JPS6476796A - Manufacture of multilayer printed wiring board - Google Patents
Manufacture of multilayer printed wiring boardInfo
- Publication number
- JPS6476796A JPS6476796A JP23430887A JP23430887A JPS6476796A JP S6476796 A JPS6476796 A JP S6476796A JP 23430887 A JP23430887 A JP 23430887A JP 23430887 A JP23430887 A JP 23430887A JP S6476796 A JPS6476796 A JP S6476796A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- multilayer printed
- circuit pattern
- covered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
PURPOSE:To enable a circuit pattern to be formed without causing exudation of resin in prepreg or leaving unetched parts and to enable holes to be formed without causing flash on the top or rear face, without damaging the surface of outer copper foil layers and without making dents, by covering the outermost layers with metallic sheets to provide a multilayer substrate, and peeling the metallic sheets off after formation of the holes. CONSTITUTION:A conductor circuit pattern forming section of a copper foil 5a-1 on the surface of the top layer is covered with photosensitive dry film resist 7, and a conductor circuit pattern 5 is formed on the surface of the top layer. An insulating board 6 having only the conductor circuit patterns 5 formed on the opposite surfaces thereof is interposed between prepregs 8. Further, two laminated boards 3 coated with a copper foil are laid on the opposite surfaces with their faces having a blind viahole faced to each other, and they are thermally pressed to provide a multilayer printed wiring board 1. The multilayer printed wiring board 1 is then provided with a through hole 2a and the outermost aluminium sheets 3a are peeled off. All the surface including the inner wall of the through hole 2a is covered with a conductor layer 9. After that, the through hole 2a and the circuit pattern section are covered with a photosensitive material to provide a multilayer printed wiring board 1 as desired.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23430887A JPS6476796A (en) | 1987-09-17 | 1987-09-17 | Manufacture of multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23430887A JPS6476796A (en) | 1987-09-17 | 1987-09-17 | Manufacture of multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6476796A true JPS6476796A (en) | 1989-03-22 |
Family
ID=16968966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23430887A Pending JPS6476796A (en) | 1987-09-17 | 1987-09-17 | Manufacture of multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6476796A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02185099A (en) * | 1989-01-12 | 1990-07-19 | Sony Corp | Manufacture of printed wiring board |
| US5733092A (en) * | 1995-05-08 | 1998-03-31 | Barry; Leonard D. | Rotary loader and system |
| WO2014038488A1 (en) * | 2012-09-05 | 2014-03-13 | 三井金属鉱業株式会社 | Printed wiring board production method and printed wiring board |
-
1987
- 1987-09-17 JP JP23430887A patent/JPS6476796A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02185099A (en) * | 1989-01-12 | 1990-07-19 | Sony Corp | Manufacture of printed wiring board |
| US5733092A (en) * | 1995-05-08 | 1998-03-31 | Barry; Leonard D. | Rotary loader and system |
| WO2014038488A1 (en) * | 2012-09-05 | 2014-03-13 | 三井金属鉱業株式会社 | Printed wiring board production method and printed wiring board |
| TWI573508B (en) * | 2012-09-05 | 2017-03-01 | Mitsui Mining & Smelting Co | Printed circuit board manufacturing method and printed circuit board |
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