JPS6451707A - Manufacture of surface acoustic wave chip device - Google Patents
Manufacture of surface acoustic wave chip deviceInfo
- Publication number
- JPS6451707A JPS6451707A JP20905987A JP20905987A JPS6451707A JP S6451707 A JPS6451707 A JP S6451707A JP 20905987 A JP20905987 A JP 20905987A JP 20905987 A JP20905987 A JP 20905987A JP S6451707 A JPS6451707 A JP S6451707A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- acoustic wave
- surface acoustic
- bonded
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
PURPOSE:To simply manufacture a surface acoustic wave chip device with a small height by forming an adhesive layer around the wafer surface and cutting off the wafer after the wafer is bonded to a frame where many caps are incorporated. CONSTITUTION:Plural continuous bonding layers 14 are formed at the surrounding of the part of plural chips 12 formed on the wafer 11 except the outer connection terminals of the pattern of the surface acoustic wave device. The frame 21 incorporated with many caps is generated via leads 23a, 23b so as to oppose respectively to plural bonding layers 14 formed to the wafer 11 by a bonding end 22a and they are overlapped and bonded. Then the wafer 11 bonded with the frame 21 is cut into chips 12.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20905987A JPS6451707A (en) | 1987-08-21 | 1987-08-21 | Manufacture of surface acoustic wave chip device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20905987A JPS6451707A (en) | 1987-08-21 | 1987-08-21 | Manufacture of surface acoustic wave chip device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6451707A true JPS6451707A (en) | 1989-02-28 |
Family
ID=16566574
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20905987A Pending JPS6451707A (en) | 1987-08-21 | 1987-08-21 | Manufacture of surface acoustic wave chip device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6451707A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08316496A (en) * | 1995-05-17 | 1996-11-29 | Nippondenso Co Ltd | Manufacture of semiconductor device |
US7042056B2 (en) | 2002-07-31 | 2006-05-09 | Murata Manufacturing Co., Ltd. | Chip-size package piezoelectric component |
US7102272B2 (en) | 2002-07-31 | 2006-09-05 | Murata Manufacturing Co., Ltd. | Piezoelectric component and method for manufacturing the same |
JP2009074508A (en) * | 2007-09-25 | 2009-04-09 | Honda Motor Co Ltd | Lubricating structure of valve gear |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6057712A (en) * | 1983-09-08 | 1985-04-03 | Murata Mfg Co Ltd | Manufacture of surface acoustic wave element |
-
1987
- 1987-08-21 JP JP20905987A patent/JPS6451707A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6057712A (en) * | 1983-09-08 | 1985-04-03 | Murata Mfg Co Ltd | Manufacture of surface acoustic wave element |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08316496A (en) * | 1995-05-17 | 1996-11-29 | Nippondenso Co Ltd | Manufacture of semiconductor device |
US7042056B2 (en) | 2002-07-31 | 2006-05-09 | Murata Manufacturing Co., Ltd. | Chip-size package piezoelectric component |
US7102272B2 (en) | 2002-07-31 | 2006-09-05 | Murata Manufacturing Co., Ltd. | Piezoelectric component and method for manufacturing the same |
JP2009074508A (en) * | 2007-09-25 | 2009-04-09 | Honda Motor Co Ltd | Lubricating structure of valve gear |
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