JPS6462475A - Composite material and its production and method for precipitating metal - Google Patents

Composite material and its production and method for precipitating metal

Info

Publication number
JPS6462475A
JPS6462475A JP21643787A JP21643787A JPS6462475A JP S6462475 A JPS6462475 A JP S6462475A JP 21643787 A JP21643787 A JP 21643787A JP 21643787 A JP21643787 A JP 21643787A JP S6462475 A JPS6462475 A JP S6462475A
Authority
JP
Japan
Prior art keywords
metallic
layer
composite material
carrier
production
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21643787A
Other languages
Japanese (ja)
Other versions
JP2635331B2 (en
Inventor
Hiroshi Fukui
Tomo Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shiseido Co Ltd
Original Assignee
Shiseido Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shiseido Co Ltd filed Critical Shiseido Co Ltd
Priority to JP62216437A priority Critical patent/JP2635331B2/en
Publication of JPS6462475A publication Critical patent/JPS6462475A/en
Application granted granted Critical
Publication of JP2635331B2 publication Critical patent/JP2635331B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To obtain a composite material in which uniform metallic layer is carried on a carrier, by allowing silicone polymer having an Si-H part to be carried on the surface of a carrier and then treating the above with a metallic salt solution so as to form plural metallic layers on a polymer layer. CONSTITUTION:A carrier carrying a silicone polymer layer having an Si-H part is treated with a metallic salt solution, by which the silicone polymer layer and a metallic layer are allowed to be carried on the surface of the carrier. The above metallic layer is formed of a first metallic layer and a second metallic layer.
JP62216437A 1987-09-01 1987-09-01 Composite material, method for producing the same, and method for depositing metal Expired - Fee Related JP2635331B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62216437A JP2635331B2 (en) 1987-09-01 1987-09-01 Composite material, method for producing the same, and method for depositing metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62216437A JP2635331B2 (en) 1987-09-01 1987-09-01 Composite material, method for producing the same, and method for depositing metal

Publications (2)

Publication Number Publication Date
JPS6462475A true JPS6462475A (en) 1989-03-08
JP2635331B2 JP2635331B2 (en) 1997-07-30

Family

ID=16688533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62216437A Expired - Fee Related JP2635331B2 (en) 1987-09-01 1987-09-01 Composite material, method for producing the same, and method for depositing metal

Country Status (1)

Country Link
JP (1) JP2635331B2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000129211A (en) * 1998-10-22 2000-05-09 Shin Etsu Chem Co Ltd Film-forming polysilane composition for metallic pattern and method for forming metallic pattern
WO2002088423A1 (en) * 2001-04-27 2002-11-07 Sumitomo Special Metals Co., Ltd. Copper plating solution and method for copper plating
KR100537130B1 (en) * 1999-05-13 2005-12-16 신에쓰 가가꾸 고교 가부시끼가이샤 Conductive Powder and Making Process
WO2006057242A1 (en) * 2004-11-25 2006-06-01 Mitsui Chemicals, Inc. Method for reducing transition metal, and method for treating surface of silicon-containing polymer, method for preparing fine transition metal particles and method for producing article and wiring board, using the reducing method
WO2007119417A1 (en) * 2006-03-28 2007-10-25 Nippon Chemical Industrial Co., Ltd Conductive powder plated by electroless plating and process for producing the same
JP2009105264A (en) * 2007-10-24 2009-05-14 Fujitsu Ltd Method for manufacturing circuit board
JP2009154474A (en) * 2007-12-27 2009-07-16 Bekku Kk Laminated body
JP2010083954A (en) * 2008-09-30 2010-04-15 Nippon Shokubai Co Ltd Polymer microparticle, method for manufacturing the same, and electroconductive microparticle
JP2012501374A (en) * 2008-08-29 2012-01-19 ダウ コーニング コーポレーション Metallized particles formed from dispersions
US8349928B2 (en) 2007-10-11 2013-01-08 Dow Corning Toray Co., Ltd. Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013320A (en) * 1983-07-01 1985-01-23 Clarion Co Ltd Device for adjusting height of head in video tape recorder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6013320A (en) * 1983-07-01 1985-01-23 Clarion Co Ltd Device for adjusting height of head in video tape recorder

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000129211A (en) * 1998-10-22 2000-05-09 Shin Etsu Chem Co Ltd Film-forming polysilane composition for metallic pattern and method for forming metallic pattern
KR100537130B1 (en) * 1999-05-13 2005-12-16 신에쓰 가가꾸 고교 가부시끼가이샤 Conductive Powder and Making Process
WO2002088423A1 (en) * 2001-04-27 2002-11-07 Sumitomo Special Metals Co., Ltd. Copper plating solution and method for copper plating
JP2002327278A (en) * 2001-04-27 2002-11-15 Sumitomo Special Metals Co Ltd Copper plating liquid and copper plating method
US7517555B2 (en) 2001-04-27 2009-04-14 Hitachi Metals, Ltd. Copper plating solution and method for copper plating
JPWO2006057242A1 (en) * 2004-11-25 2008-06-05 三井化学株式会社 Transition metal reduction method, silicon-containing polymer surface treatment method using the same, transition metal fine particle production method, article, and wiring board production method
WO2006057242A1 (en) * 2004-11-25 2006-06-01 Mitsui Chemicals, Inc. Method for reducing transition metal, and method for treating surface of silicon-containing polymer, method for preparing fine transition metal particles and method for producing article and wiring board, using the reducing method
WO2007119417A1 (en) * 2006-03-28 2007-10-25 Nippon Chemical Industrial Co., Ltd Conductive powder plated by electroless plating and process for producing the same
TWI419996B (en) * 2006-03-28 2013-12-21 Nippon Chemical Ind Conductive electroless plating powder and its manufacturing method
US8349928B2 (en) 2007-10-11 2013-01-08 Dow Corning Toray Co., Ltd. Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding
JP2009105264A (en) * 2007-10-24 2009-05-14 Fujitsu Ltd Method for manufacturing circuit board
JP2009154474A (en) * 2007-12-27 2009-07-16 Bekku Kk Laminated body
JP2012501374A (en) * 2008-08-29 2012-01-19 ダウ コーニング コーポレーション Metallized particles formed from dispersions
US8715828B2 (en) 2008-08-29 2014-05-06 Dow Corning Corporation Emulsion of metallized particles comprising a compound having a pendant Si-H group
JP2010083954A (en) * 2008-09-30 2010-04-15 Nippon Shokubai Co Ltd Polymer microparticle, method for manufacturing the same, and electroconductive microparticle

Also Published As

Publication number Publication date
JP2635331B2 (en) 1997-07-30

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