JPS6464334A - Apparatus for mounting semiconductor wafer - Google Patents
Apparatus for mounting semiconductor waferInfo
- Publication number
- JPS6464334A JPS6464334A JP62221689A JP22168987A JPS6464334A JP S6464334 A JPS6464334 A JP S6464334A JP 62221689 A JP62221689 A JP 62221689A JP 22168987 A JP22168987 A JP 22168987A JP S6464334 A JPS6464334 A JP S6464334A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- wafer
- chucker
- bonding
- aligning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To mount a semiconductor wafer in an accurately aligned state without displacement by previously bonding the wafer to an adhesive tape, correcting the position of a frame chucker to accurately align a mounting frame on the wafer, and then bonding the frame to the tape. CONSTITUTION:A frame aligning mechanism 1 for aligning a mounting frame F, a wafer aligning mechanism 2 for aligning an orientation flat part OF, a wafer bonding mechanism 3 for bonding a semiconductor wafer A on an adhesive tape B, an image sensor 4 for sensing the element pattern of the wafer A, a frame chucker 5 for attracting to hold the frame F, and a frame chucker moving mechanism 6 for moving it to a bonding position P for positioning the wafer A are provided. Further, discriminating means 7 for discriminating a sample image mostly similar to a reference image, calculating means 8 for calculating the relative displacement of the sample image and the sensor 4, position correcting means 9 for controlling to drive the mechanism 6 to correct it by the displacement, and a frame chucker elevating mechanism 10 for moving down the chucker 5 for holding the frame F are provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62221689A JP2560042B2 (en) | 1987-09-04 | 1987-09-04 | Semiconductor wafer mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62221689A JP2560042B2 (en) | 1987-09-04 | 1987-09-04 | Semiconductor wafer mounting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6464334A true JPS6464334A (en) | 1989-03-10 |
JP2560042B2 JP2560042B2 (en) | 1996-12-04 |
Family
ID=16770737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62221689A Expired - Fee Related JP2560042B2 (en) | 1987-09-04 | 1987-09-04 | Semiconductor wafer mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2560042B2 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02178948A (en) * | 1988-12-29 | 1990-07-11 | Disco Abrasive Syst Ltd | Pre-alignment method of wafer loading frame |
JPH0338051A (en) * | 1989-06-29 | 1991-02-19 | Applied Materials Inc | Handling method and device for semiconductor wafer |
KR100441128B1 (en) * | 1996-11-28 | 2004-10-08 | 앰코 테크놀로지 코리아 주식회사 | Wafer mounting method and apparatus for semiconductor package to cutting easily each of patterns of wafer |
JP2012238856A (en) * | 2011-05-12 | 2012-12-06 | Semiconductor Technologies & Instruments Pte Ltd | System and method using plural configuration frame handler constituted to process and move configuration frame |
CN104396003A (en) * | 2012-05-02 | 2015-03-04 | 盛美半导体设备(上海)有限公司 | Apparatus and method for detecting position of wafer |
CN114078727A (en) * | 2020-08-11 | 2022-02-22 | 武汉锐晶激光芯片技术有限公司 | Guide structure for taking and placing wafer |
-
1987
- 1987-09-04 JP JP62221689A patent/JP2560042B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02178948A (en) * | 1988-12-29 | 1990-07-11 | Disco Abrasive Syst Ltd | Pre-alignment method of wafer loading frame |
JPH0338051A (en) * | 1989-06-29 | 1991-02-19 | Applied Materials Inc | Handling method and device for semiconductor wafer |
KR100441128B1 (en) * | 1996-11-28 | 2004-10-08 | 앰코 테크놀로지 코리아 주식회사 | Wafer mounting method and apparatus for semiconductor package to cutting easily each of patterns of wafer |
JP2012238856A (en) * | 2011-05-12 | 2012-12-06 | Semiconductor Technologies & Instruments Pte Ltd | System and method using plural configuration frame handler constituted to process and move configuration frame |
CN104396003A (en) * | 2012-05-02 | 2015-03-04 | 盛美半导体设备(上海)有限公司 | Apparatus and method for detecting position of wafer |
CN114078727A (en) * | 2020-08-11 | 2022-02-22 | 武汉锐晶激光芯片技术有限公司 | Guide structure for taking and placing wafer |
Also Published As
Publication number | Publication date |
---|---|
JP2560042B2 (en) | 1996-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |