JPS6473638A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS6473638A JPS6473638A JP23160187A JP23160187A JPS6473638A JP S6473638 A JPS6473638 A JP S6473638A JP 23160187 A JP23160187 A JP 23160187A JP 23160187 A JP23160187 A JP 23160187A JP S6473638 A JPS6473638 A JP S6473638A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- base
- wiring layer
- integrated circuit
- semiconductor integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE:To reduce the electric resistance of a wiring layer by providing a semiconductor substrate, a wiring base on the substrate, and a wiring layer buried by forming the lower part in a wedge state in the base. CONSTITUTION:A groove 3 covered with a wiring layer 2 is formed in a base 1 of a wiring. If the layer 2 is grown, for example, by sputtering under the condition not depending upon the base azimuth and the thickness (t) of the wiring layer is t<d and t<g/2 with respect to the width (g) and the depth (d) of the groove, the sectional area S is increased by 2(d-t)t+pit<2>/2 (2d-0.4t)t adhered to its wall face when it is calculated by approximating the round position to a circumference, and the wiring resistance can be reduced by the increased amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23160187A JPS6473638A (en) | 1987-09-14 | 1987-09-14 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23160187A JPS6473638A (en) | 1987-09-14 | 1987-09-14 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6473638A true JPS6473638A (en) | 1989-03-17 |
Family
ID=16926069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23160187A Pending JPS6473638A (en) | 1987-09-14 | 1987-09-14 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6473638A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6817071B2 (en) * | 1999-04-28 | 2004-11-16 | Murata Manufacturing Co., Ltd. | Method of manufacturing surface acoustic wave device having bump electrodes |
| JP2010153543A (en) * | 2008-12-25 | 2010-07-08 | Fujitsu Ltd | Semiconductor device and method of manufacturing the same |
| JP2017109386A (en) * | 2015-12-16 | 2017-06-22 | エスアイアイ・プリンテック株式会社 | Liquid spray head and liquid spray device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60113445A (en) * | 1983-11-24 | 1985-06-19 | Nec Corp | Manufacture of semiconductor element |
| JPS60214569A (en) * | 1984-04-10 | 1985-10-26 | Nec Corp | Mos type semiconductor device |
| JPS62237746A (en) * | 1986-04-08 | 1987-10-17 | Agency Of Ind Science & Technol | Semiconductor integrated circuit |
-
1987
- 1987-09-14 JP JP23160187A patent/JPS6473638A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60113445A (en) * | 1983-11-24 | 1985-06-19 | Nec Corp | Manufacture of semiconductor element |
| JPS60214569A (en) * | 1984-04-10 | 1985-10-26 | Nec Corp | Mos type semiconductor device |
| JPS62237746A (en) * | 1986-04-08 | 1987-10-17 | Agency Of Ind Science & Technol | Semiconductor integrated circuit |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6817071B2 (en) * | 1999-04-28 | 2004-11-16 | Murata Manufacturing Co., Ltd. | Method of manufacturing surface acoustic wave device having bump electrodes |
| JP2010153543A (en) * | 2008-12-25 | 2010-07-08 | Fujitsu Ltd | Semiconductor device and method of manufacturing the same |
| JP2017109386A (en) * | 2015-12-16 | 2017-06-22 | エスアイアイ・プリンテック株式会社 | Liquid spray head and liquid spray device |
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