JPS6484624A - Semiconductor integrated circuit device using film carrier - Google Patents
Semiconductor integrated circuit device using film carrierInfo
- Publication number
- JPS6484624A JPS6484624A JP24085587A JP24085587A JPS6484624A JP S6484624 A JPS6484624 A JP S6484624A JP 24085587 A JP24085587 A JP 24085587A JP 24085587 A JP24085587 A JP 24085587A JP S6484624 A JPS6484624 A JP S6484624A
- Authority
- JP
- Japan
- Prior art keywords
- film carrier
- integrated circuit
- semiconductor integrated
- circuit device
- circuit chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Wire Bonding (AREA)
Abstract
PURPOSE:To reduce the inductance of a bonding wire by a method wherein a film carrier is used to be connected to an integrated circuit chip while the film carrier is loaded with a condenser for decoupling. CONSTITUTION:A through hole is made on the end of inner leads 2 connected to one another by an integrated circuit chip 4 and a bump. A conductor 5 is formed on the central part of a film carrier to form a condenser holding a polyimide insulating layer. When the film carrier is used to be connected to the integrated circuit chip 4, they are connected by the bump. Through these procedures, the inductance of a bonding wire can be reduced.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24085587A JP2507475B2 (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24085587A JP2507475B2 (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6484624A true JPS6484624A (en) | 1989-03-29 |
JP2507475B2 JP2507475B2 (en) | 1996-06-12 |
Family
ID=17065712
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP24085587A Expired - Lifetime JP2507475B2 (en) | 1987-09-28 | 1987-09-28 | Semiconductor integrated circuit device using film carrier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2507475B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109270A (en) * | 1989-04-17 | 1992-04-28 | Matsushita Electric Industrial Co., Ltd. | High frequency semiconductor device |
JPH06268012A (en) * | 1993-03-11 | 1994-09-22 | Nec Corp | Semiconductor integrated circuit |
-
1987
- 1987-09-28 JP JP24085587A patent/JP2507475B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5109270A (en) * | 1989-04-17 | 1992-04-28 | Matsushita Electric Industrial Co., Ltd. | High frequency semiconductor device |
JPH06268012A (en) * | 1993-03-11 | 1994-09-22 | Nec Corp | Semiconductor integrated circuit |
Also Published As
Publication number | Publication date |
---|---|
JP2507475B2 (en) | 1996-06-12 |
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