JPS6457999A - Water soluble flux for soldering - Google Patents

Water soluble flux for soldering

Info

Publication number
JPS6457999A
JPS6457999A JP21351287A JP21351287A JPS6457999A JP S6457999 A JPS6457999 A JP S6457999A JP 21351287 A JP21351287 A JP 21351287A JP 21351287 A JP21351287 A JP 21351287A JP S6457999 A JPS6457999 A JP S6457999A
Authority
JP
Japan
Prior art keywords
acid
materials
soldering
flux
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21351287A
Other languages
Japanese (ja)
Inventor
Shuji Yoshida
Hiroki Kodama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shikoku Chemicals Corp
Original Assignee
Shikoku Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shikoku Chemicals Corp filed Critical Shikoku Chemicals Corp
Priority to JP21351287A priority Critical patent/JPS6457999A/en
Publication of JPS6457999A publication Critical patent/JPS6457999A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3618—Carboxylic acids or salts

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To obtain high solderability without using hydrohalogenic acid by using glutaric acid as the essential component of a water soluble flux for soldering. CONSTITUTION:Since the glutaric acid exhibits high solubility in water, alcohols, esters, ethers, and ketones, any solvents are usable for dissolving said acid. In addition, said acid has high solubility in water and the residues after soldering are easily removable by rinsing. The glutaric acid may be used alone as an activator or may be used in conjunction with other additives. Workability control materials which adjust the viscosity of the flux and the evaporation rate and foaming characteristics of the solvent may be added thereto. The addition of materials having the effect of erasing the luster of the solder, materials for imparting fire retardance to the residues of the flux and materials for improving the various electrical characteristics of electronic circuits and preventing corrosiveness thereof to the above-mentioned acid is also possible.
JP21351287A 1987-08-26 1987-08-26 Water soluble flux for soldering Pending JPS6457999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21351287A JPS6457999A (en) 1987-08-26 1987-08-26 Water soluble flux for soldering

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21351287A JPS6457999A (en) 1987-08-26 1987-08-26 Water soluble flux for soldering

Publications (1)

Publication Number Publication Date
JPS6457999A true JPS6457999A (en) 1989-03-06

Family

ID=16640420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21351287A Pending JPS6457999A (en) 1987-08-26 1987-08-26 Water soluble flux for soldering

Country Status (1)

Country Link
JP (1) JPS6457999A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08506528A (en) * 1993-02-05 1996-07-16 ステファノウィスキー・クリスティーナ Volatile organic compound-free soldering flux solution that does not require cleaning and has low residue, and method of use
KR20160044646A (en) * 2014-10-15 2016-04-26 덕산하이메탈(주) Soldering flux

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5021308A (en) * 1973-06-28 1975-03-06

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5021308A (en) * 1973-06-28 1975-03-06

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08506528A (en) * 1993-02-05 1996-07-16 ステファノウィスキー・クリスティーナ Volatile organic compound-free soldering flux solution that does not require cleaning and has low residue, and method of use
KR20160044646A (en) * 2014-10-15 2016-04-26 덕산하이메탈(주) Soldering flux

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