JPS6422033U - - Google Patents

Info

Publication number
JPS6422033U
JPS6422033U JP11771087U JP11771087U JPS6422033U JP S6422033 U JPS6422033 U JP S6422033U JP 11771087 U JP11771087 U JP 11771087U JP 11771087 U JP11771087 U JP 11771087U JP S6422033 U JPS6422033 U JP S6422033U
Authority
JP
Japan
Prior art keywords
mold
plate
fixed
plates
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11771087U
Other languages
Japanese (ja)
Other versions
JP2528842Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987117710U priority Critical patent/JP2528842Y2/en
Publication of JPS6422033U publication Critical patent/JPS6422033U/ja
Application granted granted Critical
Publication of JP2528842Y2 publication Critical patent/JP2528842Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る半導体素子の樹脂封止装
置の要部を示す一部切欠縦断正面図、第２図は該
装置の下型側における要部の一部切欠平面図、第
３図は第１図に対応した一部分解縦断正面図、第
４図は弯曲変形防止用部材とエジエクタープレー
トとの嵌合状態を示す平面図である。 符号の説明、１……固定盤、２……金型プレー
ト、３……固定上型（固定型）、３１……上型キ
ヤビテイ、４……可動盤、５……金型プレート、
６……可動下型（可動型）、６１……下型キヤビ
テイ、６２……セツト用溝部（セツト部）、７…
…移送用通路、７１……ランナ、７２……ゲート
、８……リードフレーム、８１……外部リード、
９……製品、１０……上部エジエクタープレート
、１０１……弾性材、１０２……エジエクターピ
ン、１１……下部エジエクタープレート、１１１
……エジエクターバー、１１２……エジエクター
ピン、１１３……エジエクターピン、１２……樹
脂成形体、１２１……上樹脂成形体、１２２……
下樹脂成形体、１３……硬化樹脂、１４……弯曲
変形防止用部材、１５……弯曲変形防止用部材、
１６……固着具、Ｓ１……スペース、Ｓ２……ス
ペース。 FIG. 1 is a partially cutaway longitudinal sectional front view showing the main parts of a resin sealing device for a semiconductor element according to the present invention, FIG. 2 is a partially cutaway plan view of the main parts on the lower mold side of the device, and FIG. 4 is a partially exploded longitudinal sectional front view corresponding to FIG. 1, and FIG. 4 is a plan view showing a fitted state of the curved deformation prevention member and the ejector plate. Explanation of symbols, 1... Fixed plate, 2... Mold plate, 3... Fixed upper mold (fixed type), 3 1 ... Upper mold cavity, 4... Movable plate, 5... Mold plate,
6...Movable lower mold (movable mold), 61 ...Lower mold cavity, 62 ...Setting groove (setting part), 7...
...transfer passage, 7 1 ... runner, 7 2 ... gate, 8 ... lead frame, 8 1 ... external lead,
9...Product, 10...Upper ejector plate, 10 1 ...Elastic material, 10 2 ...Ejector pin, 11...Lower ejector plate, 11 1
 ... Ejector bar, 11 2 ... Ejector pin, 11 3 ... Ejector pin, 12 ... Resin molding, 12 1 ... Upper resin molding, 12 2 ...
Lower resin molded body, 13... Cured resin, 14... Member for preventing curved deformation, 15... Member for preventing curved deformation,
16...Fixing tool, S1 ...Space, S2 ...Space.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 対向配置した固定盤及び可動盤と、該両盤に所
要のスペースを保つて固着した両金型プレートと
、上記両スペース内に嵌装した樹脂成形品突出用
のエジエクタープレートと、上記両金型プレート
に固着して対向配置した固定型及び可動型とを備
えると共に、該両型のパーテイングライン面に半
導体リードフレームのセツト部を設けた半導体素
子の樹脂封止装置において、上記スペース内に金
型プレートの弯曲変形防止用部材を嵌装すると共
に、該弯曲変形防止用部材の嵌装位置を、両型の
パーテイングライン面の上記セツト部にセツトし
たリードフレームにおける少なくとも外部リード
の位置と対応するように設定して構成したことを
特徴とする半導体素子の樹脂封止装置。 A fixed plate and a movable plate arranged opposite each other, both mold plates fixed to the two plates while maintaining the required space, an ejector plate for ejecting the resin molded product fitted into the two spaces, and the two mold plates In a resin encapsulation apparatus for a semiconductor element, which includes a fixed mold and a movable mold that are fixed to a mold plate and arranged opposite to each other, and a set part of a semiconductor lead frame is provided on the parting line surface of both molds, The member for preventing curved deformation of the mold plate is fitted, and the fitting position of the member for preventing curved deformation is set at the position of at least the external lead in the lead frame set in the set portion of the parting line surface of both molds. A resin sealing device for a semiconductor element, characterized in that it is configured and configured to correspond to the above.
JP1987117710U 1987-07-30 1987-07-30 Resin sealing device for semiconductor element Expired - Lifetime JP2528842Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987117710U JP2528842Y2 (en) 1987-07-30 1987-07-30 Resin sealing device for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987117710U JP2528842Y2 (en) 1987-07-30 1987-07-30 Resin sealing device for semiconductor element

Publications (2)

Publication Number Publication Date
JPS6422033U true JPS6422033U (en) 1989-02-03
JP2528842Y2 JP2528842Y2 (en) 1997-03-12

Family

ID=31361405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987117710U Expired - Lifetime JP2528842Y2 (en) 1987-07-30 1987-07-30 Resin sealing device for semiconductor element

Country Status (1)

Country Link
JP (1) JP2528842Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125121U (en) * 1984-07-19 1986-02-14 株式会社東芝 Mold forming equipment
JPS6256111U (en) * 1985-09-27 1987-04-07
JPS6279632A (en) * 1985-10-03 1987-04-13 Mitsubishi Electric Corp Resin sealing device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125121U (en) * 1984-07-19 1986-02-14 株式会社東芝 Mold forming equipment
JPS6256111U (en) * 1985-09-27 1987-04-07
JPS6279632A (en) * 1985-10-03 1987-04-13 Mitsubishi Electric Corp Resin sealing device

Also Published As

Publication number Publication date
JP2528842Y2 (en) 1997-03-12

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