JPS6435984A - Manufacture of electric circuit molding - Google Patents

Abstract

PURPOSE:To efficiently manufacture a synthetic resin molding formed preferably with an electric circuit on a recess by forming the circuit on a carrier film, bonding a pattern film through a self-adhesive layer on a core surface, then exfoliating only the film, and pouring synthetic resin in a cavity between a female mold and a metal mold core facing the mold. CONSTITUTION:An electric circuit pattern film formed with an electric circuit 3 is brought into close contact with a self-adhesive layer 4, the face of a metal mold core 5 is pressed, and a carrier film 1 is exfoliated to bond the circuit 3 through the layer 4 to the core 5 surface. Then, liquid-like thermosetting synthetic resin or melted thermoplastic synthetic resin 8 is poured to be cured or cooled to be solidified in a cavity between the core 5 to which the circuit 3 is bonded and a female mold 6 to bury by half the circuit 3 on the core surface in the recess face of the molding, thereby obtaining a synthetic resin molding integrated with the circuit on its surface. Thus, the synthetic resin molding of complicated shape in which the circuit is buried in the recess face of the molding can be efficiently manufactured.