JPS6457691A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6457691A JPS6457691A JP62213088A JP21308887A JPS6457691A JP S6457691 A JPS6457691 A JP S6457691A JP 62213088 A JP62213088 A JP 62213088A JP 21308887 A JP21308887 A JP 21308887A JP S6457691 A JPS6457691 A JP S6457691A
- Authority
- JP
- Japan
- Prior art keywords
- submount
- sink
- fixed
- heat sink
- fixing materials
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Semiconductor Lasers (AREA)
Abstract
PURPOSE:To make it enough to perform temperature rise and cooling only once in a semiconductor element mounting process, wherein a submount is used, and to make it possible to realize a high-mounting position accuracy and highly reliable mounting, by a method wherein fixing material is formed in advance on both sides of the submount, and the element, the submount and a heat sink are fusion bonded simultaneously. CONSTITUTION:In case a semiconductor element 12 is fixed on a heat sink 11 through a submount 9 to manufacture a semiconductor device, fixing materials 5 consisting of the same kind of a material are respectively ready-formed in advance on both surfaces of a surface, on which the element 12 is fixed, of the submount 9, and a surface, which is fixed on the sink 1, of the submount 9. Moreover, after the above submount 9 and the element 12 are respectively arranged on the sink 1 and the submount 9, the element, the submount and the heat sink are heated at the melting point or more of the fixing materials and after that, are cooled. Thereby, the element 2 and the submount 9 are each mounted simultaneously on the submount 9 and the sink 1. For example, a Ti layer and a Pt layer are each formed on both surfaces of the submount 9 consisting of Si as electrode layers 7 and Au-Ge layers, which are used as the fixing materials 5, are each formed on the surfaces of both electrode layers 7 by vacuum deposition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62213088A JPS6457691A (en) | 1987-08-28 | 1987-08-28 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62213088A JPS6457691A (en) | 1987-08-28 | 1987-08-28 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6457691A true JPS6457691A (en) | 1989-03-03 |
Family
ID=16633357
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62213088A Pending JPS6457691A (en) | 1987-08-28 | 1987-08-28 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6457691A (en) |
-
1987
- 1987-08-28 JP JP62213088A patent/JPS6457691A/en active Pending
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