JPS5735362A - Structure of circuit substrate - Google Patents
Structure of circuit substrateInfo
- Publication number
- JPS5735362A JPS5735362A JP11074980A JP11074980A JPS5735362A JP S5735362 A JPS5735362 A JP S5735362A JP 11074980 A JP11074980 A JP 11074980A JP 11074980 A JP11074980 A JP 11074980A JP S5735362 A JPS5735362 A JP S5735362A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- circuit substrate
- grounding electrode
- long device
- reinforcing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
Abstract
PURPOSE:To strengthen the fixing between the circuit substrate and an IC by the bridging part of the resin substrate and a reinforcing lead of copper foil which is provided thereon. CONSTITUTION:Fingers 2 are formed in long device holes a1-a4. The reinforcing lead 20 is provided on the bridging part l, and the support of an island part f is reinforced. A lead 2b for a grounding electrode is bonded to the grounding electrode of the IC so as to ground electrostatic interference. The bonding of the lead 2b can be performed without trouble by selecting the position at the approximately central part of the long device hole a1-a4. Light screening pattern 2c is provided on the island part f.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11074980A JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11074980A JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5735362A true JPS5735362A (en) | 1982-02-25 |
JPS6249984B2 JPS6249984B2 (en) | 1987-10-22 |
Family
ID=14543569
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11074980A Granted JPS5735362A (en) | 1980-08-12 | 1980-08-12 | Structure of circuit substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5735362A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599187A (en) * | 1982-07-01 | 1984-01-18 | ナシヨナル・セミコンダクタ−・コ−ポレ−シヨン | Plating apparatus |
JPS6359593A (en) * | 1986-08-30 | 1988-03-15 | 株式会社東芝 | Mounting method in portable medium |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0263686U (en) * | 1988-11-01 | 1990-05-14 |
-
1980
- 1980-08-12 JP JP11074980A patent/JPS5735362A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS599187A (en) * | 1982-07-01 | 1984-01-18 | ナシヨナル・セミコンダクタ−・コ−ポレ−シヨン | Plating apparatus |
JPH0350840B2 (en) * | 1982-07-01 | 1991-08-02 | Nat Semiconductor Corp | |
JPS6359593A (en) * | 1986-08-30 | 1988-03-15 | 株式会社東芝 | Mounting method in portable medium |
Also Published As
Publication number | Publication date |
---|---|
JPS6249984B2 (en) | 1987-10-22 |
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