JPS6427773A - Substrate heating device - Google Patents
Substrate heating deviceInfo
- Publication number
- JPS6427773A JPS6427773A JP18297687A JP18297687A JPS6427773A JP S6427773 A JPS6427773 A JP S6427773A JP 18297687 A JP18297687 A JP 18297687A JP 18297687 A JP18297687 A JP 18297687A JP S6427773 A JPS6427773 A JP S6427773A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- mask
- hole
- heat
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To prevent the generation of a defective soldering and the damage of a part by arranging the mask partially equipping the shielding material of a radiation heat between a heat source and the substrate on a supporting device. CONSTITUTION:A conveyor belt 13 as the supporting device of a substrate 12 is provided inside a heating device main body 11 and the pallet 16 mounting the substrate 12 thereon is arranged. The pallet 16 is composed of the two sheets of the base plate 17 at the lower part and the porous plate like mask 18 at the upper part. The mask 18 has large and small holes 19 and forms a large hole 19 corresponding to the large heat capacity place of the substrate 12 and no hole or small hole 19 for a small heat capacity place respectively. The temp. distribution of the substrate 12 passing through the lower part of heat sources 14, 15 is therefore controlled with high accuracy. Consequently the damage of a part caused by the detective soldering and overheating is surely prevented.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18297687A JPS6427773A (en) | 1987-07-22 | 1987-07-22 | Substrate heating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18297687A JPS6427773A (en) | 1987-07-22 | 1987-07-22 | Substrate heating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6427773A true JPS6427773A (en) | 1989-01-30 |
Family
ID=16127595
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18297687A Pending JPS6427773A (en) | 1987-07-22 | 1987-07-22 | Substrate heating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6427773A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0254992A (en) * | 1988-08-19 | 1990-02-23 | Canon Inc | Temperature control in soldering electronic parts to printed-circuit board |
US5234484A (en) * | 1992-02-24 | 1993-08-10 | Itt Corporation | Method for annealing phosphors applied to surfaces having melting points below the annealing temperature of the phosphor |
JPH06179074A (en) * | 1992-12-11 | 1994-06-28 | Nippondenso Co Ltd | Heating furnace for brazing |
JP2009290152A (en) * | 2008-06-02 | 2009-12-10 | Honda Motor Co Ltd | Infrared reflow temperature controller |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339238B2 (en) * | 1972-09-11 | 1978-10-20 |
-
1987
- 1987-07-22 JP JP18297687A patent/JPS6427773A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5339238B2 (en) * | 1972-09-11 | 1978-10-20 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0254992A (en) * | 1988-08-19 | 1990-02-23 | Canon Inc | Temperature control in soldering electronic parts to printed-circuit board |
US5234484A (en) * | 1992-02-24 | 1993-08-10 | Itt Corporation | Method for annealing phosphors applied to surfaces having melting points below the annealing temperature of the phosphor |
JPH06179074A (en) * | 1992-12-11 | 1994-06-28 | Nippondenso Co Ltd | Heating furnace for brazing |
JP2009290152A (en) * | 2008-06-02 | 2009-12-10 | Honda Motor Co Ltd | Infrared reflow temperature controller |
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