JPS6435921A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS6435921A JPS6435921A JP19008587A JP19008587A JPS6435921A JP S6435921 A JPS6435921 A JP S6435921A JP 19008587 A JP19008587 A JP 19008587A JP 19008587 A JP19008587 A JP 19008587A JP S6435921 A JPS6435921 A JP S6435921A
- Authority
- JP
- Japan
- Prior art keywords
- leading
- resin sealing
- sealing part
- semiconductor device
- mounting base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE:To enable a semiconductor device with excellent moisture resistance to be manufactured simultaneously performing the diebonding and the wirebonding processes with high precision by a method wherein an element is diebonded and wirebonded with an element mounting base and the first leading part formed on a metallic sheet and after sealing the element with the first resin sealing part, the second leading part and the second resin sealing part are formed. CONSTITUTION:An element mounting base 2 and the first leading part 3 are formed on a metallic sheet (lead frame) 1 while a semiconductor element 5 is diebonded onto the element mounting base 2 and wirebonded to the first leading part 3 to be sealed with the first resin sealing part 7A and the second leading parts 8 (outer lead) 9 (tie bar) are formed. Next, the second resin sealing part 7 is formed to cover the first resin sealing part 7A and a part of the second leading parts 8, 9. Through these procedures, any defects such as lead deformation, bonding wire 6 deformation etc., during the munufacturing processes of leadframe 1 and the semiconductor device can be prevented from occurring while improving the moisture resistance in a suspended lead 4 breakdown part.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19008587A JPS6435921A (en) | 1987-07-31 | 1987-07-31 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19008587A JPS6435921A (en) | 1987-07-31 | 1987-07-31 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6435921A true JPS6435921A (en) | 1989-02-07 |
Family
ID=16252117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19008587A Pending JPS6435921A (en) | 1987-07-31 | 1987-07-31 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6435921A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02205349A (en) * | 1989-02-03 | 1990-08-15 | Fujitsu Miyagi Electron:Kk | Manufacture of semiconductor device |
JPH02281750A (en) * | 1989-04-24 | 1990-11-19 | Mitsui High Tec Inc | Manufacture of lead frame |
-
1987
- 1987-07-31 JP JP19008587A patent/JPS6435921A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02205349A (en) * | 1989-02-03 | 1990-08-15 | Fujitsu Miyagi Electron:Kk | Manufacture of semiconductor device |
JPH02281750A (en) * | 1989-04-24 | 1990-11-19 | Mitsui High Tec Inc | Manufacture of lead frame |
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