JPWO2008062515A1 - 半導体製造システム - Google Patents
半導体製造システム Download PDFInfo
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- JPWO2008062515A1 JPWO2008062515A1 JP2008545273A JP2008545273A JPWO2008062515A1 JP WO2008062515 A1 JPWO2008062515 A1 JP WO2008062515A1 JP 2008545273 A JP2008545273 A JP 2008545273A JP 2008545273 A JP2008545273 A JP 2008545273A JP WO2008062515 A1 JPWO2008062515 A1 JP WO2008062515A1
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- Prior art keywords
- bay
- semiconductor manufacturing
- controller
- scheduling
- processing
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
2:ベイ
3:ベイ間搬送装置
4:ベイ間バッファー
21:半導体製造装置
22:ベイ内搬送装置
(数1)
見かけ上のスループット=スループット×(想定稼働率÷100)×(1÷処理枚数比)
(数2)
見かけ上のスループット×設置台数≧リソグラフィ装置の見かけ上スループット
(数3)
(t×搬送対象フローステップ数)≦1枚あたりの処理時間
Claims (2)
- フローショップ方式による半導体製造システムであって、
前記半導体製造システムは、
複数の半導体製造装置と、該半導体製造装置の間でキャリアの搬送を実行するベイ内搬送装置とを備える複数のベイと、
前記ベイ間のキャリアの搬送を実行するベイ間搬送装置と、を有しており、
前記半導体製造システムは、前記ベイとベイ間搬送のスケジューリングを少なくとも実行するスケジューラを有するフローショップコントローラーを備えており、
前記ベイは、該ベイ内の前記半導体製造装置とベイ内搬送装置のスケジューリングを少なくとも実行するスケジューラを有するベイコントローラーを備えており、
前記フローショップコントローラは、前記スケジューラにおけるスケジューリングに基づいて前記ベイと前記ベイ間搬送装置に対して制御指示を送出し、
前記ベイコントローラは、前記スケジューラにおけるスケジューリングに基づいて前記半導体製造装置と前記ベイ内搬送装置に対して制御指示を送出し、
前記スケジューリングは、
前記半導体製造装置のうち、リソグラフィ装置の稼働率を基準として、前記半導体製造装置毎の設置台数、フローステップ数が算出され、前記算出された設置台数、フローステップ数に基づいて設定されている、
ことを特徴とする半導体製造システム。 - 前記フローショップコントローラー、前記ベイコントローラーは、
前記半導体製造装置、前記ベイ内搬送装置、前記ベイ、前記ベイ間搬送装置のいずれか一以上から障害情報、復旧情報、処理の残り時間情報のうち一以上の情報を受け取り、
前記フローショップコントローラーは、前記フローショップの入り口にアクセスするタイミングで再スケジューリングを行い、
前記ベイコントローラーは、前記ベイの入り口にアクセスするタイミングで再スケジューリングを行う、
ことを特徴とする請求項1に記載の半導体製造システム。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/323209 WO2008062515A1 (fr) | 2006-11-21 | 2006-11-21 | Système de fabrication de semiconducteurs |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2008062515A1 true JPWO2008062515A1 (ja) | 2010-03-04 |
JP5075835B2 JP5075835B2 (ja) | 2012-11-21 |
Family
ID=39429456
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008545273A Active JP5075835B2 (ja) | 2006-11-21 | 2006-11-21 | 半導体製造システム |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5075835B2 (ja) |
WO (1) | WO2008062515A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5374203B2 (ja) * | 2009-03-25 | 2013-12-25 | 大日本スクリーン製造株式会社 | 基板処理装置のスケジュール作成方法及びそのプログラム |
JP5427455B2 (ja) * | 2009-03-31 | 2014-02-26 | 大日本スクリーン製造株式会社 | 基板処理装置のスケジュール作成方法及びそのプログラム |
CN114500488B (zh) * | 2022-01-05 | 2023-09-15 | 珠海埃克斯智能科技有限公司 | 半导体清洗设备通讯方法、***以及计算机可读存储介质 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5751580A (en) * | 1996-07-26 | 1998-05-12 | Chartered Semiconductor Manufacturing, Ltd. | Fuzzy logic method and system for adjustment of priority rating of work in process in a production line |
JP3355117B2 (ja) * | 1997-11-13 | 2002-12-09 | 松下電器産業株式会社 | 半導体製造設備 |
JP2002026106A (ja) * | 2000-07-07 | 2002-01-25 | Matsushita Electric Ind Co Ltd | 半導体装置製造施設 |
JP2005190031A (ja) * | 2003-12-25 | 2005-07-14 | Renesas Technology Corp | 半導体デバイス製造におけるボトルネック発生回避方法およびシステム |
JP2006269449A (ja) * | 2005-03-22 | 2006-10-05 | Renesas Technology Corp | 半導体製造システム |
-
2006
- 2006-11-21 JP JP2008545273A patent/JP5075835B2/ja active Active
- 2006-11-21 WO PCT/JP2006/323209 patent/WO2008062515A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2008062515A1 (fr) | 2008-05-29 |
JP5075835B2 (ja) | 2012-11-21 |
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