JPS644682A - Heat-resistant adhesive composition - Google Patents

Heat-resistant adhesive composition

Info

Publication number
JPS644682A
JPS644682A JP15751487A JP15751487A JPS644682A JP S644682 A JPS644682 A JP S644682A JP 15751487 A JP15751487 A JP 15751487A JP 15751487 A JP15751487 A JP 15751487A JP S644682 A JPS644682 A JP S644682A
Authority
JP
Japan
Prior art keywords
epoxy
formula
component
cure accelerator
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15751487A
Other languages
Japanese (ja)
Other versions
JPH0745650B2 (en
Inventor
Itsuo Matsuda
Tokuo Kurokawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP15751487A priority Critical patent/JPH0745650B2/en
Publication of JPS644682A publication Critical patent/JPS644682A/en
Publication of JPH0745650B2 publication Critical patent/JPH0745650B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE:To obtain the title composition excellent in heat resistance, moisture resistance, adhesiveness, electrical properties, processability and storage stability, by mixing an acryl elastomer with a specified addition-polymerizable polyimide, an epoxy compound and a cure accelerator. CONSTITUTION:An addition-polymerizable polyimide (B) is obtained by reacting an unsaturated dicarboxylic acid N,N'-bisimide compound (a) of formula I (wherein R<1> is a 2C or higher bivalent group, and R<2> is a carbon-carbon double bond-containing bivalent group) with an aminophenol (b) of formula II (wherein R<3> is H, a halogen or an alkyl) and an aniline (derivative) (c) of formula III (wherein R<4-5> are each R<3>, -OCH3 or -OC2H5 which is an active hydrogen-free group). 5-50wt.% (based on the total of components A-C) acrylic elastomer (A) having at least one functional group selected from epoxy, COOH and OH is mixed with component B, an epoxy resin (C) having at least two epoxy groups in the molecule and 0.01-5wt.% (based on component C) cure accelerator (D) such as dicyandiamide.
JP15751487A 1987-06-26 1987-06-26 Heat resistant adhesive composition Expired - Lifetime JPH0745650B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15751487A JPH0745650B2 (en) 1987-06-26 1987-06-26 Heat resistant adhesive composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15751487A JPH0745650B2 (en) 1987-06-26 1987-06-26 Heat resistant adhesive composition

Publications (2)

Publication Number Publication Date
JPS644682A true JPS644682A (en) 1989-01-09
JPH0745650B2 JPH0745650B2 (en) 1995-05-17

Family

ID=15651340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15751487A Expired - Lifetime JPH0745650B2 (en) 1987-06-26 1987-06-26 Heat resistant adhesive composition

Country Status (1)

Country Link
JP (1) JPH0745650B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164463A (en) * 1989-10-23 1992-11-17 Ho Kam W Bismaleimide compositions with epoxide-aromatic amine fortifiers
WO2000046315A1 (en) * 1999-02-08 2000-08-10 Hitachi Chemical Co., Ltd. Adhesive, electrode-connecting structure, and method of connecting electrodes
WO2009066658A1 (en) * 2007-11-19 2009-05-28 Nihon Parkerizing Co., Ltd. Base processing agent for metal material and method for processing base for metal material

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5164463A (en) * 1989-10-23 1992-11-17 Ho Kam W Bismaleimide compositions with epoxide-aromatic amine fortifiers
WO2000046315A1 (en) * 1999-02-08 2000-08-10 Hitachi Chemical Co., Ltd. Adhesive, electrode-connecting structure, and method of connecting electrodes
CN100357382C (en) * 1999-02-08 2007-12-26 日立化成工业株式会社 Adhesive, electrode-connecting structure, and method of connecting electrodes
WO2009066658A1 (en) * 2007-11-19 2009-05-28 Nihon Parkerizing Co., Ltd. Base processing agent for metal material and method for processing base for metal material
JP5167270B2 (en) * 2007-11-19 2013-03-21 日本パーカライジング株式会社 Ground treatment agent for metal material and method for ground treatment of metal material
TWI424087B (en) * 2007-11-19 2014-01-21 Nihon Parkerizing Submerged treatment of metallic materials and bottom treatment of metallic materials

Also Published As

Publication number Publication date
JPH0745650B2 (en) 1995-05-17

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