JPS6435921A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6435921A
JPS6435921A JP19008587A JP19008587A JPS6435921A JP S6435921 A JPS6435921 A JP S6435921A JP 19008587 A JP19008587 A JP 19008587A JP 19008587 A JP19008587 A JP 19008587A JP S6435921 A JPS6435921 A JP S6435921A
Authority
JP
Japan
Prior art keywords
leading
resin sealing
sealing part
semiconductor device
mounting base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19008587A
Other languages
Japanese (ja)
Inventor
Kaoru Sonobe
Taku Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP19008587A priority Critical patent/JPS6435921A/en
Publication of JPS6435921A publication Critical patent/JPS6435921A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To enable a semiconductor device with excellent moisture resistance to be manufactured simultaneously performing the diebonding and the wirebonding processes with high precision by a method wherein an element is diebonded and wirebonded with an element mounting base and the first leading part formed on a metallic sheet and after sealing the element with the first resin sealing part, the second leading part and the second resin sealing part are formed. CONSTITUTION:An element mounting base 2 and the first leading part 3 are formed on a metallic sheet (lead frame) 1 while a semiconductor element 5 is diebonded onto the element mounting base 2 and wirebonded to the first leading part 3 to be sealed with the first resin sealing part 7A and the second leading parts 8 (outer lead) 9 (tie bar) are formed. Next, the second resin sealing part 7 is formed to cover the first resin sealing part 7A and a part of the second leading parts 8, 9. Through these procedures, any defects such as lead deformation, bonding wire 6 deformation etc., during the munufacturing processes of leadframe 1 and the semiconductor device can be prevented from occurring while improving the moisture resistance in a suspended lead 4 breakdown part.
JP19008587A 1987-07-31 1987-07-31 Manufacture of semiconductor device Pending JPS6435921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19008587A JPS6435921A (en) 1987-07-31 1987-07-31 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19008587A JPS6435921A (en) 1987-07-31 1987-07-31 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6435921A true JPS6435921A (en) 1989-02-07

Family

ID=16252117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19008587A Pending JPS6435921A (en) 1987-07-31 1987-07-31 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6435921A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205349A (en) * 1989-02-03 1990-08-15 Fujitsu Miyagi Electron:Kk Manufacture of semiconductor device
JPH02281750A (en) * 1989-04-24 1990-11-19 Mitsui High Tec Inc Manufacture of lead frame

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205349A (en) * 1989-02-03 1990-08-15 Fujitsu Miyagi Electron:Kk Manufacture of semiconductor device
JPH02281750A (en) * 1989-04-24 1990-11-19 Mitsui High Tec Inc Manufacture of lead frame

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