JPS6476935A - Resin composition for sealing semiconductor device - Google Patents

Resin composition for sealing semiconductor device

Info

Publication number
JPS6476935A
JPS6476935A JP23096587A JP23096587A JPS6476935A JP S6476935 A JPS6476935 A JP S6476935A JP 23096587 A JP23096587 A JP 23096587A JP 23096587 A JP23096587 A JP 23096587A JP S6476935 A JPS6476935 A JP S6476935A
Authority
JP
Japan
Prior art keywords
tio2
glass particles
resin composition
sio2
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23096587A
Other languages
Japanese (ja)
Inventor
Hiromi Oyama
Toshiyasu Kawaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP23096587A priority Critical patent/JPS6476935A/en
Publication of JPS6476935A publication Critical patent/JPS6476935A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Glass Compositions (AREA)

Abstract

PURPOSE:To obtain a resin composition of high moldability and low expansion, by mixing glass particles which is composed of SiO2 and TiO2 to a resin. CONSTITUTION:The subject resin composition for sealing semiconductor devices is composed of glass particles containing SiO2 and TiO2 and of a resin. The glass particles preferably contains the both oxides more than 99.9mol.%, and the remaining 0.1mol.% may be oxides of alkaline earth metals such as Mg, Ca, or the like, P2O5, B2O3, Al2O3, GeO2, etc. Especially preferable composition is 90-99mol.% of SiO2 and 1-10mol.% of TiO2. When the content of TiO2 exceeds 10mol.%, devitrification by TiO2 takes place and the thermal expansion undesirably tends to become large. The shape of the glass particles preferably is a perfect sphere as much as possible, so that the flowability may not lowered, even when large amounts of them are used in the composition.
JP23096587A 1987-09-17 1987-09-17 Resin composition for sealing semiconductor device Pending JPS6476935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23096587A JPS6476935A (en) 1987-09-17 1987-09-17 Resin composition for sealing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23096587A JPS6476935A (en) 1987-09-17 1987-09-17 Resin composition for sealing semiconductor device

Publications (1)

Publication Number Publication Date
JPS6476935A true JPS6476935A (en) 1989-03-23

Family

ID=16916097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23096587A Pending JPS6476935A (en) 1987-09-17 1987-09-17 Resin composition for sealing semiconductor device

Country Status (1)

Country Link
JP (1) JPS6476935A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0375239A (en) * 1989-08-14 1991-03-29 Nippon Electric Glass Co Ltd Sealing material
JPH03232741A (en) * 1990-02-07 1991-10-16 Shin Etsu Chem Co Ltd Highly transparent silica-titania glass particle and production thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0375239A (en) * 1989-08-14 1991-03-29 Nippon Electric Glass Co Ltd Sealing material
JPH03232741A (en) * 1990-02-07 1991-10-16 Shin Etsu Chem Co Ltd Highly transparent silica-titania glass particle and production thereof

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