JPS6428935A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS6428935A
JPS6428935A JP18517987A JP18517987A JPS6428935A JP S6428935 A JPS6428935 A JP S6428935A JP 18517987 A JP18517987 A JP 18517987A JP 18517987 A JP18517987 A JP 18517987A JP S6428935 A JPS6428935 A JP S6428935A
Authority
JP
Japan
Prior art keywords
film
substrate
side wall
si3n4
device region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18517987A
Other languages
Japanese (ja)
Inventor
Toshiyuki Nishihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP18517987A priority Critical patent/JPS6428935A/en
Publication of JPS6428935A publication Critical patent/JPS6428935A/en
Pending legal-status Critical Current

Links

Landscapes

  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)

Abstract

PURPOSE:To restrain oxygen which is apt to take place during an oxidation process from penetrating into a device region, by a method wherein a region excluding the device region of an oxide film is removed and an exposed part of the oxide film is covered with a semiconductor layer formed by a selective oxidation operation of a semiconductor film. CONSTITUTION:A region excluding a device region of a pad SiO2 film 2 and an Si3N4 film 3 formed on a substrate 1 is removed; the substrate 1 is exposed; a poly-Si film 5 is formed on the Si3N4 film 3 and the substrate 1. The poly-Si film 5 is oxidized selectively; a side wall 7 is formed on a side wall part of the Si3N4 film 3 and the pad SiO2 film 2; after that, a device isolation oxide film 8 is formed by selective oxidation of the substrate 1 and the side wall 7 by making use of the Si3N4 film 3 as a mask. By this setup, because an exposed part 9 of the pad SiO2 can be protected easily by the side wall 7 composed of the poly-Si film, a stress at this part is reduced; it is possible to restrain oxygen from penetrating into a device region, which is apt to take place especially during an oxidation process; it is possible to make a bird's beak small.
JP18517987A 1987-07-24 1987-07-24 Manufacture of semiconductor device Pending JPS6428935A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18517987A JPS6428935A (en) 1987-07-24 1987-07-24 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18517987A JPS6428935A (en) 1987-07-24 1987-07-24 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS6428935A true JPS6428935A (en) 1989-01-31

Family

ID=16166222

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18517987A Pending JPS6428935A (en) 1987-07-24 1987-07-24 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS6428935A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4983537A (en) * 1986-12-29 1991-01-08 General Electric Company Method of making a buried oxide field isolation structure
JP2006149538A (en) * 2004-11-26 2006-06-15 Matsushita Electric Ind Co Ltd Air cleaner of air conditioner
CN112122108A (en) * 2020-08-28 2020-12-25 丰泽区创智工业设计服务部 High-efficient screening plant

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4983537A (en) * 1986-12-29 1991-01-08 General Electric Company Method of making a buried oxide field isolation structure
JP2006149538A (en) * 2004-11-26 2006-06-15 Matsushita Electric Ind Co Ltd Air cleaner of air conditioner
CN112122108A (en) * 2020-08-28 2020-12-25 丰泽区创智工业设计服务部 High-efficient screening plant

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