JPS649240A - Production of printed circuit board - Google Patents

Production of printed circuit board

Info

Publication number
JPS649240A
JPS649240A JP16226687A JP16226687A JPS649240A JP S649240 A JPS649240 A JP S649240A JP 16226687 A JP16226687 A JP 16226687A JP 16226687 A JP16226687 A JP 16226687A JP S649240 A JPS649240 A JP S649240A
Authority
JP
Japan
Prior art keywords
resin
liquid
epichlorohydrin
impregnating
bisphenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16226687A
Other languages
Japanese (ja)
Inventor
Riichi Otake
Hisafumi Sekiguchi
Seiichi Kitazawa
Nagaro Ariga
Munekazu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DIC Corp
Original Assignee
Dainippon Ink and Chemicals Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Ink and Chemicals Co Ltd filed Critical Dainippon Ink and Chemicals Co Ltd
Priority to JP16226687A priority Critical patent/JPS649240A/en
Publication of JPS649240A publication Critical patent/JPS649240A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)

Abstract

PURPOSE:To produce in good yields the title board excellent in electrical properties, mechanical strengths, dimensional accuracy, etc., by using a solventless molding material formed by impregnating a fibrous reinforcement with a specified liquid curable composition and thickening the liquid resin composition. CONSTITUTION:The title board is produced by using a molding material formed by impregnating a fibrous reinforcing agent (B) (e.g., glass fiber) with a curable resin composition (A) formed by mixing a solventless liquid epoxy resin (e.g., a resin obtained from epichlorohydrin and bisphenol A), an epoxy resin of an m.p. >=50 deg.C (e.g., a resin obtained from epichlorohydrin and bisphenol A), a polybasic acid anhydride (e.g., methylhexahydrophthalic anhydride), an epoxy vinyl ester resin and a dibasic acid (e.g., methacrylic acid) and an oxide and/or a hydroxide of a metal, e.g., MgO, Ca(OH)2.
JP16226687A 1987-07-01 1987-07-01 Production of printed circuit board Pending JPS649240A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16226687A JPS649240A (en) 1987-07-01 1987-07-01 Production of printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16226687A JPS649240A (en) 1987-07-01 1987-07-01 Production of printed circuit board

Publications (1)

Publication Number Publication Date
JPS649240A true JPS649240A (en) 1989-01-12

Family

ID=15751184

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16226687A Pending JPS649240A (en) 1987-07-01 1987-07-01 Production of printed circuit board

Country Status (1)

Country Link
JP (1) JPS649240A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014100821A (en) * 2012-11-19 2014-06-05 Sanko Gosei Ltd Contouring molding method and fiber-reinforced resin molding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014100821A (en) * 2012-11-19 2014-06-05 Sanko Gosei Ltd Contouring molding method and fiber-reinforced resin molding

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