality of lower through-grooves 133b formed intermittently through the connection region 127b. The upper connecting region 127a is disposed so as to contact the lower through groove 133b, and the lower connecting region 127b is disposed so as to be in contact with the upper through groove 133a, and The polishing tool 40 is the same as the polishing tool 40 shown in FIG. 4 except that the annular ultrasonic transducer 31 is fixed to the lower surface of the cylindrical member 122b.

この研磨具１２０においては、前記の上側の複数の貫通溝１３３ａの内部の空気相１２５ａと複数の連結領域１２７ａとにより環状空気相含有帯域１２６ａが構成され、そして前記の下側の複数の貫通溝１３３ｂの内部の空気相１２５ｂと複数の連結領域１２７ｂとにより環状空気相含有帯域１２６ｂが構成されている。そして、前記の環状空気相含有帯域１２６ａと環状空気相含有帯域１２６ｂとにより、環状空気相含有領域１２６が構成されている。   In the polishing tool 120, an annular air phase-containing zone 126a is constituted by the air phase 125a and the plurality of connection regions 127a inside the plurality of upper through grooves 133a, and the plurality of lower through grooves. An annular air phase-containing zone 126b is configured by the air phase 125b inside the 133b and the plurality of connection regions 127b. The annular air phase-containing region 126 is configured by the annular air phase-containing zone 126a and the annular air phase-containing zone 126b.

そして、環状超音波振動子３１から発生される超音波振動の殆どは、前記の環状空気相含有領域１２６に到達すると、空気相１２５ａ、１２５ｂにより形成される超音波反射面の何れかによって反射され、砥石保持部材１２２の下側、そして環状の砥石３３へと伝わり、この環状の砥石３３を超音波振動させるために極めて有効に用いられる。このため、環状超音波振動子３１から発生される超音波振動により、環状の砥石３３を大きな振幅にて超音波振動させることができる。このため、研磨具１２０を用いることにより、研磨対象物を高い精度で研磨することができる。   Then, most of the ultrasonic vibration generated from the annular ultrasonic transducer 31 is reflected by one of the ultrasonic reflection surfaces formed by the air phases 125a and 125b when reaching the annular air phase-containing region 126. It is transmitted to the lower side of the grindstone holding member 122 and to the annular grindstone 33 and is used extremely effectively for ultrasonic vibration of the annular grindstone 33. For this reason, the annular grindstone 33 can be ultrasonically vibrated with a large amplitude by the ultrasonic vibration generated from the annular ultrasonic transducer 31. For this reason, the polishing object 120 can be polished with high accuracy by using the polishing tool 120.

研磨具１２０は、円筒状部材１２２ｂの壁体の厚みを小さな値に設定することにより、環状の砥石３３を研磨対象物の表面に平行な方向に大きな振幅にて超音波振動させることができるという利点を有している。   By setting the thickness of the wall of the cylindrical member 122b to a small value, the polishing tool 120 can vibrate the annular grindstone 33 ultrasonically in a direction parallel to the surface of the object to be polished with a large amplitude. Has advantages.

なお、研磨具１２０のように、砥石保持部材１２２の環状超音波振動子３１の上側に環状空気相含有領域１２６が形成されている場合には、前記の「砥石保持部材の環状超音波振動子の固定位置」とは、砥石保持部材１２２の環状超音波振動子３１の上端に対応する位置を意味する。   When the annular air phase-containing region 126 is formed on the upper side of the annular ultrasonic transducer 31 of the grindstone holding member 122 as in the polishing tool 120, the above-mentioned “annular ultrasonic transducer of the grindstone holding member” The “fixed position” means a position corresponding to the upper end of the annular ultrasonic transducer 31 of the grindstone holding member 122.

また、このような場合には、超音波反射面を形成する空気相１２５ａ、１２５ｂが、砥石保持部材１２２の環状超音波振動子３１の固定位置４４ａに形成される円環面（砥石保持部材を環状超音波振動子の上面に沿って切断した断面が形成する円環面）の面積の８５乃至１００％（特に、９０乃至１００％）の範囲内の領域に、円筒状部材１２２ｂの軸方向に重ねて配置されていることが好ましい。   Further, in such a case, the air phases 125a and 125b forming the ultrasonic reflecting surface are formed on the annular surface (the grindstone holding member of the grindstone holding member 122) formed at the fixed position 44a of the annular ultrasonic transducer 31. In the axial direction of the cylindrical member 122b, the region is in the range of 85 to 100% (especially 90 to 100%) of the area of the annular surface formed by the section cut along the upper surface of the annular ultrasonic transducer. It is preferable that they are arranged in a stacked manner.

図１４は、本発明の研磨具の更に別の構成例を示す一部切り欠き斜視図である。そして図１５は、図１４に記入した切断線VIII−VIII線に沿って切断した研磨具１４０の拡大断面図である。   FIG. 14 is a partially cutaway perspective view showing still another configuration example of the polishing tool of the present invention. FIG. 15 is an enlarged cross-sectional view of the polishing tool 140 cut along the cutting line VIII-VIII entered in FIG.

図１４及び図１５に示す研磨具１４０の構成は、砥石保持部材１４２が円板部材１４２ａと、円板部材１４２ａの周縁から下方に延びた円筒状部材１４２ｂとを含み、環状空気相含有領域１４６が、円筒状部材１４２ｂの外側から厚み方向に延びた非貫通の円環状外側溝１５３ａと、円筒状部材１４２ｂの内側から厚み方向に延びた非貫通の円環状内側溝１５３ｂとから構成されていて、外側溝１５３ａと内側溝１５３ｂとの深さの合計が円筒状部材１４２ｂの厚みよりも大きくされていること、そして前記円筒状部材１４２ｂの下面に環状超音波振動子３１が固定されていること以外は以外は図４の研磨具４０と同様である。   14 and 15, the grindstone holding member 142 includes a disc member 142a and a cylindrical member 142b extending downward from the peripheral edge of the disc member 142a. Is composed of a non-penetrating annular outer groove 153a extending in the thickness direction from the outside of the cylindrical member 142b and a non-penetrating annular inner groove 153b extending in the thickness direction from the inside of the cylindrical member 142b. The total depth of the outer groove 153a and the inner groove 153b is larger than the thickness of the cylindrical member 142b, and the annular ultrasonic transducer 31 is fixed to the lower surface of the cylindrical member 142b. Other than the above is the same as the polishing tool 40 of FIG.

この研磨具１４０においては、前記の外側溝１５３ａの内部の空気相１４５ａと連結領域１４７ａとにより環状空気相含有帯域１４６ａが構成され、そして内側溝１５３ｂの内部の空気相１４５ｂと連結領域１４７ｂとにより環状空気相含有帯域１４６ｂが構成されている。そして、環状空気相含有帯域１４６ａと環状空気相含有帯域１４６ｂとにより、環状空気相含有領域１４６が構成されている。   In this polishing tool 140, an annular air phase-containing zone 146a is constituted by the air phase 145a and the connection region 147a inside the outer groove 153a, and the air phase 145b and the connection region 147b inside the inner groove 153b. An annular air phase-containing zone 146b is configured. An annular air phase-containing region 146 is configured by the annular air phase-containing zone 146a and the annular air phase-containing zone 146b.

図１４の研磨具１４０は、前記の図６の研磨具６０と同様に、超音波振動を付与することにより環状の砥石３３を周方向において均一に超音波振動させることができるため、研磨対象物を研磨する精度が高いという利点を有している。   Since the polishing tool 140 of FIG. 14 can ultrasonically vibrate the annular grindstone 33 uniformly in the circumferential direction by applying ultrasonic vibration similarly to the polishing tool 60 of FIG. It has the advantage that the precision which grind | polishes is high.

前記の外側溝１５３ａと内側溝１５３ｂとの深さの合計は、円筒状部材１４２ｂの壁体の厚みよりも大きく、前記厚みの１．５倍（特に、１．１倍）以下であることが好ましい。外側溝１５３ａと内側溝１５３ｂとの深さの合計が、円筒状部材１４２ｂの壁体の厚みの１．５倍を超えると、砥石保持部材１４２の剛性が低下して、この砥石保持部材１４２に環状の砥石３３が不安定に支持されるため、研磨対象物を研磨する精度が低下する。   The total depth of the outer groove 153a and the inner groove 153b is larger than the thickness of the wall of the cylindrical member 142b, and may be 1.5 times (particularly 1.1 times) or less of the thickness. preferable. When the total depth of the outer groove 153a and the inner groove 153b exceeds 1.5 times the thickness of the wall of the cylindrical member 142b, the rigidity of the grindstone holding member 142 decreases, and the grindstone holding member 142 Since the annular grindstone 33 is unstablely supported, the accuracy of polishing the object to be polished is lowered.

図１６は、本発明の研磨具の更に別の構成例を示す斜視図である。そして図１７は、図１６に記入した切断線IX−IX線に沿って切断した研磨具１６０の拡大断面図である。   FIG. 16 is a perspective view showing still another configuration example of the polishing tool of the present invention. 17 is an enlarged cross-sectional view of the polishing tool 160 cut along the cutting line IX-IX entered in FIG.

図１６及び図１７に示す研磨具１６０の構成は、砥石保持部材１６２が円板部材１６２ａと、該円板部材１６２ａの周縁から下方に延びた円筒状部材１６２ｂとを含み、環状空気相含有領域１６６が、円筒状部材１６２ｂの内部で、かつ環状超音波振動子３１の上側に備えられた多孔質環状部材１７３から構成されていること、そして前記円筒状部材１６２ｂの下面に環状超音波振動子３１が固定されていること以外は以外は図４の研磨具４０と同様である。   The configuration of the polishing tool 160 shown in FIGS. 16 and 17 includes an annular air phase-containing region in which a grindstone holding member 162 includes a disk member 162a and a cylindrical member 162b extending downward from the periphery of the disk member 162a. 166 is composed of a porous annular member 173 provided inside the cylindrical member 162b and above the annular ultrasonic transducer 31, and an annular ultrasonic transducer is formed on the lower surface of the cylindrical member 162b. Except that 31 is fixed, it is the same as the polishing tool 40 of FIG.

この研磨具１６０の環状空気相含有領域１６６は、多孔質環状部材１７３の内部にて環状部材１７３の周方向に沿って環状に配置している気泡（空気相）１６５を含む環状空気相含有帯域が、環状空気相含有領域１６６の軸方向に多重に配置された構成を有している。   The annular air phase-containing region 166 of the polishing tool 160 includes an annular air phase-containing zone including bubbles (air phase) 165 arranged annularly along the circumferential direction of the annular member 173 inside the porous annular member 173. However, it has the structure arrange | positioned in multiple in the axial direction of the cyclic | annular air phase containing area | region 166. FIG.

図１６の研磨具１６０は、前記の図８の研磨具８０と同様に、超音波振動を付与することにより環状の砥石３３を周方向において均一に超音波振動させることができ、また砥石保持部材１６２の剛性も高いため、研磨対象物を研磨する精度が高いという利点を有している。   16, the polishing tool 160 of FIG. 16 can uniformly ultrasonically vibrate the annular grindstone 33 in the circumferential direction by applying ultrasonic vibration, similarly to the polishing tool 80 of FIG. Since the rigidity of 162 is also high, there is an advantage that the accuracy of polishing the object to be polished is high.

従来の研磨装置が備える研磨具の構成を示す平面図である。It is a top view which shows the structure of the grinding | polishing tool with which the conventional grinding | polishing apparatus is provided. 図１に記入した切断線Ｉ−Ｉ線に沿って切断した研磨具１の断面図である。It is sectional drawing of the grinding | polishing tool 1 cut | disconnected along the cutting-line II line entered in FIG. 本発明の研磨装置の構成例を示す正面図である。It is a front view which shows the structural example of the grinding | polishing apparatus of this invention. 図３に示す研磨具４０を、研磨具４０に接続する回転軸１３ａを図に記入した切断線II−II線に沿って切断した状態で示す平面図である。It is a top view which shows the grinding | polishing tool 40 shown in FIG. 3 in the state which cut | disconnected the rotating shaft 13a connected to the grinding | polishing tool 40 along the cutting line II-II line drawn in the figure. 図４に記入した切断線III−III線に沿って切断した研磨具４０の拡大断面図である。It is an expanded sectional view of the polishing tool 40 cut | disconnected along the cutting line III-III line entered in FIG. 本発明の研磨具の別の構成例を示す平面図である。It is a top view which shows another structural example of the polishing tool of this invention. 図６に記入した切断線IV−IV線に沿って切断した研磨具６０の拡大断面図である。It is an expanded sectional view of the grinding | polishing tool 60 cut | disconnected along the cutting line IV-IV line entered in FIG. 本発明の研磨具の更に別の構成例を示す平面図である。It is a top view which shows another structural example of the polishing tool of this invention. 図８に記入した切断線Ｖ−Ｖ線に沿って切断した研磨具８０の拡大断面図である。It is an expanded sectional view of the grinding | polishing tool 80 cut | disconnected along the cutting line VV entered in FIG. 本発明の研磨具の更に別の構成例を示す平面図である。It is a top view which shows another structural example of the polishing tool of this invention. 図１０に記入した切断線VI−VI線に沿って切断した研磨具１００の拡大断面図である。It is an expanded sectional view of the polishing tool 100 cut | disconnected along the cutting line VI-VI line entered in FIG. 本発明の研磨具の更に別の構成例を示す斜視図である。It is a perspective view which shows another structural example of the polishing tool of this invention. 図１２に記入した切断線VII−VII線に沿って切断した研磨具１２０の拡大断面図である。It is an expanded sectional view of the grinding | polishing tool 120 cut | disconnected along the cutting line VII-VII line entered in FIG. 本発明の研磨具の更に別の構成例を示す一部切り欠き斜視図である。It is a partially notched perspective view which shows another structural example of the polishing tool of this invention. 図１４に記入した切断線VIII−VIII線に沿って切断した研磨具１４０の拡大断面図である。It is an expanded sectional view of the grinding | polishing tool 140 cut | disconnected along the cutting line VIII-VIII line entered in FIG. 本発明の研磨具の更に別の構成例を示す斜視図である。It is a perspective view which shows another structural example of the polishing tool of this invention. 図１６に記入した切断線IX−IX線に沿って切断した研磨具１６０の拡大断面図である。It is an expanded sectional view of the grinding | polishing tool 160 cut | disconnected along the cutting line IX-IX line entered in FIG.

符号の説明Explanation of symbols

１ 研磨具
２ 接続板
３ 連結手段
３ａ 連結部
３ｂ スペース部
４ 環状弾性体
５ 超音波振動子
６ 砥石
７ ねじ孔
１０ 研磨装置
１１ 研磨対象物
１２ 支持テーブル
１３ 回転駆動装置
１３ａ 回転軸
１４ 電源
１５ 基台
１６、１７ 回転駆動装置
１６ａ 回転軸
１８ 研削液供給装置
１８ａ パイプ
２１、２２ 支柱
２３ 送りねじ
２３ａ ねじ軸
２３ｂ ナット
２４ ベアリング
２５ ロータリートランス
２５ａ 電力供給ユニット
２５ｂ 電力受容ユニット
２６ａ ステータコア
２６ｂ ロータコア
２７ａ ステータコイル
２７ｂ ロータコイル
２８ａ、２８ｂ、２８ｃ 電気配線
３１、３１ａ、３１ｂ 環状超音波振動子
３２ 砥石保持部材
３２ａ スリーブ
３２ｂ 保持部材本体
３２ｃ 砥石保持リング
３２ｄ 透孔
３３ 環状の砥石
３４ａ 環状超音波振動子の固定位置
３４ｂ 回転軸との接続位置
３５ａ、３５ｂ 空気相
３６ 環状空気相含有領域
３６ａ、３６ｂ 環状空気相含有帯域
３７ａ、３７ｂ 連結領域
３８ａ、３８ｂ、３８ｃ ボルト
４０ 研磨具
４１ 圧電体
４２ 電極層
４３ａ、４３ｂ 貫通溝
４４ａ 環状超音波振動子の固定位置
６０ 研磨具
６２ 砥石保持部材
６６ 環状空気相含有領域
６５ａ、６５ｂ 空気相
６６ａ、６６ｂ 環状空気相含有帯域
６７ａ、６７ｂ 連結領域
７３ａ 円環状上側溝
７３ｂ 円環状下側溝
８０ 研磨具
８２ 砥石保持部材
８２ｂ 保持部材本体
８５ 気泡（空気相）
８６ 環状空気相含有領域
９３ 多孔質環状部材
１００ 研磨具
１０２ 砥石保持部材
１０５ａ、１０５ｂ 空気相
１０６ 環状空気相含有領域
１０６ａ、１０６ｂ 環状空気相含有帯域
１０７ａ、１０７ｂ 連結領域
１１３ａ、１１３ｂ 貫通孔
１１５ａ、１１５ｂ ロータリートランス
１１６ 筒体
１１９ａ、１１９ｂ 環状の砥石３３の振動方向を示す矢印
１２０ 研磨具
１２２ 砥石保持部材
１２２ａ 円板部材
１２２ｂ 円筒状部材
１２５ａ、１２５ｂ 空気相
１２６ 環状空気相含有領域
１２６ａ、１２６ｂ 環状空気相含有帯域
１２７ａ、１２７ｂ 連結領域
１３３ａ、１３３ｂ 貫通溝
１４０ 研磨具
１４２ 砥石保持部材
１４２ａ 円板部材
１４２ｂ 円筒状部材
１４５ａ、１４５ｂ 空気相
１４６ 環状空気相含有領域
１４６ａ、１４６ｂ 環状空気相含有帯域
１４７ａ、１４７ｂ 連結領域
１５３ａ 円環状外側溝
１５３ｂ 円環状内側溝
１６０ 研磨具
１６２ 砥石保持部材
１６２ａ 円板部材
１６２ｂ 円筒状部材
１６５ 気泡（空気相）
１６６ 環状空気相含有領域
１７３ 多孔質環状部材DESCRIPTION OF SYMBOLS 1 Polishing tool 2 Connection board 3 Connection means 3a Connection part 3b Space part 4 Annular elastic body 5 Ultrasonic vibrator 6 Grinding wheel 7 Screw hole 10 Polishing apparatus 11 Polishing object 12 Support table 13 Rotation drive apparatus 13a Rotating shaft 14 Power supply 15 Base Tables 16 and 17 Rotation drive device 16a Rotating shaft 18 Grinding fluid supply device 18a Pipes 21 and 22 Support column 23 Feed screw 23a Screw shaft 23b Nut 24 Bearing 25 Rotary transformer 25a Power supply unit 25b Power receiving unit 26a Stator core 26b Rotor core 27a Stator coil 27b Rotor coils 28a, 28b, 28c Electric wiring 31, 31a, 31b Annular ultrasonic transducer 32 Grindstone holding member 32a Sleeve 32b Holding member body 32c Grindstone holding ring 32d Through hole 33 Annular grindstone 34a Fixed position 34b of annular ultrasonic transducer Connection positions 35a, 35b with the rotating shaft Air phase 36 Annular air phase containing regions 36a, 36b Annular air phase containing zones 37a, 37b Connection regions 38a, 38b, 38c Bolt 40 Polishing tool 41 Piezoelectric body 42 Electrode layers 43a, 43b Through grooves 44a Fixed position 60 of the annular ultrasonic transducer 60 Polishing tool 62 Grinding stone holding member 66 Annular air phase containing regions 65a, 65b An air phase 66a, 66b Annular air phase containing zones 67a, 67b Annular upper groove 73b Annular lower groove 80 Abrasive tool 82 Whetstone holding member 82b Holding member main body 85 Air bubbles (air phase)
86 Annular air phase-containing region 93 Porous annular member 100 Polishing tool 102 Grinding stone holding member 105a, 105b Air phase 106 Annular air phase-containing region 106a, 106b Annular air phase-containing zone 107a, 107b Connecting region 113a, 113b Through hole 115a, 115b Rotary transformer 116 Cylindrical body 119a, 119b Arrow 120 indicating vibration direction of annular grindstone 33 Polishing tool 122 Grinding stone holding member 122a Disk member 122b Cylindrical members 125a, 125b Air phase 126 Annular air phase containing regions 126a, 126b Annular air phase Containing zone 127a, 127b Connection region 133a, 133b Through groove 140 Polishing tool 142 Grinding wheel holding member 142a Disk member 142b Cylindrical member 145a, 145b Air phase 146 Annular air phase containing region 146a, 146b Annular air phase containing zone 147a, 147b Connection region 153a Annular outer groove 153b Annular inner groove 160 Polishing tool 162 Grinding wheel holding member 162a Disk member 162b Cylindrical member 165 Bubble (air phase)
166 annular air phase containing region 173 porous annular member

Claims (17)

上側表面に研磨対象物を支持する支持テーブル；支持テーブルの上方に、支持テーブルに対して垂直に配置された回転軸；そして、回転軸の下端部に支持テーブルと平行に接続されている、電源に電気的に接続する環状超音波振動子を固定した砥石保持部材と該砥石保持部材の周縁部の下端に備えられた環状の砥石とを含む研磨具から構成された研磨装置であって、該研磨具の砥石保持部材の環状超音波振動子の固定位置と回転軸との接続位置との間の位置に、環状に形成もしくは配置した連続もしくは非連続の空気相を含む環状空気相含有帯域を多重に形成してなる環状空気相含有領域が設けられていて、この環状空気相含有領域により、環状超音波振動子から発生される超音波振動が砥石保持部材の環状空気相含有領域よりも回転軸との接続位置の側の領域に直線的に伝達されないようにされていることを特徴とする研磨装置。   A support table for supporting an object to be polished on the upper surface; a rotary shaft disposed above the support table and perpendicular to the support table; and a power source connected to the lower end of the rotary shaft in parallel with the support table A polishing apparatus comprising a polishing tool including a grindstone holding member to which an annular ultrasonic vibrator that is electrically connected to the wheel is fixed, and an annular grindstone provided at a lower end of a peripheral edge of the grindstone holding member, An annular air phase-containing zone including a continuous or non-continuous air phase formed or arranged in an annular shape at a position between the fixed position of the annular ultrasonic vibrator of the grindstone holding member of the polishing tool and the connection position of the rotating shaft. Multiple annular air phase containing regions are provided, and this annular air phase containing region causes the ultrasonic vibration generated from the annular ultrasonic transducer to rotate more than the annular air phase containing region of the grindstone holding member. With shaft Polishing apparatus characterized by being prevented from being linearly transmitted to the region of the side of the connection position. 環状空気相含有領域が、砥石保持部材に連結領域を介して断続的に形成された内周側の複数の貫通溝と連結領域を介して断続的に形成された外周側の複数の貫通溝とから構成されていて、内周側の連結領域は、外周側の貫通溝に接するように配置され、かつ外周側の連結領域は、内周側の貫通溝に接するように配置されている請求項１に記載の研磨装置。   The annular air phase-containing region has a plurality of inner peripheral side through grooves formed intermittently on the grindstone holding member via the connection region, and a plurality of outer peripheral side through grooves formed intermittently through the connection region The inner peripheral side connection region is disposed so as to contact the outer peripheral side through groove, and the outer peripheral side connection region is disposed so as to be in contact with the inner peripheral side through groove. 2. The polishing apparatus according to 1. 環状空気相含有領域が、砥石保持部材に連結領域を介して断続的に形成された内周側の複数の貫通孔と連結領域を介して断続的に形成された外周側の複数の貫通孔とから構成されていて、内周側の連結領域は、外周側の貫通孔に接するように配置され、かつ外周側の連結領域は、内周側の貫通孔に接するように配置されている請求項１に記載の研磨装置。   The annular air phase-containing region has a plurality of inner peripheral side through holes formed intermittently in the grindstone holding member via the connection region, and a plurality of outer peripheral side through holes formed intermittently through the connection region. The inner peripheral connection region is disposed so as to contact the outer peripheral through hole, and the outer peripheral connection region is disposed so as to contact the inner peripheral through hole. 2. The polishing apparatus according to 1. 環状空気相含有領域が、砥石保持部材の上側から上下方向に延びた非貫通の円環状上側溝と砥石保持部材の下側から上下方向に延びた非貫通の円環状下側溝とから構成されていて、上側溝と下側溝との深さの合計が砥石保持部材の上下方向の厚みよりも大きい請求項１に記載の研磨装置。   The annular air phase-containing region is composed of a non-penetrating annular upper groove extending in the vertical direction from the upper side of the grindstone holding member and a non-penetrating annular lower groove extending in the vertical direction from the lower side of the grindstone holding member. The polishing apparatus according to claim 1, wherein the total depth of the upper groove and the lower groove is greater than the vertical thickness of the grindstone holding member. 環状空気相含有領域が、砥石保持部材の内部で、かつ環状超音波振動子の内周側に備えられた多孔質環状部材から構成されている請求項１に記載の研磨装置。   The polishing apparatus according to claim 1, wherein the annular air phase-containing region is configured by a porous annular member provided inside the grindstone holding member and on the inner peripheral side of the annular ultrasonic transducer. 上記砥石保持部材が円板部材と該円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、該円筒状部材に連結領域を介して断続的に形成された上側の複数の貫通溝と連結領域を介して断続的に形成された下側の複数の貫通溝とから構成されていて、上側の連結領域は、下側の貫通溝に接するように配置され、かつ下側の連結領域は、上側の貫通溝に接するように配置されている請求項１に記載の研磨装置。   The grindstone holding member includes a disk member and a cylindrical member extending downward from the periphery of the disk member, and an annular air phase-containing region is intermittently formed in the cylindrical member via a connection region. It is composed of a plurality of upper through-grooves and a plurality of lower through-grooves that are intermittently formed through the connection region, and the upper connection region is disposed so as to be in contact with the lower through-groove, The polishing apparatus according to claim 1, wherein the lower connection region is disposed in contact with the upper through groove. 上記砥石保持部材が円板部材と該円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、該円筒状部材の外側から厚み方向に延びた非貫通の円環状外側溝と円筒状部材の内側から厚み方向に延びた非貫通の円環状内側溝とから構成されていて、外側溝と内側溝との深さの合計が円筒状部材の厚みよりも大きい請求項１に記載の研磨装置。   The grindstone holding member includes a disk member and a cylindrical member extending downward from the periphery of the disk member, and the annular air phase-containing region extends in the thickness direction from the outside of the cylindrical member. It is composed of an annular outer groove and a non-penetrating annular inner groove extending in the thickness direction from the inside of the cylindrical member, and the total depth of the outer groove and the inner groove is larger than the thickness of the cylindrical member. Item 2. The polishing apparatus according to Item 1. 上記砥石保持部材が円板部材と該円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、円筒状部材の内部で、かつ環状超音波振動子の上側に備えられた多孔質環状部材から構成されている請求項１に記載の研磨装置。   The grindstone holding member includes a disc member and a cylindrical member extending downward from the periphery of the disc member, and the annular air phase-containing region is inside the cylindrical member and above the annular ultrasonic transducer. The polishing apparatus according to claim 1, comprising a porous annular member provided. 支持テーブルが回転する請求項１に記載の研磨装置。   The polishing apparatus according to claim 1, wherein the support table rotates. 中央に回転軸接続部を備え、電源に電気的に接続する環状超音波振動子を固定した砥石保持部材と該砥石保持部材の周縁部の下端に備えられた環状の砥石とを含む研磨具であって、該砥石保持部材の環状超音波振動子の固定位置と回転軸接続部との間の位置に、環状に形成もしくは配置した連続もしくは非連続の空気相を含む環状空気相含有帯域を多重に形成してなる環状空気相含有領域が設けられていて、この環状空気相含有領域により、環状超音波振動子から発生される超音波振動が砥石保持部材の環状空気相含有領域よりも回転軸接続部の側の領域に直線的に伝達されないようにされていることを特徴とする研磨具。   A polishing tool including a grindstone holding member having a rotating shaft connecting portion at the center and fixed with an annular ultrasonic vibrator electrically connected to a power source, and an annular grindstone provided at a lower end of a peripheral edge of the grindstone holding member. An annular air phase-containing zone including a continuous or discontinuous air phase formed or arranged in an annular shape is multiplexed at a position between the fixed position of the annular ultrasonic transducer of the grindstone holding member and the rotary shaft connecting portion. An annular air phase-containing region is formed, and the annular air phase-containing region causes the ultrasonic vibration generated from the annular ultrasonic transducer to rotate more than the annular air phase-containing region of the grindstone holding member. A polishing tool characterized by being prevented from being linearly transmitted to the region on the side of the connecting portion. 環状空気相含有領域が、砥石保持部材に連結領域を介して断続的に形成された内周側の複数の貫通溝と連結領域を介して断続的に形成された外周側の複数の貫通溝とから構成されていて、内周側の連結領域は、外周側の貫通溝に接するように配置され、かつ外周側の連結領域は、内周側の貫通溝に接するように配置されている請求項１０に記載の研磨具。   The annular air phase-containing region has a plurality of inner peripheral side through grooves formed intermittently on the grindstone holding member via the connection region, and a plurality of outer peripheral side through grooves formed intermittently through the connection region The inner peripheral side connection region is disposed so as to contact the outer peripheral side through groove, and the outer peripheral side connection region is disposed so as to be in contact with the inner peripheral side through groove. The polishing tool according to 10. 環状空気相含有領域が、砥石保持部材に連結領域を介して断続的に形成された内周側の複数の貫通孔と連結領域を介して断続的に形成された外周側の複数の貫通孔とから構成されていて、内周側の連結領域は、外周側の貫通孔に接するように配置され、かつ外周側の連結領域は、内周側の貫通孔に接するように配置されている請求項１０に記載の研磨具。   The annular air phase-containing region has a plurality of inner peripheral side through holes formed intermittently in the grindstone holding member via the connection region, and a plurality of outer peripheral side through holes formed intermittently through the connection region. The inner peripheral connection region is disposed so as to contact the outer peripheral through hole, and the outer peripheral connection region is disposed so as to contact the inner peripheral through hole. The polishing tool according to 10. 環状空気相含有領域が、砥石保持部材の上側から上下方向に延びた非貫通の円環状上側溝と砥石保持部材の下側から上下方向に延びた非貫通の円環状下側溝とから構成されていて、上側溝と下側溝との深さの合計が砥石保持部材の上下方向の厚みよりも大きい請求項１０に記載の研磨具。   The annular air phase-containing region is composed of a non-penetrating annular upper groove extending in the vertical direction from the upper side of the grindstone holding member and a non-penetrating annular lower groove extending in the vertical direction from the lower side of the grindstone holding member. The polishing tool according to claim 10, wherein the total depth of the upper groove and the lower groove is larger than the vertical thickness of the grindstone holding member. 環状空気相含有領域が、砥石保持部材の内部で、かつ環状超音波振動子の内周側に備えられた多孔質環状部材から構成されている請求項１０に記載の研磨具。   The polishing tool according to claim 10, wherein the annular air phase-containing region is composed of a porous annular member provided inside the grindstone holding member and on the inner peripheral side of the annular ultrasonic transducer. 上記砥石保持部材が円板部材と該円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、該円筒状部材に連結領域を介して断続的に形成された上側の複数の貫通溝と連結領域を介して断続的に形成された下側の複数の貫通溝とから構成されていて、上側の連結領域は、下側の貫通溝に接するように配置され、かつ下側の連結領域は、上側の貫通溝に接するように配置されている請求項１０に記載の研磨具。   The grindstone holding member includes a disk member and a cylindrical member extending downward from the periphery of the disk member, and an annular air phase-containing region is intermittently formed in the cylindrical member via a connection region. It is composed of a plurality of upper through-grooves and a plurality of lower through-grooves that are intermittently formed via a connection region, and the upper connection region is disposed so as to be in contact with the lower through-groove, The polishing tool according to claim 10, wherein the lower connection region is disposed so as to contact the upper through groove. 上記砥石保持部材が円板部材と該円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、該円筒状部材の外側から厚み方向に延びた非貫通の円環状外側溝と円筒状部材の内側から厚み方向に延びた非貫通の円環状内側溝とから構成されていて、外側溝と内側溝との深さの合計が円筒状部材の厚みよりも大きい請求項１０に記載の研磨具。   The grindstone holding member includes a disk member and a cylindrical member extending downward from the periphery of the disk member, and the annular air phase-containing region extends in the thickness direction from the outside of the cylindrical member. It is composed of an annular outer groove and a non-penetrating annular inner groove extending in the thickness direction from the inside of the cylindrical member, and the total depth of the outer groove and the inner groove is larger than the thickness of the cylindrical member. Item 11. The polishing tool according to Item 10. 上記砥石保持部材が円板部材と該円板部材の周縁から下方に延びた円筒状部材とを含み、環状空気相含有領域が、円筒状部材の内部で、かつ環状超音波振動子の上側に備えられた多孔質環状部材から構成されている請求項１０に記載の研磨具。   The grindstone holding member includes a disc member and a cylindrical member extending downward from the periphery of the disc member, and the annular air phase-containing region is inside the cylindrical member and above the annular ultrasonic transducer. The abrasive | polishing tool of Claim 10 comprised from the provided porous annular member.
JP2009502631A 2007-03-07 2008-03-07 Polishing tool and polishing apparatus Pending JPWO2008108463A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2007098874 2007-03-07
JP2007098874 2007-03-07
JP2007137186 2007-04-23
JP2007137186 2007-04-23
PCT/JP2008/054181 WO2008108463A1 (en) 2007-03-07 2008-03-07 Polishing tool and polishing device

Publications (1)

Publication Number Publication Date
JPWO2008108463A1 true JPWO2008108463A1 (en) 2010-06-17

Family

ID=39738328

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009502631A Pending JPWO2008108463A1 (en) 2007-03-07 2008-03-07 Polishing tool and polishing apparatus

Country Status (4)

Country Link
US (1) US20100087125A1 (en)
JP (1) JPWO2008108463A1 (en)
CN (1) CN101674919A (en)
WO (1) WO2008108463A1 (en)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2006137453A1 (en) * 2005-06-21 2009-01-22 大西　一正 Polishing equipment using ultrasonic vibration
JP5208630B2 (en) * 2008-09-08 2013-06-12 株式会社ディスコ Grinding wheel
JP5357571B2 (en) * 2009-02-24 2013-12-04 株式会社ディスコ Grinding wheel
JP5329264B2 (en) * 2009-03-06 2013-10-30 株式会社ディスコ Grinding wheel
JP5301321B2 (en) * 2009-03-06 2013-09-25 株式会社ディスコ Grinding wheel
JP5362492B2 (en) * 2009-09-07 2013-12-11 株式会社ディスコ Grinding wheel
EP2486602B1 (en) * 2009-10-08 2013-01-16 Komax Holding AG Device and method for removing coatings from solar modules
JP5443960B2 (en) * 2009-11-27 2014-03-19 有限会社Ｕｗａｖｅ Polishing tool
CN101837569A (en) * 2010-01-12 2010-09-22 武汉万邦激光金刚石工具有限公司 Rapid-assembly structure of split diamond millstone
JP5706146B2 (en) * 2010-12-10 2015-04-22 株式会社ディスコ Grinding equipment
JP2012125850A (en) * 2010-12-13 2012-07-05 Disco Corp Grinding wheel
JP2012169024A (en) * 2011-02-16 2012-09-06 Showa Denko Kk Method for manufacturing glass substrate for magnetic recording medium
JP5394427B2 (en) * 2011-03-29 2014-01-22 コマツＮｔｃ株式会社 Removal method of grinding wheel base metal, removal jig, grinding machine and grinding wheel base metal
CN102179733A (en) * 2011-04-11 2011-09-14 辽宁工业大学 Annular ultrasonic polishing oscillator
JP5848640B2 (en) * 2012-03-08 2016-01-27 株式会社ディスコ Polishing surface plate and lapping equipment
WO2014063075A1 (en) * 2012-10-19 2014-04-24 Motion Concepts, LLC Setup platform apparatus for bench and pedestal grinders
CN102909648A (en) * 2012-11-01 2013-02-06 昆山市大金机械设备厂 Automatic grinding device
CN103737471B (en) * 2013-12-27 2016-07-13 湖南宇晶机器股份有限公司 Ultrathin and fragile workpiece polishing method and polishing device
JP2015223691A (en) * 2014-05-30 2015-12-14 天龍製鋸株式会社 Cup wheel
DE102014223544A1 (en) * 2014-11-18 2016-05-19 Sauer Gmbh Spindle device and machine tool with spindle device
JP6475518B2 (en) * 2015-03-03 2019-02-27 株式会社ディスコ Wafer processing method
CN104889881B (en) * 2015-05-27 2017-07-18 厦门大学 One kind vibration composite and flexible grinding and polishing instrument
JP6814579B2 (en) * 2016-09-20 2021-01-20 株式会社ディスコ Grinding wheel and grinding equipment
JP6995306B2 (en) * 2017-08-03 2022-01-14 株式会社キラ・コーポレーション Ultrasonic vibration processing equipment
CN109202756B (en) * 2018-11-15 2024-04-02 珠海市世创金刚石工具制造有限公司 Staggered tooth diamond grinding wheel
CA3054036A1 (en) * 2018-12-28 2020-06-28 Virtual Machines Inc. Method and system for producing abrasive products
CN110125801A (en) * 2019-05-21 2019-08-16 清博(昆山)自动化科技有限公司 A kind of pneumatic grinding and polishing apparatus and its working method digitizing speed regulating control
CN110355621B (en) * 2019-07-17 2021-03-16 大连理工大学 Combined grinding wheel for ultrasonic machining and design method thereof
CN112276785B (en) * 2020-10-16 2022-07-05 广州大学 Double-traveling-wave action bearing roller ultrasonic grinding device
CN112846972B (en) * 2021-01-11 2022-10-21 烟台鑫硕机械有限公司 Grinding wheel fastening device of vertical circular truncated cone surface grinding machine
CN112904719B (en) * 2021-01-15 2022-08-02 哈尔滨工程大学 Annular area tracking control method suitable for underwater robot position
CN115383520A (en) * 2022-08-30 2022-11-25 山东大学 Device and method for processing micro texture on inner wall of rolling bearing raceway

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09291557A (en) * 1996-04-24 1997-11-11 Shimizu Corp Underground vibration control wall
JP2004293433A (en) * 2003-03-27 2004-10-21 Toyoda Gosei Co Ltd Intake device and its manufacturing method
JP2006184079A (en) * 2004-12-27 2006-07-13 Tohoku Univ Atomic force microscope
WO2006137453A1 (en) * 2005-06-21 2006-12-28 Kazumasa Ohnishi Grinding device using ultrasonic vibration

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3112542B2 (en) * 1992-01-24 2000-11-27 オリンパス光学工業株式会社 Ultrasonic polishing equipment
JPH10156706A (en) * 1996-11-27 1998-06-16 Speedfam Co Ltd Device and method for polishing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09291557A (en) * 1996-04-24 1997-11-11 Shimizu Corp Underground vibration control wall
JP2004293433A (en) * 2003-03-27 2004-10-21 Toyoda Gosei Co Ltd Intake device and its manufacturing method
JP2006184079A (en) * 2004-12-27 2006-07-13 Tohoku Univ Atomic force microscope
WO2006137453A1 (en) * 2005-06-21 2006-12-28 Kazumasa Ohnishi Grinding device using ultrasonic vibration

Also Published As

Publication number Publication date
US20100087125A1 (en) 2010-04-08
CN101674919A (en) 2010-03-17
WO2008108463A1 (en) 2008-09-12

Similar Documents

Publication Publication Date Title
JPWO2008108463A1 (en) Polishing tool and polishing apparatus
JPWO2006137453A1 (en) Polishing equipment using ultrasonic vibration
JP5020962B2 (en) Disc-shaped cutting tool and cutting device
WO2009101987A1 (en) Cutting or grinding apparatus
JPWO2006126302A1 (en) CUTTING TOOL AND CUTTING DEVICE PROVIDED WITH A DISC-CUT CUTTING BLADE
JP2007125867A (en) Disk-shaped blade and cutting apparatus
JP5443960B2 (en) Polishing tool
JP2013031887A (en) Grinding tool
JP2010042498A (en) Processing method by use of grinding wheel provided with ultrasonic vibration
JP2008018520A (en) Ultrasonic polishing device
JP2008023696A (en) Ultrasonic processing device
KR100491625B1 (en) Ultrasonic vibration composite grinding tool
JP2008155287A (en) Workpiece grinding device and workpiece grinding method
JP2007125682A (en) Cup type grinding wheel and ultrasonic polishing device
JP5362492B2 (en) Grinding wheel
JP2011110693A (en) Grinding tool
JP2009226575A (en) Polishing tool and polishing device
JP2005001096A (en) Ultrasonic vibrating table
JP2010120153A (en) Polishing tool and polishing apparatus
JP4705971B2 (en) Lapping machine manufacturing equipment
JP2010030027A (en) Polishing apparatus and polishing machine
JP5208630B2 (en) Grinding wheel
JP2011062801A (en) Polishing tool
JP2009226574A (en) Ultrasonic grinding wheel
JP2011255486A (en) Method of washing tool and workpiece machined by the tool

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110302

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120515

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20120914