JPS6462475A - Composite material and its production and method for precipitating metal - Google Patents
Composite material and its production and method for precipitating metalInfo
- Publication number
- JPS6462475A JPS6462475A JP21643787A JP21643787A JPS6462475A JP S6462475 A JPS6462475 A JP S6462475A JP 21643787 A JP21643787 A JP 21643787A JP 21643787 A JP21643787 A JP 21643787A JP S6462475 A JPS6462475 A JP S6462475A
- Authority
- JP
- Japan
- Prior art keywords
- metallic
- layer
- composite material
- carrier
- production
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To obtain a composite material in which uniform metallic layer is carried on a carrier, by allowing silicone polymer having an Si-H part to be carried on the surface of a carrier and then treating the above with a metallic salt solution so as to form plural metallic layers on a polymer layer. CONSTITUTION:A carrier carrying a silicone polymer layer having an Si-H part is treated with a metallic salt solution, by which the silicone polymer layer and a metallic layer are allowed to be carried on the surface of the carrier. The above metallic layer is formed of a first metallic layer and a second metallic layer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62216437A JP2635331B2 (en) | 1987-09-01 | 1987-09-01 | Composite material, method for producing the same, and method for depositing metal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62216437A JP2635331B2 (en) | 1987-09-01 | 1987-09-01 | Composite material, method for producing the same, and method for depositing metal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6462475A true JPS6462475A (en) | 1989-03-08 |
JP2635331B2 JP2635331B2 (en) | 1997-07-30 |
Family
ID=16688533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62216437A Expired - Fee Related JP2635331B2 (en) | 1987-09-01 | 1987-09-01 | Composite material, method for producing the same, and method for depositing metal |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2635331B2 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000129211A (en) * | 1998-10-22 | 2000-05-09 | Shin Etsu Chem Co Ltd | Film-forming polysilane composition for metallic pattern and method for forming metallic pattern |
WO2002088423A1 (en) * | 2001-04-27 | 2002-11-07 | Sumitomo Special Metals Co., Ltd. | Copper plating solution and method for copper plating |
KR100537130B1 (en) * | 1999-05-13 | 2005-12-16 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Conductive Powder and Making Process |
WO2006057242A1 (en) * | 2004-11-25 | 2006-06-01 | Mitsui Chemicals, Inc. | Method for reducing transition metal, and method for treating surface of silicon-containing polymer, method for preparing fine transition metal particles and method for producing article and wiring board, using the reducing method |
WO2007119417A1 (en) * | 2006-03-28 | 2007-10-25 | Nippon Chemical Industrial Co., Ltd | Conductive powder plated by electroless plating and process for producing the same |
JP2009105264A (en) * | 2007-10-24 | 2009-05-14 | Fujitsu Ltd | Method for manufacturing circuit board |
JP2009154474A (en) * | 2007-12-27 | 2009-07-16 | Bekku Kk | Laminated body |
JP2010083954A (en) * | 2008-09-30 | 2010-04-15 | Nippon Shokubai Co Ltd | Polymer microparticle, method for manufacturing the same, and electroconductive microparticle |
JP2012501374A (en) * | 2008-08-29 | 2012-01-19 | ダウ コーニング コーポレーション | Metallized particles formed from dispersions |
US8349928B2 (en) | 2007-10-11 | 2013-01-08 | Dow Corning Toray Co., Ltd. | Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6013320A (en) * | 1983-07-01 | 1985-01-23 | Clarion Co Ltd | Device for adjusting height of head in video tape recorder |
-
1987
- 1987-09-01 JP JP62216437A patent/JP2635331B2/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6013320A (en) * | 1983-07-01 | 1985-01-23 | Clarion Co Ltd | Device for adjusting height of head in video tape recorder |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000129211A (en) * | 1998-10-22 | 2000-05-09 | Shin Etsu Chem Co Ltd | Film-forming polysilane composition for metallic pattern and method for forming metallic pattern |
KR100537130B1 (en) * | 1999-05-13 | 2005-12-16 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Conductive Powder and Making Process |
WO2002088423A1 (en) * | 2001-04-27 | 2002-11-07 | Sumitomo Special Metals Co., Ltd. | Copper plating solution and method for copper plating |
JP2002327278A (en) * | 2001-04-27 | 2002-11-15 | Sumitomo Special Metals Co Ltd | Copper plating liquid and copper plating method |
US7517555B2 (en) | 2001-04-27 | 2009-04-14 | Hitachi Metals, Ltd. | Copper plating solution and method for copper plating |
JPWO2006057242A1 (en) * | 2004-11-25 | 2008-06-05 | 三井化学株式会社 | Transition metal reduction method, silicon-containing polymer surface treatment method using the same, transition metal fine particle production method, article, and wiring board production method |
WO2006057242A1 (en) * | 2004-11-25 | 2006-06-01 | Mitsui Chemicals, Inc. | Method for reducing transition metal, and method for treating surface of silicon-containing polymer, method for preparing fine transition metal particles and method for producing article and wiring board, using the reducing method |
WO2007119417A1 (en) * | 2006-03-28 | 2007-10-25 | Nippon Chemical Industrial Co., Ltd | Conductive powder plated by electroless plating and process for producing the same |
TWI419996B (en) * | 2006-03-28 | 2013-12-21 | Nippon Chemical Ind | Conductive electroless plating powder and its manufacturing method |
US8349928B2 (en) | 2007-10-11 | 2013-01-08 | Dow Corning Toray Co., Ltd. | Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding |
JP2009105264A (en) * | 2007-10-24 | 2009-05-14 | Fujitsu Ltd | Method for manufacturing circuit board |
JP2009154474A (en) * | 2007-12-27 | 2009-07-16 | Bekku Kk | Laminated body |
JP2012501374A (en) * | 2008-08-29 | 2012-01-19 | ダウ コーニング コーポレーション | Metallized particles formed from dispersions |
US8715828B2 (en) | 2008-08-29 | 2014-05-06 | Dow Corning Corporation | Emulsion of metallized particles comprising a compound having a pendant Si-H group |
JP2010083954A (en) * | 2008-09-30 | 2010-04-15 | Nippon Shokubai Co Ltd | Polymer microparticle, method for manufacturing the same, and electroconductive microparticle |
Also Published As
Publication number | Publication date |
---|---|
JP2635331B2 (en) | 1997-07-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |