JPS56159229A - Production of multilayer board - Google Patents
Production of multilayer boardInfo
- Publication number
- JPS56159229A JPS56159229A JP6358080A JP6358080A JPS56159229A JP S56159229 A JPS56159229 A JP S56159229A JP 6358080 A JP6358080 A JP 6358080A JP 6358080 A JP6358080 A JP 6358080A JP S56159229 A JPS56159229 A JP S56159229A
- Authority
- JP
- Japan
- Prior art keywords
- plates
- resin
- prepregs
- epoxy resin
- continuity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
PURPOSE: A cyanate ester resin composition is used as a base resin to make circuit plates and they are laminated by placing prepregs made by impregnating a reinforcing base material with an epoxy resin between them, thus producing multilayered laminate plates with less defects in continuity.
CONSTITUTION: A cyanate ester resin composition such as a cyanate-maleimide- epoxy resin is used as a base material resin to make printed circuit plates. In the meantime, a reinforcing material such as glass fiber cloth is impregnated or coated with an epoxy resin and dried to prepare prepregs of class B insulation. Then, the circuit plates are laminated by placing the prepregs between the plates to produce the objective multilayered plates.
EFFECT: The defects in continuity of copper foil in the inner layers is extremely decreased, which are caused by the fusion of the resin by the friction heat on drilling for hole boring, and the adhesion to the inner copper foils is high.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6358080A JPS56159229A (en) | 1980-05-14 | 1980-05-14 | Production of multilayer board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6358080A JPS56159229A (en) | 1980-05-14 | 1980-05-14 | Production of multilayer board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS56159229A true JPS56159229A (en) | 1981-12-08 |
Family
ID=13233335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6358080A Pending JPS56159229A (en) | 1980-05-14 | 1980-05-14 | Production of multilayer board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56159229A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6032631A (en) * | 1983-08-01 | 1985-02-19 | Hayakawa Rubber Co Ltd | Manufacture of rubber molded item with pattern |
JPS61154096A (en) * | 1984-12-26 | 1986-07-12 | 住友ベークライト株式会社 | Manufacture of multilayer printed wiring board |
US11707411B2 (en) | 2019-08-09 | 2023-07-25 | Corning Incorporated | Pharmaceutical packages with coatings comprising polycyanurates |
-
1980
- 1980-05-14 JP JP6358080A patent/JPS56159229A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6032631A (en) * | 1983-08-01 | 1985-02-19 | Hayakawa Rubber Co Ltd | Manufacture of rubber molded item with pattern |
JPS61154096A (en) * | 1984-12-26 | 1986-07-12 | 住友ベークライト株式会社 | Manufacture of multilayer printed wiring board |
JPH0365910B2 (en) * | 1984-12-26 | 1991-10-15 | ||
US11707411B2 (en) | 2019-08-09 | 2023-07-25 | Corning Incorporated | Pharmaceutical packages with coatings comprising polycyanurates |
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