JPS6468489A - Electrolytic gold plating method - Google Patents
Electrolytic gold plating methodInfo
- Publication number
- JPS6468489A JPS6468489A JP22597587A JP22597587A JPS6468489A JP S6468489 A JPS6468489 A JP S6468489A JP 22597587 A JP22597587 A JP 22597587A JP 22597587 A JP22597587 A JP 22597587A JP S6468489 A JPS6468489 A JP S6468489A
- Authority
- JP
- Japan
- Prior art keywords
- thallium
- gold plating
- electric current
- plating film
- current
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
PURPOSE:To control the amount of thallium formed into eutectoid in a plating film, by using pulse current as impressed electric current at the time of carrying out plating by using a gold plating bath in which thallium is added. CONSTITUTION:A gold plating bath in which thallium is added as a grain refiner is used and also pulse current is used as an electric current to be impressed. By this method, the amount of eutectoid thallium in the plating film of a material to be plated can be reduced to about one-tenth that prepared by using conventional D.C. current. Moreover, by sending an electric current having a polarity reverse to that of usually applied electric current at the time of the circuit breaking of the above pulse current, the amount of thallium formed into eutectoid in the plating film can be controlled to a greater extent. Accordingly, the gold plating film excellent in heat resistance, wire covering power, and die covering power can be obtained.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22597587A JPS6468489A (en) | 1987-09-09 | 1987-09-09 | Electrolytic gold plating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22597587A JPS6468489A (en) | 1987-09-09 | 1987-09-09 | Electrolytic gold plating method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6468489A true JPS6468489A (en) | 1989-03-14 |
Family
ID=16837819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22597587A Pending JPS6468489A (en) | 1987-09-09 | 1987-09-09 | Electrolytic gold plating method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6468489A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006249484A (en) * | 2005-03-09 | 2006-09-21 | Shinshu Univ | Gold plating liquid and gold plating method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58161793A (en) * | 1982-03-19 | 1983-09-26 | Hitachi Ltd | Continuous electroplating method |
JPS62151592A (en) * | 1985-12-25 | 1987-07-06 | Hitachi Cable Ltd | Production of gold plated lead frame |
-
1987
- 1987-09-09 JP JP22597587A patent/JPS6468489A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58161793A (en) * | 1982-03-19 | 1983-09-26 | Hitachi Ltd | Continuous electroplating method |
JPS62151592A (en) * | 1985-12-25 | 1987-07-06 | Hitachi Cable Ltd | Production of gold plated lead frame |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006249484A (en) * | 2005-03-09 | 2006-09-21 | Shinshu Univ | Gold plating liquid and gold plating method |
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