JPS6486546A - Semiconductor stack - Google Patents
Semiconductor stackInfo
- Publication number
- JPS6486546A JPS6486546A JP24447787A JP24447787A JPS6486546A JP S6486546 A JPS6486546 A JP S6486546A JP 24447787 A JP24447787 A JP 24447787A JP 24447787 A JP24447787 A JP 24447787A JP S6486546 A JPS6486546 A JP S6486546A
- Authority
- JP
- Japan
- Prior art keywords
- pin
- hole
- length
- central axis
- semiconductor stack
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Rectifiers (AREA)
Abstract
PURPOSE:To adjust length at the same time as assembly of a semiconductor stack, and to facilitate the assembly by composing the semiconductor stack of a cylindrical first pin, a central axis of which has a specified wall thickness and a through-hole, and a columnar second pin, which can be fitted into the through-hole in the first pin, and inserting the first pin into the through-hole in the second pin in an adjustable manner. CONSTITUTION:When length in the axial direction of a central axis 4 is lengthened excessively and a first pin 2 collides with the base of a hole 8 in a diode 7, a second pin 3 is further inserted into a through-hole 2 in the first pin 2, and overall length is shortened. When the length of the central axis 4 is lengthened, on the contrary, the second pin 3 is drawn out of the through- hole 2 in the first pin 2, and overall length in the axial direction is lengthened. When the first pin 2 and the second pin 3 are combined, entire length in the axial direction of the central axis 4 is made longer than a fixed value previously, and both pins can also be combined while the end face of the first pin 1 is abutted against the base of the hole 8 in the diode 7 when a semiconductor stack is assembled. Accordingly, the length of the central axis 4 can be adjusted at the same time as the assembly of the semiconductor stack.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24447787A JPS6486546A (en) | 1987-09-29 | 1987-09-29 | Semiconductor stack |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24447787A JPS6486546A (en) | 1987-09-29 | 1987-09-29 | Semiconductor stack |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6486546A true JPS6486546A (en) | 1989-03-31 |
Family
ID=17119246
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24447787A Pending JPS6486546A (en) | 1987-09-29 | 1987-09-29 | Semiconductor stack |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6486546A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285216A (en) * | 1989-09-27 | 1994-02-08 | Kyocera Corporation | Thermal head |
US5959651A (en) * | 1995-08-12 | 1999-09-28 | Rohm Co., Ltd. | Thermal printhead and method of adjusting characteristic thereof |
-
1987
- 1987-09-29 JP JP24447787A patent/JPS6486546A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5285216A (en) * | 1989-09-27 | 1994-02-08 | Kyocera Corporation | Thermal head |
US5959651A (en) * | 1995-08-12 | 1999-09-28 | Rohm Co., Ltd. | Thermal printhead and method of adjusting characteristic thereof |
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