JPWO2007052476A1 - 電子回路装置およびその製造方法 - Google Patents
電子回路装置およびその製造方法 Download PDFInfo
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- JPWO2007052476A1 JPWO2007052476A1 JP2007542333A JP2007542333A JPWO2007052476A1 JP WO2007052476 A1 JPWO2007052476 A1 JP WO2007052476A1 JP 2007542333 A JP2007542333 A JP 2007542333A JP 2007542333 A JP2007542333 A JP 2007542333A JP WO2007052476 A1 JPWO2007052476 A1 JP WO2007052476A1
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- semiconductor element
- electronic circuit
- circuit device
- insulating resin
- external connection
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Abstract
Description
1A,16A,17A,18A,21A,22A,23A,24A,26A,27A,28A,36A,37A 電極パッド
2 外部接続端子
2A 端子面
3 接続導体(金属細線)
4,56,64 絶縁性樹脂
5,15,20,25,35 電子回路装置
6,30,41 位置決めプレート
6A,30A,41A 素子収容領域
6B,30B,41B 端子収容領域
6C 部品収容領域
7,31,42 成型金型
8,11,32,43 樹脂流入口
9 下金型
10 上金型
12 空間部
23 受動部品
24 中継端子板
26 第1の半導体素子
27,28 第2の半導体素子
29 絶縁性接着剤
36B,37B バンプ
38 フィルムキャリア
39 配線導体
39A 接続領域
40 絶縁性シート
50,50A,50B,50C,50D 導電路
52 導電性ペースト
53 金属細線
54 チップ型電子部品
55 ロウ材
62 リード
63 ボンディングワイヤ
図1Aは本発明の第1の実施の形態にかかる電子回路装置5の構成を示す図1Bの1A−1A線断面図で、図1Bは本発明の第1の実施の形態にかかる電子回路装置5の構成を上面からみた平面図である。なお、図1Bは、理解をしやすくするために絶縁性樹脂を透過してみた状態の平面図である。
図6Aは本発明の第2の実施の形態にかかる電子回路装置25の構成を示す図6Bの6A−6A線断面図で、図6Bは本発明の第2の実施の形態にかかる電子回路装置25の構成を上面からみた平面図である。なお、図6Bは、理解をしやすくするために絶縁性樹脂を透過してみた状態の平面図である。
図8Aは本発明の第3の実施の形態にかかる電子回路装置35の構成を示す図8Bの8A−8A線断面図で、図8Bは本発明の第3の実施の形態にかかる電子回路装置35の構成を上面からみた平面図である。なお、図8Bは、理解をしやすくするために絶縁性樹脂を透過してみた状態の平面図である。
図1Aは本発明の第1の実施の形態にかかる電子回路装置5の構成を示す図1Bの1A−1A線断面図で、図1Bは本発明の第1の実施の形態にかかる電子回路装置5の構成を上面からみた平面図である。なお、図1Bは、理解をしやすくするために絶縁性樹脂を透過してみた状態の平面図である。
図6Aは本発明の第2の実施の形態にかかる電子回路装置25の構成を示す図6Bの6A−6A線断面図で、図6Bは本発明の第2の実施の形態にかかる電子回路装置25の構成を上面からみた平面図である。なお、図6Bは、理解をしやすくするために絶縁性樹脂を透過してみた状態の平面図である。
図8Aは本発明の第3の実施の形態にかかる電子回路装置35の構成を示す図8Bの8A−8A線断面図で、図8Bは本発明の第3の実施の形態にかかる電子回路装置35の構成を上面からみた平面図である。なお、図8Bは、理解をしやすくするために絶縁性樹脂を透過してみた状態の平面図である。
1A,16A,17A,18A,21A,22A,23A,24A,26A,27A,28A,36A,37A 電極パッド
2 外部接続端子
2A 端子面
3 接続導体(金属細線)
4,56,64 絶縁性樹脂
5,15,20,25,35 電子回路装置
6,30,41 位置決めプレート
6A,30A,41A 素子収容領域
6B,30B,41B 端子収容領域
6C 部品収容領域
7,31,42 成型金型
8,11,32,43 樹脂流入口
9 下金型
10 上金型
12 空間部
23 受動部品
24 中継端子板
26 第1の半導体素子
27,28 第2の半導体素子
29 絶縁性接着剤
36B,37B バンプ
38 フィルムキャリア
39 配線導体
39A 接続領域
40 絶縁性シート
50,50A,50B,50C,50D 導電路
52 導電性ペースト
53 金属細線
54 チップ型電子部品
55 ロウ材
62 リード
63 ボンディングワイヤ
Claims (13)
- 少なくとも1個の半導体素子と、
複数個の外部接続端子と、
前記半導体素子と前記外部接続端子とを電気的に接続する接続導体と、
前記半導体素子を被覆し、かつ前記接続導体を一体に支持する絶縁性樹脂とを備え、
前記半導体素子は前記絶縁性樹脂中に埋設され、前記外部接続端子の端子面は前記絶縁性樹脂から露出していることを特徴とする電子回路装置。 - 少なくとも1個の受動部品をさらに含み、
前記半導体素子および前記受動部品は、前記絶縁性樹脂中に埋設され、前記接続導体により前記半導体素子、前記受動部品および前記外部接続端子間を接続したことを特徴とする請求項1に記載の電子回路装置。 - 前記半導体素子は形状の異なる複数個からなり、第1の半導体素子の表面上に1つ以上の第2の半導体素子が配置され、かつ前記絶縁性樹脂中に埋設されており、前記接続導体により前記第1の半導体素子、前記第2の半導体素子および前記外部接続端子間を接続したことを特徴とする請求項1に記載の電子回路装置。
- 少なくとも1個の受動部品が前記第1の半導体素子の表面上にさらに配置され、かつ前記絶縁性樹脂中に埋設されており、前記接続導体により前記第1の半導体素子、前記第2の半導体素子、前記受動部品および前記外部接続端子間を接続したことを特徴とする請求項3に記載の電子回路装置。
- 前記接続導体が金属細線であることを特徴とする請求項1に記載の電子回路装置。
- 前記半導体素子と前記外部接続端子、または前記半導体素子、前記受動部品および前記外部接続端子の相互間を接続するための中継端子板を、さらに設けて前記金属細線により接続したことを特徴とする請求項5に記載の電子回路装置。
- 前記接続導体は、その一部が絶縁性シートで支持されている配線導体であることを特徴とする請求項1に記載の電子回路装置。
- 半導体素子を収容するための素子収容領域と、前記素子収容領域より深い段差を有して形成され、複数個の外部接続端子を収容するための端子収容領域とを有する位置決めプレートをセットするプレート準備ステップと、
前記半導体素子の電極パッドが露出する方向に、前記半導体素子を前記素子収容領域に配置するとともに、前記外部接続端子を前記端子収容領域に配置する配置ステップと、
前記半導体素子と前記外部接続端子とを接続導体によって電気的に接続する接続ステップと、前記接続導体、前記半導体素子および前記外部接続端子の露出面を絶縁性樹脂で覆いモールドする第1の樹脂モールドステップと、
前記端子収容領域に接触していた前記外部接続端子のうちの端子面を除く領域および前記素子収容領域に接触していた前記半導体素子面を除く領域を、前記絶縁性樹脂で覆いモールドして、前記半導体素子を前記絶縁性樹脂中に埋設するとともに前記半導体素子と前記外部接続端子とを一体化し、かつ前記端子面を露出させる第2の樹脂モールドステップと、
を含むことを特徴とする電子回路装置の製造方法。 - 前記プレート準備ステップにおいて、前記位置決めプレートに前記端子収容領域より浅い部品収容領域をさらに設け、前記配置ステップにおいて、さらに受動部品を前記部品収容領域に配置し、
前記接続ステップにおいて、前記受動部品を、前記半導体素子および前記外部接続端子の少なくとも一方と前記接続導体により接続し、
前記第1の樹脂モールドステップと前記第2の樹脂モールドステップとにおいて、前記受動部品も前記半導体素子と同様に前記絶縁性樹脂中に埋設することを特徴とする請求項8に記載の電子回路装置の製造方法。 - 前記第1の樹脂モールドステップにおいて、前記位置決めプレートを下金型として用いることを特徴とする請求項8に記載の電子回路装置の製造方法。
- 前記接続導体として、金属細線を用いることを特徴とする請求項8に記載の電子回路装置の製造方法。
- 前記接続導体として、前記半導体素子と接続するための配線パターンおよび前記外部接続端子と接続する接続領域とからなる配線導体が絶縁性シートにより支持された構成を用いることを特徴とする請求項8に記載の電子回路装置の製造方法。
- 前記配置ステップにおいて、前記素子収容領域に第1の半導体素子と、前記第1の半導体素子の電極パッドで囲まれた領域内に1つ以上の第2の半導体素子を積層して配置することを特徴とする請求項8に記載の電子回路装置の製造方法。
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WO2015182284A1 (ja) * | 2014-05-30 | 2015-12-03 | 富士電機株式会社 | 半導体装置 |
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