JPS5335380A - Production of semiconductor device using film carrier tape - Google Patents

Production of semiconductor device using film carrier tape

Info

Publication number
JPS5335380A
JPS5335380A JP10959376A JP10959376A JPS5335380A JP S5335380 A JPS5335380 A JP S5335380A JP 10959376 A JP10959376 A JP 10959376A JP 10959376 A JP10959376 A JP 10959376A JP S5335380 A JPS5335380 A JP S5335380A
Authority
JP
Japan
Prior art keywords
carrier tape
production
semiconductor device
film carrier
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10959376A
Other languages
Japanese (ja)
Inventor
Mitsuru Imai
Toshio Matsubayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP10959376A priority Critical patent/JPS5335380A/en
Publication of JPS5335380A publication Critical patent/JPS5335380A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent the deformation of leads by providing supports integrally connecting cantilever form leads within the openings of a carrier tape and cutting the supports immediate before chip bonding.
JP10959376A 1976-09-13 1976-09-13 Production of semiconductor device using film carrier tape Pending JPS5335380A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10959376A JPS5335380A (en) 1976-09-13 1976-09-13 Production of semiconductor device using film carrier tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10959376A JPS5335380A (en) 1976-09-13 1976-09-13 Production of semiconductor device using film carrier tape

Publications (1)

Publication Number Publication Date
JPS5335380A true JPS5335380A (en) 1978-04-01

Family

ID=14514186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10959376A Pending JPS5335380A (en) 1976-09-13 1976-09-13 Production of semiconductor device using film carrier tape

Country Status (1)

Country Link
JP (1) JPS5335380A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754670A (en) * 1980-09-20 1982-04-01 Touhoku Nitsupatsu Kk Stopper for frame structure
CN1062989C (en) * 1995-09-08 2001-03-07 株式会社日立制作所 Distribution base panel and electric power conversion arrangement using same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5754670A (en) * 1980-09-20 1982-04-01 Touhoku Nitsupatsu Kk Stopper for frame structure
CN1062989C (en) * 1995-09-08 2001-03-07 株式会社日立制作所 Distribution base panel and electric power conversion arrangement using same

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Legal Events

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A601 Written request for extension of time

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Effective date: 20040811

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Effective date: 20040823

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Effective date: 20041104