JPS6461245A - Multilayer printed wiring board - Google Patents

Multilayer printed wiring board

Info

Publication number
JPS6461245A
JPS6461245A JP21939187A JP21939187A JPS6461245A JP S6461245 A JPS6461245 A JP S6461245A JP 21939187 A JP21939187 A JP 21939187A JP 21939187 A JP21939187 A JP 21939187A JP S6461245 A JPS6461245 A JP S6461245A
Authority
JP
Japan
Prior art keywords
inner layer
wiring board
printed wiring
multilayer printed
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21939187A
Other languages
Japanese (ja)
Inventor
Hideto Misawa
Shoji Fujikawa
Katsutoshi Hirakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP21939187A priority Critical patent/JPS6461245A/en
Publication of JPS6461245A publication Critical patent/JPS6461245A/en
Pending legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PURPOSE:To obtain a multilayer printed wiring board with low dielectric constant by using a specified resin for an inner layer. CONSTITUTION:An inner layer 1, a prepreg 2 and an outer layer 3 are prelimi narily made. As the inner layer 1, the material in which the circuits becoming inner layer circuits are formed on both surfaces of the laminated sheet of ethyl ene tetrafluoride resin, is used. In the multilayer printed wiring board, since ethylene tetrafluoride resin is used for the resin constituting the inner layer 1, while the dielectric constant of the multilayer printed wiring board may be lowered, the thermal deformation of the inner layer is prevented in forming the multilayers, and its dimension change may be minimized.
JP21939187A 1987-09-02 1987-09-02 Multilayer printed wiring board Pending JPS6461245A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21939187A JPS6461245A (en) 1987-09-02 1987-09-02 Multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21939187A JPS6461245A (en) 1987-09-02 1987-09-02 Multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPS6461245A true JPS6461245A (en) 1989-03-08

Family

ID=16734682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21939187A Pending JPS6461245A (en) 1987-09-02 1987-09-02 Multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS6461245A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340493A (en) * 1989-07-07 1991-02-21 Matsushita Electric Works Ltd Multilayered printed wiring board
JP2014128971A (en) * 2012-11-29 2014-07-10 Panasonic Corp Method for manufacturing metal-clad laminate, and printed wiring board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340493A (en) * 1989-07-07 1991-02-21 Matsushita Electric Works Ltd Multilayered printed wiring board
JP2014128971A (en) * 2012-11-29 2014-07-10 Panasonic Corp Method for manufacturing metal-clad laminate, and printed wiring board

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