JPS6433990A - High thermal conductivity wiring board - Google Patents

High thermal conductivity wiring board

Info

Publication number
JPS6433990A
JPS6433990A JP18913887A JP18913887A JPS6433990A JP S6433990 A JPS6433990 A JP S6433990A JP 18913887 A JP18913887 A JP 18913887A JP 18913887 A JP18913887 A JP 18913887A JP S6433990 A JPS6433990 A JP S6433990A
Authority
JP
Japan
Prior art keywords
layer
metal
wiring board
foil
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18913887A
Other languages
Japanese (ja)
Inventor
Koichi Tsuyama
Masashi Isono
Toshiro Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP18913887A priority Critical patent/JPS6433990A/en
Publication of JPS6433990A publication Critical patent/JPS6433990A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PURPOSE:To facilitate processing, and improve productivity, by constituting a wiring board of a plurality of inner-layer-metal-foil layers for heat conduction, insulating layers and conductor circuit layers, and providing through holes for heat conduction which penetrate the inner-layer-metal-foil layers for heat conduction. CONSTITUTION:The title wiring board is constituted of a plurality of inner-layer- metal-foil layers 1, insulating layer 2, and conductor circuit layers 31, 32. Through holes 5 for heat conduction are arranged, which penetrate the inner- layer-metal-foil layer 1. The inner-layer-metal-foil 1 is made of any one of copper, nickel, iron, aluminum and alloy of them. Concerning thermal conductivity and workability, the total thickness of the inner-layer-metal-foils 1 is preferably set as 25-80% of thickness of the wiring board. Since the insulating layer 2 requires thermal conductivity, the following materials are suitable; resin impregnated glass cloth or resin film containing thermal conductive filler such as alumina, aluminum nitride, silica, magnesia, titania, silicon carbide, and boron nitride. As for resin, from a view-point of electric characteristics, epoxy resin or polyimide resin is suitable.
JP18913887A 1987-07-29 1987-07-29 High thermal conductivity wiring board Pending JPS6433990A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18913887A JPS6433990A (en) 1987-07-29 1987-07-29 High thermal conductivity wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18913887A JPS6433990A (en) 1987-07-29 1987-07-29 High thermal conductivity wiring board

Publications (1)

Publication Number Publication Date
JPS6433990A true JPS6433990A (en) 1989-02-03

Family

ID=16236046

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18913887A Pending JPS6433990A (en) 1987-07-29 1987-07-29 High thermal conductivity wiring board

Country Status (1)

Country Link
JP (1) JPS6433990A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278894A (en) * 1989-04-20 1990-11-15 Satosen Co Ltd Printed circuit board
EP0450968A2 (en) * 1990-04-06 1991-10-09 De Beers Industrial Diamond Division (Proprietary) Limited Circuit boards
JPH0436625A (en) * 1990-05-31 1992-02-06 John Fluke Mfg Co Inc Isothermal terminal block
JPH1098287A (en) * 1996-09-19 1998-04-14 Toshiba Corp Cooler for circuit board module and portable electronic equipment having the cooler
JP2009177016A (en) * 2008-01-25 2009-08-06 Tdk Corp Aggregate substrate, manufacturing method of aggregate substrate, and varistor

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278894A (en) * 1989-04-20 1990-11-15 Satosen Co Ltd Printed circuit board
EP0450968A2 (en) * 1990-04-06 1991-10-09 De Beers Industrial Diamond Division (Proprietary) Limited Circuit boards
JPH0436625A (en) * 1990-05-31 1992-02-06 John Fluke Mfg Co Inc Isothermal terminal block
JPH1098287A (en) * 1996-09-19 1998-04-14 Toshiba Corp Cooler for circuit board module and portable electronic equipment having the cooler
JP2009177016A (en) * 2008-01-25 2009-08-06 Tdk Corp Aggregate substrate, manufacturing method of aggregate substrate, and varistor
KR101022981B1 (en) * 2008-01-25 2011-03-18 티디케이가부시기가이샤 Aggregate substrate, manufacturing method of aggregate substrate, and varistor
US8125307B2 (en) 2008-01-25 2012-02-28 Tdk Corporation Aggregate substrate, production method of aggregate substrate, and varistor
TWI385678B (en) * 2008-01-25 2013-02-11 Tdk Corp A manufacturing method of a collective substrate, a collective substrate, and a varistor

Similar Documents

Publication Publication Date Title
US4591659A (en) Multilayer printed circuit board structure
US4812792A (en) High-frequency multilayer printed circuit board
US3783347A (en) Heat-extracting housing for semiconductor
CA2098330A1 (en) Electrical Device Cooling System Using a Heat Sink Attached to a Circuit Board Containing Heat Conductive Layers and Channels
JPS6433990A (en) High thermal conductivity wiring board
FI872004A0 (en) SYSTEM FOER LOESTAGBAR MONTERING AV HALVLEDARE PAO ETT LEDARUNDERLAG.
EP0279601A3 (en) Electrical conductor arrangement
HK103693A (en) Integrated circuit with an electroconductive flat element
JPH06252534A (en) Printed wiring board with sealing and its manufacture
JPS58165348A (en) Wiring board of semiconductor device
JPS648696A (en) Manufacture of circuit board
JPS6432655A (en) Substrate for loading semiconductor element
JPH01194384A (en) Manufacture of copper-clad laminated plate
JPS6436440A (en) Clad material for electronic components
EP0366338A3 (en) A substrate for an electrical circuit system and a circuit system using that substrate
JPS60236278A (en) Plate for circuit
JPH02210851A (en) Semiconductor chip carrier
JPH0828559B2 (en) Printed wiring board
JPS63299195A (en) Manufacture of superconducting printed substrate
JPS60236280A (en) Plate for circuit
KR870001893Y1 (en) A heating element
JPH0655477B2 (en) Method for manufacturing ceramic coat laminate
JP2764992B2 (en) Cutting method of multilayer plastic chip carrier
JPS648699A (en) Manufacture of circuit board
JPH036086A (en) Metal-based printed wiring board