JPS6447863A - Method for joining sputtering target - Google Patents

Method for joining sputtering target

Info

Publication number
JPS6447863A
JPS6447863A JP20157187A JP20157187A JPS6447863A JP S6447863 A JPS6447863 A JP S6447863A JP 20157187 A JP20157187 A JP 20157187A JP 20157187 A JP20157187 A JP 20157187A JP S6447863 A JPS6447863 A JP S6447863A
Authority
JP
Japan
Prior art keywords
alloy powder
sheet
target
temp
binder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20157187A
Other languages
English (en)
Inventor
Itsuro Takenoshita
Takashi Tominaga
Takafumi Sakuramoto
Tsuyoshi Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daido Steel Co Ltd
Nitto Denko Corp
Original Assignee
Daido Steel Co Ltd
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daido Steel Co Ltd, Nitto Denko Corp filed Critical Daido Steel Co Ltd
Priority to JP20157187A priority Critical patent/JPS6447863A/ja
Publication of JPS6447863A publication Critical patent/JPS6447863A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP20157187A 1987-08-11 1987-08-11 Method for joining sputtering target Pending JPS6447863A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20157187A JPS6447863A (en) 1987-08-11 1987-08-11 Method for joining sputtering target

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20157187A JPS6447863A (en) 1987-08-11 1987-08-11 Method for joining sputtering target

Publications (1)

Publication Number Publication Date
JPS6447863A true JPS6447863A (en) 1989-02-22

Family

ID=16443267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20157187A Pending JPS6447863A (en) 1987-08-11 1987-08-11 Method for joining sputtering target

Country Status (1)

Country Link
JP (1) JPS6447863A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6158174A (ja) * 1984-08-20 1986-03-25 Mitsubishi Electric Corp 燃料電池
US6451185B2 (en) 1998-08-12 2002-09-17 Honeywell International Inc. Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
US6555250B2 (en) * 1997-03-19 2003-04-29 Honeywell International Inc. Ni-plated target diffusion bonded to a backing plate and method of making same
CN110129755A (zh) * 2019-06-05 2019-08-16 深圳市华星光电技术有限公司 磁控溅射靶材和磁控溅射装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6158174A (ja) * 1984-08-20 1986-03-25 Mitsubishi Electric Corp 燃料電池
US6555250B2 (en) * 1997-03-19 2003-04-29 Honeywell International Inc. Ni-plated target diffusion bonded to a backing plate and method of making same
US6451185B2 (en) 1998-08-12 2002-09-17 Honeywell International Inc. Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
CN110129755A (zh) * 2019-06-05 2019-08-16 深圳市华星光电技术有限公司 磁控溅射靶材和磁控溅射装置

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