JPS6478695A - Method for cutting raw film of polishing film - Google Patents

Method for cutting raw film of polishing film

Info

Publication number
JPS6478695A
JPS6478695A JP62235691A JP23569187A JPS6478695A JP S6478695 A JPS6478695 A JP S6478695A JP 62235691 A JP62235691 A JP 62235691A JP 23569187 A JP23569187 A JP 23569187A JP S6478695 A JPS6478695 A JP S6478695A
Authority
JP
Japan
Prior art keywords
film
polishing
raw film
cutting
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62235691A
Other languages
Japanese (ja)
Inventor
Naoto Akaha
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Holdings Ltd
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP62235691A priority Critical patent/JPS6478695A/en
Publication of JPS6478695A publication Critical patent/JPS6478695A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve the efficiency and quality of cutting by forming a polishing layer having specific Mohs hardness on the raw film of a polishing film and projecting a laser beam thereon. CONSTITUTION:The polishing layer 12 is formed on the raw film 8 of the polishing film by coating a polishing paint contg. a polishing agent having >=5.5 Mohs hardness on a film base body. The laser beam 2 from a laser oscillator 1 is projected through a mirror 3, an optical system 4 and a condenser lens 5 to the raw film 8. An irradiated spot surface 10 generates heat to a locally extremely high temp. state and the film base material is instantaneously removed and cut by liquefaction, gasification and conversion to plasma. Gas such as gaseous N2 is introduced simultaneously from a gas introducing pipe 9 and the base material converted to the plasma is efficiently removed, by which the oxidation reaction thereof is prevented. The efficiency and quality of cutting the raw film 8 are thereby improved.
JP62235691A 1987-09-19 1987-09-19 Method for cutting raw film of polishing film Pending JPS6478695A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62235691A JPS6478695A (en) 1987-09-19 1987-09-19 Method for cutting raw film of polishing film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62235691A JPS6478695A (en) 1987-09-19 1987-09-19 Method for cutting raw film of polishing film

Publications (1)

Publication Number Publication Date
JPS6478695A true JPS6478695A (en) 1989-03-24

Family

ID=16989791

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62235691A Pending JPS6478695A (en) 1987-09-19 1987-09-19 Method for cutting raw film of polishing film

Country Status (1)

Country Link
JP (1) JPS6478695A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5405223A (en) * 1990-11-28 1995-04-11 Sirevag; Gunnar Method for treating drill cuttings during oil and gas drilling
JP2007331891A (en) * 2006-06-15 2007-12-27 Tcm Corp Mast device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5405223A (en) * 1990-11-28 1995-04-11 Sirevag; Gunnar Method for treating drill cuttings during oil and gas drilling
JP2007331891A (en) * 2006-06-15 2007-12-27 Tcm Corp Mast device

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