JPS6468489A - Electrolytic gold plating method - Google Patents

Electrolytic gold plating method

Info

Publication number
JPS6468489A
JPS6468489A JP22597587A JP22597587A JPS6468489A JP S6468489 A JPS6468489 A JP S6468489A JP 22597587 A JP22597587 A JP 22597587A JP 22597587 A JP22597587 A JP 22597587A JP S6468489 A JPS6468489 A JP S6468489A
Authority
JP
Japan
Prior art keywords
thallium
gold plating
electric current
plating film
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22597587A
Other languages
Japanese (ja)
Inventor
Kimiko Harayama
Masao Nakazawa
Shoichi Iwai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP22597587A priority Critical patent/JPS6468489A/en
Publication of JPS6468489A publication Critical patent/JPS6468489A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To control the amount of thallium formed into eutectoid in a plating film, by using pulse current as impressed electric current at the time of carrying out plating by using a gold plating bath in which thallium is added. CONSTITUTION:A gold plating bath in which thallium is added as a grain refiner is used and also pulse current is used as an electric current to be impressed. By this method, the amount of eutectoid thallium in the plating film of a material to be plated can be reduced to about one-tenth that prepared by using conventional D.C. current. Moreover, by sending an electric current having a polarity reverse to that of usually applied electric current at the time of the circuit breaking of the above pulse current, the amount of thallium formed into eutectoid in the plating film can be controlled to a greater extent. Accordingly, the gold plating film excellent in heat resistance, wire covering power, and die covering power can be obtained.
JP22597587A 1987-09-09 1987-09-09 Electrolytic gold plating method Pending JPS6468489A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22597587A JPS6468489A (en) 1987-09-09 1987-09-09 Electrolytic gold plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22597587A JPS6468489A (en) 1987-09-09 1987-09-09 Electrolytic gold plating method

Publications (1)

Publication Number Publication Date
JPS6468489A true JPS6468489A (en) 1989-03-14

Family

ID=16837819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22597587A Pending JPS6468489A (en) 1987-09-09 1987-09-09 Electrolytic gold plating method

Country Status (1)

Country Link
JP (1) JPS6468489A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249484A (en) * 2005-03-09 2006-09-21 Shinshu Univ Gold plating liquid and gold plating method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161793A (en) * 1982-03-19 1983-09-26 Hitachi Ltd Continuous electroplating method
JPS62151592A (en) * 1985-12-25 1987-07-06 Hitachi Cable Ltd Production of gold plated lead frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161793A (en) * 1982-03-19 1983-09-26 Hitachi Ltd Continuous electroplating method
JPS62151592A (en) * 1985-12-25 1987-07-06 Hitachi Cable Ltd Production of gold plated lead frame

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006249484A (en) * 2005-03-09 2006-09-21 Shinshu Univ Gold plating liquid and gold plating method

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