JPS5735362A - Structure of circuit substrate - Google Patents

Structure of circuit substrate

Info

Publication number
JPS5735362A
JPS5735362A JP11074980A JP11074980A JPS5735362A JP S5735362 A JPS5735362 A JP S5735362A JP 11074980 A JP11074980 A JP 11074980A JP 11074980 A JP11074980 A JP 11074980A JP S5735362 A JPS5735362 A JP S5735362A
Authority
JP
Japan
Prior art keywords
lead
circuit substrate
grounding electrode
long device
reinforcing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11074980A
Other languages
Japanese (ja)
Other versions
JPS6249984B2 (en
Inventor
Isao Komine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP11074980A priority Critical patent/JPS5735362A/en
Publication of JPS5735362A publication Critical patent/JPS5735362A/en
Publication of JPS6249984B2 publication Critical patent/JPS6249984B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To strengthen the fixing between the circuit substrate and an IC by the bridging part of the resin substrate and a reinforcing lead of copper foil which is provided thereon. CONSTITUTION:Fingers 2 are formed in long device holes a1-a4. The reinforcing lead 20 is provided on the bridging part l, and the support of an island part f is reinforced. A lead 2b for a grounding electrode is bonded to the grounding electrode of the IC so as to ground electrostatic interference. The bonding of the lead 2b can be performed without trouble by selecting the position at the approximately central part of the long device hole a1-a4. Light screening pattern 2c is provided on the island part f.
JP11074980A 1980-08-12 1980-08-12 Structure of circuit substrate Granted JPS5735362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11074980A JPS5735362A (en) 1980-08-12 1980-08-12 Structure of circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11074980A JPS5735362A (en) 1980-08-12 1980-08-12 Structure of circuit substrate

Publications (2)

Publication Number Publication Date
JPS5735362A true JPS5735362A (en) 1982-02-25
JPS6249984B2 JPS6249984B2 (en) 1987-10-22

Family

ID=14543569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11074980A Granted JPS5735362A (en) 1980-08-12 1980-08-12 Structure of circuit substrate

Country Status (1)

Country Link
JP (1) JPS5735362A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599187A (en) * 1982-07-01 1984-01-18 ナシヨナル・セミコンダクタ−・コ−ポレ−シヨン Plating apparatus
JPS6359593A (en) * 1986-08-30 1988-03-15 株式会社東芝 Mounting method in portable medium

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0263686U (en) * 1988-11-01 1990-05-14

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599187A (en) * 1982-07-01 1984-01-18 ナシヨナル・セミコンダクタ−・コ−ポレ−シヨン Plating apparatus
JPH0350840B2 (en) * 1982-07-01 1991-08-02 Nat Semiconductor Corp
JPS6359593A (en) * 1986-08-30 1988-03-15 株式会社東芝 Mounting method in portable medium

Also Published As

Publication number Publication date
JPS6249984B2 (en) 1987-10-22

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