JPS6435926A - Reliability testing system for semiconductor element - Google Patents
Reliability testing system for semiconductor elementInfo
- Publication number
- JPS6435926A JPS6435926A JP19080887A JP19080887A JPS6435926A JP S6435926 A JPS6435926 A JP S6435926A JP 19080887 A JP19080887 A JP 19080887A JP 19080887 A JP19080887 A JP 19080887A JP S6435926 A JPS6435926 A JP S6435926A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor elements
- probes
- semiconductor element
- reliability test
- testing system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE:To enable the reliability test of multiple semiconductor elements to be performed simultaneously by a method wherein the multiple semiconductor elements are impressed with specified stress signals through the intermediary of multiple probes. CONSTITUTION:A probe card 4 provided with multiple probes 4a corresponding to electrode pads of multiple semiconductor elements formed on a semiconductor wafer 3 is arranged on a mounting base 1a while the probes 4a are implanted corresponding to the electrode pads of multiple semiconductor elements formed on the semiconductor wafer 3. Then, the reliability test of these semiconductor elements is performed by impressing respective semiconductor elements with specified stress signals from a tester 2 through the intermediary of these probes 4a. Through these procedures, the reliability test of multiple semiconductor elements can be performed simultaneously.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62190808A JP2526252B2 (en) | 1987-07-30 | 1987-07-30 | Reliability test method for semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62190808A JP2526252B2 (en) | 1987-07-30 | 1987-07-30 | Reliability test method for semiconductor devices |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6435926A true JPS6435926A (en) | 1989-02-07 |
JP2526252B2 JP2526252B2 (en) | 1996-08-21 |
Family
ID=16264090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62190808A Expired - Lifetime JP2526252B2 (en) | 1987-07-30 | 1987-07-30 | Reliability test method for semiconductor devices |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2526252B2 (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50120779A (en) * | 1974-03-08 | 1975-09-22 | ||
JPS59134845A (en) * | 1983-01-21 | 1984-08-02 | Hitachi Ltd | Probe card |
JPS6059745A (en) * | 1983-09-13 | 1985-04-06 | Nec Corp | Probe substrate for measuring semiconductor integrated circuit |
JPS6113932A (en) * | 1984-06-29 | 1986-01-22 | 松下電器産業株式会社 | Power controller of cleaner |
JPS6170734A (en) * | 1984-09-13 | 1986-04-11 | Fujitsu Ltd | Probe card |
JPS62149150A (en) * | 1985-09-24 | 1987-07-03 | Nec Corp | Accelerated-life testing method of semiconductor device |
JPS62293629A (en) * | 1986-06-12 | 1987-12-21 | Nec Corp | Accelerated life test of semiconductor device |
-
1987
- 1987-07-30 JP JP62190808A patent/JP2526252B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50120779A (en) * | 1974-03-08 | 1975-09-22 | ||
JPS59134845A (en) * | 1983-01-21 | 1984-08-02 | Hitachi Ltd | Probe card |
JPS6059745A (en) * | 1983-09-13 | 1985-04-06 | Nec Corp | Probe substrate for measuring semiconductor integrated circuit |
JPS6113932A (en) * | 1984-06-29 | 1986-01-22 | 松下電器産業株式会社 | Power controller of cleaner |
JPS6170734A (en) * | 1984-09-13 | 1986-04-11 | Fujitsu Ltd | Probe card |
JPS62149150A (en) * | 1985-09-24 | 1987-07-03 | Nec Corp | Accelerated-life testing method of semiconductor device |
JPS62293629A (en) * | 1986-06-12 | 1987-12-21 | Nec Corp | Accelerated life test of semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JP2526252B2 (en) | 1996-08-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3688612D1 (en) | SYSTEM WITH ELECTRON BEAM TESTING PROBE FOR ANALYZING INTEGRATED CIRCUITS. | |
MY119234A (en) | Semiconductor parallel tester | |
DE59007516D1 (en) | TEST DEVICE FOR TESTING ELECTRICAL OR ELECTRONIC TESTS. | |
EP0309956A3 (en) | Method of testing semiconductor elements and apparatus for testing the same | |
MY113351A (en) | Testing fixture and method for circuit traces on a flexible substrate | |
GB8825319D0 (en) | Apparatus for testing input pin leakage current of device under test | |
TW334607B (en) | Method for high speed testing a semiconductor device | |
US20020075030A1 (en) | Method of calibrating a test system for semiconductor components, and test substrate | |
JPS6435926A (en) | Reliability testing system for semiconductor element | |
JPS5666768A (en) | Tool for in-circuit tester | |
EP0228949A3 (en) | Test method and apparatus for cellular array processor chip | |
US6693434B2 (en) | Automated system for estimating ring oscillator reliability and testing AC response and method of operation thereof | |
JPS57201041A (en) | Testing method for semiconductor wafer | |
JPS52122084A (en) | Inspection system for semiconductor substrates | |
JPS57201042A (en) | Testing method for semiconductor wafer | |
JPS6438671A (en) | Apparatus for testing integrated circuit | |
JPS5750444A (en) | Inspection device for semiconductor wafer | |
JPH0438846A (en) | Function test method of semiconductor integrated circuit device | |
JPS56114346A (en) | Semiconductor structure for novel wafer inspecting system | |
JPS57115843A (en) | Testing device for wafer | |
JPS5291646A (en) | Array probe card for testing ic wafer | |
JPH0472645A (en) | Wafer prober | |
JPS59192839U (en) | Wafer measurement equipment | |
JPH03276656A (en) | Semiconductor testing device | |
JPS6473267A (en) | Test data generation system for lsi |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080614 Year of fee payment: 12 |