JPS6472546A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6472546A
JPS6472546A JP22876387A JP22876387A JPS6472546A JP S6472546 A JPS6472546 A JP S6472546A JP 22876387 A JP22876387 A JP 22876387A JP 22876387 A JP22876387 A JP 22876387A JP S6472546 A JPS6472546 A JP S6472546A
Authority
JP
Japan
Prior art keywords
plate
resin
protrusion
recess
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22876387A
Other languages
Japanese (ja)
Inventor
Kazuhiro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP22876387A priority Critical patent/JPS6472546A/en
Publication of JPS6472546A publication Critical patent/JPS6472546A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To eliminate work of cutting the extension of a heat sink plate after resin molding, to obviate a danger of losing adhesive properties of the plate and the resin and to improve withstand voltage characteristics by providing a protrusion with a stepwise difference from the other main face of the plate on the sidewall of the plate, forming a recess on the outer face of the resin on the side of the protrusion, and exposing a part of the protrusion in the recess. CONSTITUTION:A semiconductor pellet 7 mounted on one main surface of a heat sink plate 5 is electrically connected to leads 6 disposed at its one ends in the vicinity of the pellet, and covered with resin 8 on the whole pellet 7 and plate 5. In such a semiconductor device, a protrusion 5c is formed with a stepwise difference (h) from the other main surface of the plate 5 on the sidewall of the plate 5, a recess 8b is formed on the outer face of the resin 8 on the side of the protrusion 5c, and the part of the protrusion 5c is exposed in the recess 8b. Thus, since it is not necessary to cut the extension of the plate, the adhesive properties of the resin to the plate are not lost to eliminate the deterioration of its moisture resistance. Further, since the charger of the plate is disposed in the resin recess, a creepage distance, a space distance to an external heat sink or the like can be increased, thereby improving its withstand voltage characteristics.
JP22876387A 1987-09-11 1987-09-11 Semiconductor device Pending JPS6472546A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22876387A JPS6472546A (en) 1987-09-11 1987-09-11 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22876387A JPS6472546A (en) 1987-09-11 1987-09-11 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6472546A true JPS6472546A (en) 1989-03-17

Family

ID=16881449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22876387A Pending JPS6472546A (en) 1987-09-11 1987-09-11 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6472546A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02294055A (en) * 1989-05-08 1990-12-05 Matsushita Electric Ind Co Ltd Ic package
JPH03163986A (en) * 1989-04-03 1991-07-15 Brooktree Corp System detecting each voltage pulse having specific dimensions
JPH0444155U (en) * 1990-08-21 1992-04-15
JPH04162550A (en) * 1990-10-26 1992-06-08 Nec Corp Resin-sealed semiconductor device and manufacture thereof
JPH08125069A (en) * 1994-10-24 1996-05-17 Nec Kyushu Ltd Semiconductor device
JP2007081442A (en) * 1998-10-05 2007-03-29 Fuji Electric Device Technology Co Ltd Package of semiconductor element and method of manufacturing the same
JP2012033178A (en) * 2003-06-23 2012-02-16 Sandisk Corp Integrated circuit product

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03163986A (en) * 1989-04-03 1991-07-15 Brooktree Corp System detecting each voltage pulse having specific dimensions
JPH02294055A (en) * 1989-05-08 1990-12-05 Matsushita Electric Ind Co Ltd Ic package
JPH0444155U (en) * 1990-08-21 1992-04-15
JPH04162550A (en) * 1990-10-26 1992-06-08 Nec Corp Resin-sealed semiconductor device and manufacture thereof
JPH08125069A (en) * 1994-10-24 1996-05-17 Nec Kyushu Ltd Semiconductor device
JP2007081442A (en) * 1998-10-05 2007-03-29 Fuji Electric Device Technology Co Ltd Package of semiconductor element and method of manufacturing the same
JP2012033178A (en) * 2003-06-23 2012-02-16 Sandisk Corp Integrated circuit product

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