JPS56159229A - Production of multilayer board - Google Patents

Production of multilayer board

Info

Publication number
JPS56159229A
JPS56159229A JP6358080A JP6358080A JPS56159229A JP S56159229 A JPS56159229 A JP S56159229A JP 6358080 A JP6358080 A JP 6358080A JP 6358080 A JP6358080 A JP 6358080A JP S56159229 A JPS56159229 A JP S56159229A
Authority
JP
Japan
Prior art keywords
plates
resin
prepregs
epoxy resin
continuity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6358080A
Other languages
Japanese (ja)
Inventor
Shunichi Takigawa
Nobuyuki Ikeguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Gas Chemical Co Inc
Original Assignee
Mitsubishi Gas Chemical Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co Inc filed Critical Mitsubishi Gas Chemical Co Inc
Priority to JP6358080A priority Critical patent/JPS56159229A/en
Publication of JPS56159229A publication Critical patent/JPS56159229A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE: A cyanate ester resin composition is used as a base resin to make circuit plates and they are laminated by placing prepregs made by impregnating a reinforcing base material with an epoxy resin between them, thus producing multilayered laminate plates with less defects in continuity.
CONSTITUTION: A cyanate ester resin composition such as a cyanate-maleimide- epoxy resin is used as a base material resin to make printed circuit plates. In the meantime, a reinforcing material such as glass fiber cloth is impregnated or coated with an epoxy resin and dried to prepare prepregs of class B insulation. Then, the circuit plates are laminated by placing the prepregs between the plates to produce the objective multilayered plates.
EFFECT: The defects in continuity of copper foil in the inner layers is extremely decreased, which are caused by the fusion of the resin by the friction heat on drilling for hole boring, and the adhesion to the inner copper foils is high.
COPYRIGHT: (C)1981,JPO&Japio
JP6358080A 1980-05-14 1980-05-14 Production of multilayer board Pending JPS56159229A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6358080A JPS56159229A (en) 1980-05-14 1980-05-14 Production of multilayer board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6358080A JPS56159229A (en) 1980-05-14 1980-05-14 Production of multilayer board

Publications (1)

Publication Number Publication Date
JPS56159229A true JPS56159229A (en) 1981-12-08

Family

ID=13233335

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6358080A Pending JPS56159229A (en) 1980-05-14 1980-05-14 Production of multilayer board

Country Status (1)

Country Link
JP (1) JPS56159229A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032631A (en) * 1983-08-01 1985-02-19 Hayakawa Rubber Co Ltd Manufacture of rubber molded item with pattern
JPS61154096A (en) * 1984-12-26 1986-07-12 住友ベークライト株式会社 Manufacture of multilayer printed wiring board
US11707411B2 (en) 2019-08-09 2023-07-25 Corning Incorporated Pharmaceutical packages with coatings comprising polycyanurates

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6032631A (en) * 1983-08-01 1985-02-19 Hayakawa Rubber Co Ltd Manufacture of rubber molded item with pattern
JPS61154096A (en) * 1984-12-26 1986-07-12 住友ベークライト株式会社 Manufacture of multilayer printed wiring board
JPH0365910B2 (en) * 1984-12-26 1991-10-15
US11707411B2 (en) 2019-08-09 2023-07-25 Corning Incorporated Pharmaceutical packages with coatings comprising polycyanurates

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