JPH0313737U - - Google Patents
Info
- Publication number
- JPH0313737U JPH0313737U JP7540189U JP7540189U JPH0313737U JP H0313737 U JPH0313737 U JP H0313737U JP 7540189 U JP7540189 U JP 7540189U JP 7540189 U JP7540189 U JP 7540189U JP H0313737 U JPH0313737 U JP H0313737U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- runner
- cavity
- lead frame
- molding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000000465 moulding Methods 0.000 claims description 3
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示す要部側断面図、
第２図は第１図装置の要部斜視断面図、第３図は
第１図の要部拡大側断面図、第４図は本考案の動
作を説明する要部側断面図、第５図は本考案装置
による成型品を示す要部斜視図、第６図は樹脂モ
ールド装置の一例を示す側断面図、第７図は第６
図装置による成形品の側面図、第８図は不要な樹
脂が残留した状態を示す成形品の側面図である。
１……下金型、２……上金型、１ａ……ランナ
、１ｂ，２ａ……キヤビテイ、１ｃ……ゲート、
３……リードフレーム、６……可動ピン、７……
樹脂。
FIG. 1 is a side sectional view of the main part showing an embodiment of the present invention;
Fig. 2 is a perspective sectional view of the main part of the device shown in Fig. 1, Fig. 3 is an enlarged side sectional view of the main part of Fig. 1, Fig. 4 is a side sectional view of the main part explaining the operation of the present invention, and Fig. 5. 6 is a side sectional view showing an example of the resin molding device, and FIG.
FIG. 8 is a side view of the molded product showing a state in which unnecessary resin remains. 1...Lower mold, 2...Upper mold, 1a...Runner, 1b, 2a...Cavity, 1c...Gate,
3... Lead frame, 6... Movable pin, 7...
resin.
Claims (1)
及びゲートを介してランナと連通したキヤビテイ
を設け、キヤビテイ部で上下金型によつてリード
フレームを挟持し、ランナにガイドされた樹脂を
キヤビテイに注入してリードフレーム上の要部を
樹脂被覆する樹脂モールド装置において、 上記金型のゲート部を含む領域を金型衝合面に
対して垂直方向に可動にしたことを特徴とする樹
脂モールド装置。[Scope of Claim for Utility Model Registration] A runner that guides the resin and a cavity that communicates with the runner through a gate are provided on the abutting surfaces of the upper and lower molds, and a lead frame is held between the upper and lower molds in the cavity part, In a resin molding device that injects resin guided by a runner into a cavity to coat important parts on a lead frame with resin, the area including the gate part of the mold is movable in a direction perpendicular to the mold abutment surface. A resin molding device characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7540189U JPH0313737U (en) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7540189U JPH0313737U (en) | 1989-06-27 | 1989-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313737U true JPH0313737U (en) | 1991-02-12 |
Family
ID=31615949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7540189U Pending JPH0313737U (en) | 1989-06-27 | 1989-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313737U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037756U (en) * | 1973-08-06 | 1975-04-19 |
-
1989
- 1989-06-27 JP JP7540189U patent/JPH0313737U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037756U (en) * | 1973-08-06 | 1975-04-19 |