JPS6464293A - Manufacture of circuit module - Google Patents

Manufacture of circuit module

Info

Publication number
JPS6464293A
JPS6464293A JP22068587A JP22068587A JPS6464293A JP S6464293 A JPS6464293 A JP S6464293A JP 22068587 A JP22068587 A JP 22068587A JP 22068587 A JP22068587 A JP 22068587A JP S6464293 A JPS6464293 A JP S6464293A
Authority
JP
Japan
Prior art keywords
cured
ultraviolet
resin
electronic parts
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22068587A
Other languages
Japanese (ja)
Inventor
Akinori Motomiya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP22068587A priority Critical patent/JPS6464293A/en
Publication of JPS6464293A publication Critical patent/JPS6464293A/en
Pending legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

PURPOSE:To expose the rear side of electronic parts too, by a method wherein, after ultraviolet-cured resin is selectively cured, the resin on the rear side of a substrate, which is not cured, is separated. CONSTITUTION:From the side of a retaining plate 10, ultraviolet-cured resin 40 is irradiated with ultraviolet rays, and selectively cured. At the same time, the adhesion of the retaining plate 10 is decreased. Cured ultraviolet-cuerd resin 41 and a spacer 30 become a substrate of circuit module. Ultraviolet-cured resin 42 on the flate plate 50 side of electronic parts 21, 22, 23 is in the shadow of these electronic parts, and is not irradiated with the ultraviolet rays, so that it is not cured. The retaining plate 10 and the flat plate 50 are separated, and washing is performed by using solvent, e.g. ethanol, which is matched with the material of used ultraviolet-cured resin. The part of the ultraviolet-cured resin 42 which is in the shadow and not cured is eliminated, and holes are formed. Thus, electrode terminals 21a, 22a, 23a on the surface side of the respective electronic parts 21, 22, 23 are exposed from the substrate surface, and rear electrodes on the rear side are also exposed on the rear of the substrate.
JP22068587A 1987-09-03 1987-09-03 Manufacture of circuit module Pending JPS6464293A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22068587A JPS6464293A (en) 1987-09-03 1987-09-03 Manufacture of circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22068587A JPS6464293A (en) 1987-09-03 1987-09-03 Manufacture of circuit module

Publications (1)

Publication Number Publication Date
JPS6464293A true JPS6464293A (en) 1989-03-10

Family

ID=16754872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22068587A Pending JPS6464293A (en) 1987-09-03 1987-09-03 Manufacture of circuit module

Country Status (1)

Country Link
JP (1) JPS6464293A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058464A (en) * 2014-09-08 2016-04-21 日本電気株式会社 Module component and manufacturing method of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058464A (en) * 2014-09-08 2016-04-21 日本電気株式会社 Module component and manufacturing method of the same

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