JPS6420963U - - Google Patents
Info
- Publication number
- JPS6420963U JPS6420963U JP11715387U JP11715387U JPS6420963U JP S6420963 U JPS6420963 U JP S6420963U JP 11715387 U JP11715387 U JP 11715387U JP 11715387 U JP11715387 U JP 11715387U JP S6420963 U JPS6420963 U JP S6420963U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- soldering
- hole
- soldering part
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係る半田付け装置
の断面図、第２図は第１図の半田付け装置に用い
られる燃遮蔽用テンプレートの平面図である。
１：回路基板、２：電子部品、３：発熱源、４
：熱遮蔽用テンプレート、７：電子部品と回路基
板の接続部、９，１０：孔。
FIG. 1 is a sectional view of a soldering device according to an embodiment of the present invention, and FIG. 2 is a plan view of a flame shielding template used in the soldering device of FIG. 1. 1: Circuit board, 2: Electronic component, 3: Heat source, 4
: Template for heat shielding, 7: Connection part between electronic components and circuit board, 9, 10: Hole.
Claims (1)
路基板の表面側に対向配置した発熱源から赤外線
等の熱線を照射して電子部品を半田付けする半田
付け装置において、 上記回路基板と電子部品の半田付け部に対応す
る部位に半田付け部に対応した形状の孔を設け該
孔により半田付け部のみを開放して上記電子部品
を覆う熱遮蔽用テンプレートを上記回路基板と発
熱源との間に設けたことを特徴とする半田付け装
置。[Claims for Utility Model Registration] Soldering in which electronic components are soldered to a circuit board on which electronic components are mounted by irradiating heat rays such as infrared rays from a heat source placed opposite to the front surface of the circuit board. In the apparatus, a hole having a shape corresponding to the soldering part is provided at a portion corresponding to the soldering part of the circuit board and the electronic component, and a heat shielding template is provided to cover the electronic component by opening only the soldering part through the hole. A soldering device characterized in that it is provided between the circuit board and a heat source.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11715387U JPS6420963U (en) | 1987-07-30 | 1987-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11715387U JPS6420963U (en) | 1987-07-30 | 1987-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420963U true JPS6420963U (en) | 1989-02-01 |
Family
ID=31360345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11715387U Pending JPS6420963U (en) | 1987-07-30 | 1987-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420963U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07503407A (en) * | 1992-05-18 | 1995-04-13 | ミンテック コーポレーション | Hollow fiber filter cartridge and manufacturing method |
-
1987
- 1987-07-30 JP JP11715387U patent/JPS6420963U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07503407A (en) * | 1992-05-18 | 1995-04-13 | ミンテック コーポレーション | Hollow fiber filter cartridge and manufacturing method |