JPS6451707A - Manufacture of surface acoustic wave chip device - Google Patents

Manufacture of surface acoustic wave chip device

Info

Publication number
JPS6451707A
JPS6451707A JP20905987A JP20905987A JPS6451707A JP S6451707 A JPS6451707 A JP S6451707A JP 20905987 A JP20905987 A JP 20905987A JP 20905987 A JP20905987 A JP 20905987A JP S6451707 A JPS6451707 A JP S6451707A
Authority
JP
Japan
Prior art keywords
wafer
acoustic wave
surface acoustic
bonded
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20905987A
Other languages
Japanese (ja)
Inventor
Takaya Watanabe
Yasunobu Iwanaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20905987A priority Critical patent/JPS6451707A/en
Publication of JPS6451707A publication Critical patent/JPS6451707A/en
Pending legal-status Critical Current

Links

Landscapes

  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

PURPOSE:To simply manufacture a surface acoustic wave chip device with a small height by forming an adhesive layer around the wafer surface and cutting off the wafer after the wafer is bonded to a frame where many caps are incorporated. CONSTITUTION:Plural continuous bonding layers 14 are formed at the surrounding of the part of plural chips 12 formed on the wafer 11 except the outer connection terminals of the pattern of the surface acoustic wave device. The frame 21 incorporated with many caps is generated via leads 23a, 23b so as to oppose respectively to plural bonding layers 14 formed to the wafer 11 by a bonding end 22a and they are overlapped and bonded. Then the wafer 11 bonded with the frame 21 is cut into chips 12.
JP20905987A 1987-08-21 1987-08-21 Manufacture of surface acoustic wave chip device Pending JPS6451707A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20905987A JPS6451707A (en) 1987-08-21 1987-08-21 Manufacture of surface acoustic wave chip device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20905987A JPS6451707A (en) 1987-08-21 1987-08-21 Manufacture of surface acoustic wave chip device

Publications (1)

Publication Number Publication Date
JPS6451707A true JPS6451707A (en) 1989-02-28

Family

ID=16566574

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20905987A Pending JPS6451707A (en) 1987-08-21 1987-08-21 Manufacture of surface acoustic wave chip device

Country Status (1)

Country Link
JP (1) JPS6451707A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316496A (en) * 1995-05-17 1996-11-29 Nippondenso Co Ltd Manufacture of semiconductor device
US7042056B2 (en) 2002-07-31 2006-05-09 Murata Manufacturing Co., Ltd. Chip-size package piezoelectric component
US7102272B2 (en) 2002-07-31 2006-09-05 Murata Manufacturing Co., Ltd. Piezoelectric component and method for manufacturing the same
JP2009074508A (en) * 2007-09-25 2009-04-09 Honda Motor Co Ltd Lubricating structure of valve gear

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057712A (en) * 1983-09-08 1985-04-03 Murata Mfg Co Ltd Manufacture of surface acoustic wave element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057712A (en) * 1983-09-08 1985-04-03 Murata Mfg Co Ltd Manufacture of surface acoustic wave element

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08316496A (en) * 1995-05-17 1996-11-29 Nippondenso Co Ltd Manufacture of semiconductor device
US7042056B2 (en) 2002-07-31 2006-05-09 Murata Manufacturing Co., Ltd. Chip-size package piezoelectric component
US7102272B2 (en) 2002-07-31 2006-09-05 Murata Manufacturing Co., Ltd. Piezoelectric component and method for manufacturing the same
JP2009074508A (en) * 2007-09-25 2009-04-09 Honda Motor Co Ltd Lubricating structure of valve gear

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